H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/08/2002	US20020106616 System for providing training in semiconductor manufacturing system operation techniques
08/08/2002	US20020106603 Mechanical clamper for heated substrates at die attach
08/08/2002	US20020106602 Cooling system for reducing particles pollution
08/08/2002	US20020106587 Two mask via pattern to improve pattern definition
08/08/2002	US20020106586 Method for manufacturing a polysilicon type thin film transistor
08/08/2002	US20020106580 A resin capable of increased solubility in alkali by interacting with an acid, an iradiation acid generator compound, a compound with at least two vinyl ether groups, and an organic amine
08/08/2002	US20020106579 Adjust the height and center of a liquid dispenser nozzle with respect to the wafer chuck
08/08/2002	US20020106578 Cyclopentanone solvent, polymethylglutarimide and a light absorption dye applied onto a body, heat treated, and covered with a photoresist
08/08/2002	US20020106567 Phase-shifting mask and method of forming pattern using the same
08/08/2002	US20020106536 Dielectric layer for semiconductor device and method of manufacturing the same
08/08/2002	US20020106518 Fluororesin-coated quartz glass jig and method for producing the same
08/08/2002	US20020106515 Novel high temperature underfilling material with low exotherm during use
08/08/2002	US20020106500 Plasma curing process for porous low-k materials
08/08/2002	US20020106460 Low dielectric constant fluorocarbonated silicon films for integrated circuits and method of preparation
08/08/2002	US20020106459 Method of depositing a thick dielectric film
08/08/2002	US20020106447 Preparing binder-free suspension of electrode material particles in a volatile suspending agent; depositing the binder-free particle suspension on a substrate covered with a conducting film, removing the suspending agent; compressing
08/08/2002	US20020106445 Chemical liquid coating device and chemical liquid coating method
08/08/2002	US20020106269 Substrate processing apparatus
08/08/2002	US20020106268 Substrate treatment system, substrate transfer system, and substrate transfer method
08/08/2002	US20020106267 Container and loader for substrate
08/08/2002	US20020106266 System for preventing improper insertion of FOUP door into FOUP
08/08/2002	US20020106154 Apparatus for and method of jointing probes
08/08/2002	US20020106050 X-ray exposure apparatus
08/08/2002	US20020105985 Semiconductor laser manufacturing method and semiconductor laser
08/08/2002	US20020105849 Semiconductor memory device with improved data propagation characteristics of a data bus
08/08/2002	US20020105827 Three-layered stacked magnetic spin polarisation device with memory, using such a device
08/08/2002	US20020105826 SRAM device
08/08/2002	US20020105823 Magnetic spin polarisation and magnetisation rotation device with memory and writing process, using such a device
08/08/2002	US20020105636 Defect inspection apparatus and defect inspection method
08/08/2002	US20020105628 Exposure method and apparatus using near field light
08/08/2002	US20020105627 Fabrication method for correcting member, fabrication method for projection optical system, and exposure apparatus
08/08/2002	US20020105590 Image pickup apparatus
08/08/2002	US20020105577 Device and method for nondestructive inspection on semiconductor device
08/08/2002	US20020105510 Power supply circuit, operational amplifier circuit, liquid crystal device and electronic instrument
08/08/2002	US20020105452 Apparatus and method for precision trimming of a semiconductor device
08/08/2002	US20020105368 Semiconductor device
08/08/2002	US20020105367 Phase adjustor for semiconductor integrated circuit device
08/08/2002	US20020105354 Semiconductor integrated circuit testing system and method
08/08/2002	US20020105352 Apparatus and method for testing semiconductor integrated circuit
08/08/2002	US20020105347 Contactor for testing semiconductor device and manufacturing method thereof
08/08/2002	US20020105318 High voltage detector
08/08/2002	US20020105277 Ion implanter
08/08/2002	US20020105275 Lamp having a high-reflectance film for improving directivity of light and heat treatment apparatus having such a lamp
08/08/2002	US20020105263 Liquid crystal display and method for manufacturing the same
08/08/2002	US20020105236 System for safeguarding integrated intrabay pod delivery and storage system
08/08/2002	US20020105130 Workpiece holding device for a bonding apparatus
08/08/2002	US20020105098 Semiconductor device and manufacturing method of the same
08/08/2002	US20020105094 Semiconductor device and method for producing the same, and method for mounting semiconductor device
08/08/2002	US20020105093 Encapsulant composition and electronic package utilizing same
08/08/2002	US20020105092 Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly
08/08/2002	US20020105090 Wiring forming method for semiconductor device and semiconductor device
08/08/2002	US20020105089 Semiconductor device and manufacturing method thereof
08/08/2002	US20020105088 Semiconductor device having multilayer interconnection structure and manfacturing method thereof
08/08/2002	US20020105087 High performance silicon contact for flip chip
08/08/2002	US20020105086 Semiconductor device and method for manufacturing the same
08/08/2002	US20020105085 Semiconductor device and process for producing the same
08/08/2002	US20020105084 Low dielectric constant material for integrated circuit fabrication
08/08/2002	US20020105083 Multi-layer interconnect module and method of interconnection
08/08/2002	US20020105082 Method for forming interconnects on semiconductor substrates and structures formed
08/08/2002	US20020105081 Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization
08/08/2002	US20020105080 Method of forming an electronic device
08/08/2002	US20020105079 Semiconductor device
08/08/2002	US20020105078 Semiconductor device, a method for making the same, and an LCD monitor comprising the same
08/08/2002	US20020105077 Semiconductor package having changed substrate design using special wire bonding
08/08/2002	US20020105076 Reliable metal bumps on top of i/o pads with test probe marks
08/08/2002	US20020105075 Semiconductor module and method for fabricating the semiconductor module
08/08/2002	US20020105074 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
08/08/2002	US20020105073 Low cost and compliant microelectronic packages for high i/o and fine pitch
08/08/2002	US20020105072 Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body
08/08/2002	US20020105069 Semiconductor device including stud bumps as external connection terminals
08/08/2002	US20020105066 Semiconductor device with lightly doped drain layer
08/08/2002	US20020105064 Grounding of package substrates
08/08/2002	US20020105062 Interface device and interface system
08/08/2002	US20020105059 Alpha particle shield for integrated circuit
08/08/2002	US20020105057 Wafer surface that facilitates particle removal
08/08/2002	US20020105056 Arrangement of stacked, spherically-shaped semiconductors
08/08/2002	US20020105055 Method for making high voltage device
08/08/2002	US20020105054 High voltage transistor using P+ buried layer
08/08/2002	US20020105053 Integrated circuit with bipolar transistors having different emitter base junction widths
08/08/2002	US20020105051 Structures and methods of anti-fuse formation in SOI
08/08/2002	US20020105050 One time programmable semiconductor nonvolatile memory device and method for production of same
08/08/2002	US20020105049 Integrated circuit having tap cells and a method for positioning tap cells in an integrated circuit
08/08/2002	US20020105048 Dielectric element including oxide dielectric film and method of manufacturing the same
08/08/2002	US20020105047 Semiconductor memory device and its method of manufacture
08/08/2002	US20020105046 Integrated semiconductor circuit device, process of manufacturing the same, IC module and IC card
08/08/2002	US20020105043 Antireflective coating layer
08/08/2002	US20020105041 Integrated circuit device with switching between active mode and standby mode controlled by digital circuit
08/08/2002	US20020105040 Semiconductor device having semiconductor circuit formed by semiconductor elements and method for manufacturing the same
08/08/2002	US20020105039 Damascene double-gate mosfet structure and its fabrication method
08/08/2002	US20020105037 Semiconductor memory capable of being driven at low voltage and its manufacture method
08/08/2002	US20020105035 Self-aligned, magnetoresitive random-access memory (MRAM) structure utilizing a spacer containment scheme
08/08/2002	US20020105034 Semiconductor device having dynamic threshold transistors and element isolation region and fabrication method thereof
08/08/2002	US20020105033 Thin film transistor having lightly and heavily doped source/drain regions and its manufacture
08/08/2002	US20020105032 SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
08/08/2002	US20020105031 Semiconductor device and method of manufacturing the same
08/08/2002	US20020105030 Thin film transistor array substrate for liquid crystal display and method for fabricating same
08/08/2002	US20020105029 Poly-silicon thin film transistor and method for fabricating thereof
08/08/2002	US20020105023 Nov-volatile semiconductor memory cell utilizing poly-edge discharge
08/08/2002	US20020105020 Non-volatile memory device and method of manufacturing the same
08/08/2002	US20020105019 Structure and method for a compact trench-capacitor DRAM cell with body contact

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