H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/21/2002	US20020173088 Method of forming a MOS transistor on a semiconductor wafer
11/21/2002	US20020173087 Shallow depth well tubes; adjusting threshold voltage
11/21/2002	US20020173086 Silicon substrate; dielectric interface; metal silicide layer
11/21/2002	US20020173085 Reducing impurities during oxidation
11/21/2002	US20020173084 Recording using light reflected from substrate; accuracy measuring thickness
11/21/2002	US20020173083 Methodology for electrically induced selective breakdown of nanotubes
11/21/2002	US20020173081 Bonding carrier to circuit; wire bonding; applying ultrasonic frequency
11/21/2002	US20020173079 Dual damascene integration scheme using a bilayer interlevel dielectric
11/21/2002	US20020173078 Method and apparatus for manufacturing semiconductor device
11/21/2002	US20020173076 Multilayer laminate; high capacitance; wire bonding pad; sealing
11/21/2002	US20020173075 Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
11/21/2002	US20020173074 Method for underfilling bonding gap between flip-chip and circuit substrate
11/21/2002	US20020173073 Fabricating process for forming multi-layered metal bumps by electroless plating
11/21/2002	US20020173071 Multilayer metal sheets; photosensitive chips; radiation transparent glues
11/21/2002	US20020173070 Semiconductors packages
11/21/2002	US20020173069 Multilayer, semiconductor substrate; polyimide dielectric; adhesive and protective coatings
11/21/2002	US20020173067 Method of forming patterned metalization on patterned semiconductor wafers
11/21/2002	US20020173066 Semiconductor device including gate insulation films having different thicknesses
11/21/2002	US20020173065 Method for forming a compact sensing apparatus in a dual-piece monolithic substrate
11/21/2002	US20020173064 Method for producing a semiconductor device
11/21/2002	US20020173063 Method for monolithic integration of multiple devices on an optoelectronic substrate
11/21/2002	US20020173060 Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate
11/21/2002	US20020173059 Measuring plasma vartiations using aluminum pad contactor
11/21/2002	US20020173057 Semiconductor manufacturing method and semiconductor manufacturing apparatus
11/21/2002	US20020173056 Measuring deformation angle
11/21/2002	US20020173055 For disconnecting (via cutting fuses) a defective memory cell; photoresists; semiconductors
11/21/2002	US20020173054 Materials handling; ruthenium complex is adsorbed on substrate and reductive purge gas is injected into chamber
11/21/2002	US20020172908 Auxiliary heat-insulating jig, method of manufacturing the same, wafer boat provided with plate insulator, vertical heat treatment apparatus, method of modifying vertical heat treatment apparatus and method of fabricating semiconductor device
11/21/2002	US20020172901 Method of exposing a lattice pattern onto a photo-resist film
11/21/2002	US20020172898 Damascene polysilazanes for manufacturing microelectronic devices; etch resistance
11/21/2002	US20020172896 Antireflective coating compositions
11/21/2002	US20020172892 Metallizing method for dielectrics
11/21/2002	US20020172887 Electroluminescence; optics; electronics
11/21/2002	US20020172886 Acid generators; for the production of semiconductor integrated circuits, photoresists
11/21/2002	US20020172885 For increasing sensitivity of photoresist useful for microfabrication of integrated circuits utilizing deep ultraviolet rays (from excimer lasers) and x-rays; resolution; profile
11/21/2002	US20020172876 Method of calibration of a lithographic apparatus, mask for use in calibration of lithographic apparatus, lithographic apparatus, device manufacturing method, device manufactured thereby
11/21/2002	US20020172872 Photomask and method of fabricating semiconductor device by use of same
11/21/2002	US20020172840 Giant magneto-resistive effect element, magneto-resistive effect type head, thin-film magnetic memory and thin-film magnetic sensor
11/21/2002	US20020172820 Lasers
11/21/2002	US20020172811 Laminated diffusion barrier
11/21/2002	US20020172774 Method of n2o annealing an oxide layer on a silicon carbide layer
11/21/2002	US20020172768 Irradiating alternately an organometal compound as a source material and either of oxygen radicals, nitrogen radicals and a mixture of oxygen radicals and nitrogen radicals as an oxidizing or nitriding agent for depositing monoatomic layer
11/21/2002	US20020172764 Universal backplane assembly and methods
11/21/2002	US20020172761 Method for the production of optical components with increased stability, components obtained thereby and their use
11/21/2002	US20020172756 Method for selectively oxidizing a silicon/metal composite film stack
11/21/2002	US20020172652 Composition for film formation and material for insulating film formation
11/21/2002	US20020172589 Vacuum pump
11/21/2002	US20020172585 Device and method for aligning disk-shaped substrates
11/21/2002	US20020172412 Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same
11/21/2002	US20020172089 Dram technology compatible processor/memory chips
11/21/2002	US20020172074 Integrated chip having SRAM, DRAM and Flash memory and method for fabricating the same
11/21/2002	US20020172073 Thin film magnetic memory device capable of conducting stable data read and write operations
11/21/2002	US20020172071 Integrated semiconductor circuit having transistors that are switched with different frequencies
11/21/2002	US20020172070 Semiconductor memory device
11/21/2002	US20020172064 Passivation layer for molecular electronic device fabrication
11/21/2002	US20020172024 Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged
11/21/2002	US20020171994 Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber
11/21/2002	US20020171845 System and method for controlling wafer temperature
11/21/2002	US20020171844 Cyclic error reduction in average interferometric position measurements
11/21/2002	US20020171833 Aligning apparatus and method for aligning mask patterns with regions on a substrate
11/21/2002	US20020171828 Method and system for controlling the photolithography process
11/21/2002	US20020171818 Optical exposure method, device manufacturing method and lithographic projection apparatus
11/21/2002	US20020171817 Lithography device wich uses a source of radiation in the extreme ultraviolet range and multi-layered mirrors with a broad spectral band in this range
11/21/2002	US20020171815 Method for manufacturing exposure apparatus and method for manufacturing micro device
11/21/2002	US20020171602 Method for tuning an antenna resonant circuit of a passive transponder
11/21/2002	US20020171577 Integrated circuit device, electronic equipment, and method of placement of an integrated circuit device
11/21/2002	US20020171471 Regulating circuit for a high voltage generator
11/21/2002	US20020171468 Apparatus for biasing ultra-low voltage logic circuits
11/21/2002	US20020171461 Semiconductor device with multiple power sources
11/21/2002	US20020171449 Test system and manufacturing of semiconductor device
11/21/2002	US20020171414 Method for optimizing probe card analysis and scrub mark analysis data
11/21/2002	US20020171411 Reflection coefficient phase detector
11/21/2002	US20020171328 A method for producing an acceleration sensor
11/21/2002	US20020171173 Mold cleaning sheet and manufacturing method of a semiconductor device using the same
11/21/2002	US20020171157 Electronic device
11/21/2002	US20020171156 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
11/21/2002	US20020171155 Semiconductor device and method for manufacturing the same
11/21/2002	US20020171154 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
11/21/2002	US20020171152 Flip-chip-type semiconductor device and manufacturing method thereof
11/21/2002	US20020171151 Method for forming interconnects on semiconductor substrates and structures formed
11/21/2002	US20020171149 Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer
11/21/2002	US20020171147 Structure of a dual damascene via
11/21/2002	US20020171146 Compound structure for reduced contact resistance
11/21/2002	US20020171145 BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
11/21/2002	US20020171143 Bumped die and wire bonded board-on-chip package
11/21/2002	US20020171142 Integrated circuits, minimizing electromigration failure and degradation of an interconnect structure formed in porous low-K dielectric material.
11/21/2002	US20020171140 Tape carrier package (TCP) on which semiconductor chips are mounted and method of manufacuturing the same
11/21/2002	US20020171138 Multilayer wiring board and semiconductor device
11/21/2002	US20020171133 Systems for testing and packaging integrated circuits
11/21/2002	US20020171132 Reworkable and thermally conductive adhesive and use thereof
11/21/2002	US20020171128 Semiconductor device and method for producing the same
11/21/2002	US20020171125 Organic semiconductor devices with short channels
11/21/2002	US20020171124 Insulators for high density circuits
11/21/2002	US20020171123 System and method for fabricating silicon targets
11/21/2002	US20020171122 System and method for sputtering silicon films using hydrogen gas mixtures
11/21/2002	US20020171120 Semiconductor device
11/21/2002	US20020171119 Semiconductor device with copper fuse section
11/21/2002	US20020171118 Deep slit isolation with controlled void
11/21/2002	US20020171117 Integrated circuit device
11/21/2002	US20020171116 Method for fabricating forward and reverse blocking devices

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