Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/28/2002EP1234009A1 Composition and method for planarizing surfaces
08/28/2002EP1233935A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body
08/28/2002EP1151478B1 Power mos element and method for producing the same
08/28/2002EP1080609B1 Electroluminescent devices
08/28/2002EP1053508B1 A process for making a photoactive compound and photoresist therefrom
08/28/2002EP0938746B1 Process for wet chemical etching or surface cleaning of mixed crystal compounds containing arsenic
08/28/2002EP0929843B1 Light sensitive composition containing an arylhydrazo dye
08/28/2002EP0906174B1 Workpiece inspection and handling
08/28/2002EP0837750B1 Wire bonding, severing, and ball forming
08/28/2002EP0811249B1 Emitter ballast bypass for radio frequency power transistors
08/28/2002CN2508392Y Low stress chip assembly
08/28/2002CN1366732A Voltage limiting bias circuit for reduction of hot electron degradation effects in MOS cascode circuits
08/28/2002CN1366713A Semiconductor device and method of manufacturing same
08/28/2002CN1366712A Information processing structure
08/28/2002CN1366711A Semiconductor device with integrated CMOS circuit with MOS transistors having silicon-germanium (Sil-Gex) gate electrodes, and method for manufacturing same
08/28/2002CN1366710A Method of fabricating power rectifier device to vary operating parameters and resulting device
08/28/2002CN1366709A Method for preparing porous SOG film
08/28/2002CN1366708A Reinforcement material for silicon wafer and method of manufacturing IC chip using reinforcement material
08/28/2002CN1366677A Reference cell for huigh speed sensing in non-volatile memories
08/28/2002CN1366614A Integrated circuit with test interface
08/28/2002CN1366606A Holder mechanism
08/28/2002CN1366549A Polishing compound and method for preparation thereof, and polishing method
08/28/2002CN1366525A Method for preparation of pure citalopram
08/28/2002CN1366509A Water-repellent porous silica, method for preparation thereof and use thereof
08/28/2002CN1366479A Efficient energy transfer capillary
08/28/2002CN1366447A Circuit substrate and its making method and display apparatus
08/28/2002CN1366444A Parts built-in module and its making method
08/28/2002CN1366351A Thin film transistor and its manufacturing method and semiconductor device of said transistor
08/28/2002CN1366350A Semiconductor device and its making method
08/28/2002CN1366349A Semiconductor apparatus and its making method
08/28/2002CN1366348A Semiconductor apparatus and its making method
08/28/2002CN1366347A Semiconductor device and its making method
08/28/2002CN1366346A Point contact planar grid type single-electronic transistor and its preparing process
08/28/2002CN1366345A Point-contact planar grid type single-electron transistor and its preparing process
08/28/2002CN1366342A 半导体存储器 Semiconductor memory
08/28/2002CN1366341A Semiconductor device and its making method
08/28/2002CN1366340A Semiconductor equipment and its manufacturing method
08/28/2002CN1366339A Semiconductor device formed from cascade connected multiple diodes
08/28/2002CN1366336A Method for making SMD electronic elements
08/28/2002CN1366335A Process for preparing transistor with metallic silicide on source and drain
08/28/2002CN1366334A Method of chemical gaseous phase sedimenting tungsten on semiconductor substrate
08/28/2002CN1366333A Substrate treatment equipment and substrate treatment method using said equipment
08/28/2002CN1366332A Process for preparing dual-layer grid of MOS element
08/28/2002CN1366331A Manufacturing method of SOI chip
08/28/2002CN1366206A Liquid crystal display equipment array substrate and its making method
08/28/2002CN1365941A Container of electron device
08/28/2002CN1089992C IC terminal frame processing system
08/28/2002CN1089949C 半导体器件 Semiconductor devices
08/28/2002CN1089948C 电力控制器件 Power control device
08/28/2002CN1089947C Method for producing semiconductor device having capacitor
08/28/2002CN1089946C Sheet removing apparatus and method
08/28/2002CN1089808C Method and composition for testing ion in liquid
08/28/2002CN1089790C Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
08/28/2002CN1089652C Intermediate material for producing dual gauge strip and method for producing same and method for producing dual guage strip
08/28/2002CN1089616C On-site generation of ultra-high-purity hydrogen peroxide for semiconductor processing
08/27/2002US6442744 Method and apparatus for improving auto-placement in semiconductor integrated circuit design
08/27/2002US6442742 Cache memory having a DRAM memory cell
08/27/2002US6442740 Clock signal analysis device and clock signal analysis method
08/27/2002US6442736 Semiconductor processing system and method for controlling moisture level therein
08/27/2002US6442735 SOI circuit design method
08/27/2002US6442731 Interactive method of optimum LSI layout including considering LSI chip size, test element groups, and alignment marks
08/27/2002US6442500 Devices for controlling temperature indications in integrated circuits using adjustable threshold temperatures
08/27/2002US6442496 Method and apparatus for dynamic sampling of a production line
08/27/2002US6442445 User configurable multivariate time series reduction tool control method
08/27/2002US6442184 Nitride-based semiconductor light emitting device and manufacturing method therefor
08/27/2002US6442087 Semiconductor memory device with reduced interference between bit lines
08/27/2002US6442082 Voltage-level shifter and semiconductor memory using the same
08/27/2002US6442079 Voltage regulator circuit for a semiconductor memory device
08/27/2002US6442078 Semiconductor memory device having structure implementing high data transfer rate
08/27/2002US6442064 Magnetic tunnel junction element and magnetic memory using the same
08/27/2002US6442063 Integrated memory having memory cells with magnetoresistive memory effect
08/27/2002US6442062 Load-less four-transistor memory cell with different gate insulation thicknesses for N-channel drive transistors and P-channel access transistors
08/27/2002US6442059 Nonvolatile ferroelectric memory and method for fabricating the same
08/27/2002US6442043 Chip assembly module of bump connection type using a multi-layer printed circuit substrate
08/27/2002US6442042 Circuit configuration having at least one nanoelectronic component and method for fabricating the component
08/27/2002US6442033 Low-cost 3D flip-chip packaging technology for integrated power electronics modules
08/27/2002US6442009 Semiconductor device having protective and test circuits
08/27/2002US6441975 Device for the low-deformation support of an optical element and method for the low-deformation support of the optical element
08/27/2002US6441899 Apparatus and method for loading substrates of various sizes into substrate holders
08/27/2002US6441886 Illumination optical system and exposure apparatus having the same
08/27/2002US6441885 Low thermal distortion extreme-UV lithography reticle
08/27/2002US6441758 D/A conversion circuit and semiconductor device
08/27/2002US6441715 Method of fabricating a miniaturized integrated circuit inductor and transformer fabrication
08/27/2002US6441702 Method and system for wafer-level tuning of bulk acoustic wave resonators and filters
08/27/2002US6441665 Semiconductor integrated circuit
08/27/2002US6441630 Probing apparatus and head plate opening/closing force-reducing mechanism
08/27/2002US6441629 Probe contact system having planarity adjustment mechanism
08/27/2002US6441620 Method for fault identification in a plasma process
08/27/2002US6441503 Bond wire pressure sensor die package
08/27/2002US6441502 Member for mounting of semiconductor
08/27/2002US6441501 Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep
08/27/2002US6441500 Semiconductor device having resin members provided separately corresponding to externally connecting electrodes
08/27/2002US6441498 Semiconductor substrate and land grid array semiconductor package using same
08/27/2002US6441497 Semiconductor device fabricated on multiple substrates and method for fabricating the same
08/27/2002US6441496 Structure of stacked integrated circuits
08/27/2002US6441495 Semiconductor device of stacked chips
08/27/2002US6441494 Microelectronic contacts
08/27/2002US6441492 Diffusion barriers for copper interconnect systems
08/27/2002US6441491 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device containing the same
08/27/2002US6441490 Low dielectric constant stop layer for integrated circuit interconnects