H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/14/2002	US20020166684 Ceramic multilayer circuit boards mounted on a patterned metal support substrate and method of making
11/14/2002	US20020166654 Finned Heat Sink Assemblies
11/14/2002	US20020166633 Device for etching the backside of wafer
11/14/2002	US20020166632 Method and apparatus for shielding a device from a semiconductor wafer process chamber
11/14/2002	US20020166625 Using backgrind wafer tape to enable wafer mounting of bumped wafers
11/14/2002	US20020166590 System and method for using bent pipes in high-purity fluid handling systems
11/14/2002	US20020166581 Silicon-based film, formation method therefor and photovoltaic element
11/14/2002	US20020166575 Solution processing apparatus and solution processing method
11/14/2002	US20020166572 Placing the wafer in a chemical cleaning tank and cleaning the wafer with a chemical cleaning solution; placing the wafer in a cleansing tank that fills with deionized water; adding a neutralizer in the cleansing tank; removing solution
11/14/2002	US20020166571 Semiconductor wafers are dipped in a cleaning solution tank to which a cleaning solution is fed; ultrasonic waves are fed into the aforementioned cleaning solution for removing particles on semiconductor wafers
11/14/2002	US20020166570 Placing wafer having metal layer into first chemical cleaning equipment unit to clean wafer surface with chemical cleaning solution while protecting metal layer by cathodic protection; rinsing chemical cleaning solution; drying
11/14/2002	US20020166569 Disposing wafer in a chamber to restrain other than rotational wafer movement; striking wafer surface with a fluid to generate a force tangential to the wafer surface of sufficient magnitude to rotate the wafer; cleaning the wafer
11/14/2002	US20020166552 Dicing machine with interlock
11/14/2002	US20020166509 Film forming device
11/14/2002	US20020166507 Thin film forming apparatus
11/14/2002	US20020166504 Cleaner for molding apparatus of semiconductor chip packages
11/14/2002	US20020166502 Low defect density (Ga, Al, In) N and HVPE process for making same
11/14/2002	US20020166428 Wafer sawing apparatus
11/14/2002	US20020166256 Process and apparatus for cleaning a silicon surface
11/14/2002	US20020166255 System for sensing position of spin dryer cover
11/14/2002	US20020166232 Method for fine pattern formation
11/14/2002	DE10220359A1 Siliziumkarbidhalbleitervorrichtung und Herstellungsverfahren Silicon carbide semiconductor device and manufacturing method
11/14/2002	DE10218155A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
11/14/2002	DE10215759A1 Reinigungsprozeß für eine Photomaske Cleaning process for a photomask
11/14/2002	DE10214105A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
11/14/2002	DE10206442A1 Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed
11/14/2002	DE10206441A1 Substrate surface used as support for components in microelectronics industry, e.g. thermal sensor, comprises layer containing conducting particles, and support layer acting as the base support for conducting layer
11/14/2002	DE10206440A1 Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components
11/14/2002	DE10206439A1 Method for producing strip conductor structures as a connection between electrical/electrooptical component terminals uses a thread-type conductor line to go between terminals to be linked and to contact them with its ends.
11/14/2002	DE10206438A1 Method for forming and creating strip conductor structures on a substrate prepares a draft circuit for electrostatic charge patterns to generate a strip conductor structure.
11/14/2002	DE10206437A1 Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps
11/14/2002	DE10206435A1 Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties
11/14/2002	DE10206434A1 Process for the selective metallization of partial structures or regions comprises applying a conducting adhesive or producing a conducting path on a substrate, and selectively depositing metal on the conducting adhesive
11/14/2002	DE10206433A1 Device for producing electrical elements e.g. resistors comprises a capillary arrangement in a dispensing arrangement for applying a conducting adhesive
11/14/2002	DE10162213A1 Verfahren des Herstellens von Masken und Verfahren des Auftragsverteilens von Masken Method of making masks and process the order distributing masks
11/14/2002	DE10160088A1 Chipträger und Verfahren zum Testen eines Chips, das den Chipträger verwendet Chip carrier and a method for testing chips using the chip carrier
11/14/2002	DE10152202A1 Production of copper metallization comprises preparing contact region in substrate, opening hole through an insulating layer to contact region, depositing tantalum carbide nitride barrier layer in hole, and depositing layer of copper
11/14/2002	DE10148630A1 Vorrichtung und Verfahren zum Auswählen eines Photomaskenherstellers anhand von Empfangsdaten Apparatus and method for selecting a photomask manufacturer based on the received data
11/14/2002	DE10141839A1 Production of self-adjusting mask comprises covering structures with covering layer, applying further covering layer, removing further covering layer until first covering layer is exposed in first partial surface, removing covering layer
11/14/2002	DE10129846C1 Process for electrically contacting switching elements used in communications networks comprises applying a first layer on a first switching component, forming a hole in the first layer, and further processing
11/14/2002	DE10125370C1 Integrated semiconductor circuit manufacturing method has dielectric or ferroelectric layer for integrated capacitors separately heated before reducing into small particles applied semiconductor circuit substrate
11/14/2002	DE10124735C1 Semiconductor chip testing method has test mode status of initiated test mode read out via proof mode before execution of test mode
11/14/2002	DE10122324A1 Flexible integrierte monolithische Schaltung Flexible integrated monolithic circuit
11/14/2002	DE10121578A1 Verfahren und Bestückungssystem zum Bestücken eines Substrats mit elektronischen Bauteilen Procedures and placement system for placing a substrate with electronic components
11/14/2002	DE10121556A1 Verfahren zum Rückseitenschleifen von Wafern Process for back-surface grinding of wafers
11/14/2002	DE10121549A1 Bauelement auf GaAs und Herstellungsverfahren On GaAs device and manufacturing method
11/14/2002	DE10121495A1 Conductor strip arrangement comprises a first layer made from a first insulating material, a conductor strip arranged on the first layer and made from an electrically conducting material, and a second layer arranged on the exposed surface
11/14/2002	DE10121494A1 Transistor und integrierter Schaltkreis Transistor and integrated circuit
11/14/2002	DE10121181A1 Stencil mask used for high and ultra-high energy implantation of semiconductor wafers has implantation openings in a substrate through which the implantation energy is projected onto a wafer
11/14/2002	DE10121011A1 Doping bit line contact holes comprises simultaneously opening contact holes in the cell field and also further contact holes in peripheral circuits of the chip, and carrying out unmasked n-type doping of all the contact holes
11/14/2002	DE10120520A1 Halbleiterbauelement und Herstellungsverfahren A semiconductor device and manufacturing method
11/14/2002	DE10120257A1 Anschlußträger für ein elektronisches Bauelement und Verfahren zu dessen Herstellung Terminal carrier for an electronic component and method for its production
11/14/2002	DE10120053A1 Stressreduziertes Schichtsystem Reduced stress layer system
11/14/2002	CA2445772A1 A method to produce germanium layers
11/13/2002	EP1257045A2 Stage system with onboard linear motor
11/13/2002	EP1256988A2 Semi-insulating substrate, semiconductor optical device and fabrication method of semiconductor thin film
11/13/2002	EP1256987A2 Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
11/13/2002	EP1256986A2 Single electron memory device and method for manufacturing the same
11/13/2002	EP1256983A2 Flexible integrated monolithic circuit
11/13/2002	EP1256982A1 Electronic Module and its Assembling Process
11/13/2002	EP1256979A1 Passivation layer on a semiconductor device with a ferroelectric layer
11/13/2002	EP1256978A2 Method of forming low dielectric constant insulation film for semiconductor device
11/13/2002	EP1256977A1 Method and apparatus for producing polysilicon film, semiconductor device, and method of manufacture thereof
11/13/2002	EP1256976A2 Method for producing semiconductor device
11/13/2002	EP1256975A2 Vertical type wafer supporting jig
11/13/2002	EP1256974A1 Apparatus for placing a semiconductor chip as a flip chip on a substrate
11/13/2002	EP1256973A1 Heating system and method for heating an atmospheric reactor
11/13/2002	EP1256958A2 Multibit magnetic memory and method of operation thereof
11/13/2002	EP1256844A1 Lithographic apparatus
11/13/2002	EP1256843A1 Method of calibrating a lithographic apparatus
11/13/2002	EP1256836A2 LCD with bus lines overlapped by pixel electrodes and insulating layer therebetween
11/13/2002	EP1256638A2 Thin film including multi components and method of forming the same
11/13/2002	EP1256387A2 Flip chip underfill system and method
11/13/2002	EP1256135A1 Semiconductor component which emits radiation, and method for producing the same
11/13/2002	EP1256133A2 Mos-gated semiconductor device having alternating conductivity type semiconductor regions and method of making the same
11/13/2002	EP1256132A1 Three-dimensional interconnection method and electronic device obtained by same
11/13/2002	EP1256128A1 Encapsulation for an electrical component and method for producing the same
11/13/2002	EP1256127A1 Self-cleaning process for etching silicon-containing material
11/13/2002	EP1256126A1 Etching solution and method
11/13/2002	EP1256125A1 Electron beam modification of cvd deposited films, forming low dielectric constant materials
11/13/2002	EP1256117A1 Method to provide a reduced constant e-field during erase of eeproms for reliability improvement
11/13/2002	EP1256116A2 Flash memory architecture employing three layer metal interconnect
11/13/2002	EP1256075A1 Supporting multiple fpga configuration modes using dedicated on-chip processor
11/13/2002	EP1256033A1 Zoom illumination system for use in photolithography
11/13/2002	EP1256031A2 Apparatus and method of cleaning reticles for use in a lithography tool
11/13/2002	EP1256030A1 Laser thermal processing apparatus and method
11/13/2002	EP1256010A1 Device for detecting a magnetic field, magnetic field measurer and current meter
11/13/2002	EP1256009A1 Lssd interface
11/13/2002	EP1256008A1 Method and apparatus for selectively compacting test responses
11/13/2002	EP1256007A1 Decompressor/prpg for applying pseudo-random and deterministic test patterns
11/13/2002	EP1256006A1 Non-invasive electrical measurement of semiconductor wafers
11/13/2002	EP1255980A1 Portable sensor array system
11/13/2002	EP1255677A2 Method and apparatus of immobilizing solder spheres
11/13/2002	EP1152839B1 Method and device for treating substrates
11/13/2002	EP1144198B1 Thermal transfer element for forming multilayer devices
11/13/2002	EP1137969A4 Method of using a modulated exposure mask
11/13/2002	EP1089799A4 Apparatus and method for recovering photoresist developers and strippers
11/13/2002	EP1055253B1 Device for loading substrates into and unloading them from a clean room
11/13/2002	EP1005626B1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
11/13/2002	EP0914677B1 Stratified structure with a ferroelectric layer and process for producing the same

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