H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/28/2002	US20020175343 Method for fabricating a semiconductor device
11/28/2002	US20020175342 Two-mask trench schottky diode
11/28/2002	US20020175341 Process for production of a nitride semiconductor device and a nitride semiconductor device
11/28/2002	US20020175340 Process for producing gallium nitride crystal substrate, and gallium nitride crystal substrate
11/28/2002	US20020175337 InGaN/A1GaN/GaN Multilayer Buffer for Growth of GaN on Sapphire
11/28/2002	US20020175334 Optical data converter
11/28/2002	US20020175331 Structure and method for mounting a semiconductor element
11/28/2002	US20020175330 Method of forming three-dimensional photonic band structures in solid materials
11/28/2002	US20020175329 Semiconductor apparatus and method of making same
11/28/2002	US20020175328 Semiconductor device and method for manufacturing the same
11/28/2002	US20020175327 Arrangement with a semiconductor component
11/28/2002	US20020175300 Position detection method and apparatus
11/28/2002	US20020175298 Method of manufacturing semiconductor device
11/28/2002	US20020175297 Methods and apparatus for ion implantation with variable spatial frequency scan lines
11/28/2002	US20020175296 Apparatus and method of ion beam processing
11/28/2002	US20020175295 Method for aligning electron beam projection lithography tool
11/28/2002	US20020175202 Method and apparatus for positioning a semiconductor pellet
11/28/2002	US20020175160 Pre-heating and load lock pedestal material for high temperature cvd liquid crystal and flat panel display applications
11/28/2002	US20020175153 Circuit and method for heating an adhesive to package or rework a semiconductor die
11/28/2002	US20020175146 Structure and method to preserve STI during etching
11/28/2002	US20020175145 Method of forming void-free intermetal dielectrics
11/28/2002	US20020175144 Hexafluorobutadiene (C4F6), combined with a larger amount of diluent gas xenon (Xe) enhance nitride selectivity without the occurence of etch stop
11/28/2002	US20020175143 Preventing edge-stain when polishing acid-etched wafers by first oxidizing the wafer with an aqueous solution of hydrogen peroxide and ammonium hydroxide followed by polishing with an aqueous alkaline slurry
11/28/2002	US20020175142 Method of forming capacitor element
11/28/2002	US20020175140 Method for forming metal layer of semiconductor device
11/28/2002	US20020175139 Method for forming an electrical insulating layer on bit lines of the flash memory
11/28/2002	US20020175080 Plating a wafer by exposing to a first solution of a sulfur depolarizing compound to brighten and level; exposing to a metal compound solution, applying a current; elimination of depletion/monitoring of additives and defects (bumps)
11/28/2002	US20020175071 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/28/2002	US20020174997 Conductive cap, electronic component, and method of forming insulating film of conductive cap
11/28/2002	US20020174959 Plate member separating apparatus and method
11/28/2002	US20020174958 Separating apparatus and processing method for plate memeber
11/28/2002	US20020174953 Wafer chuck having refrigerating plate serving as chucking plate
11/28/2002	US20020174952 Integrated processing system having multiple reactors connected to a central chamber
11/28/2002	US20020174951 Surface isolation device
11/28/2002	US20020174950 Apparatus for manufacturing a semiconductor device
11/28/2002	US20020174947 Thermoplastic adhesive preform for heat sink attachment
11/28/2002	US20020174920 Heat treatment of formed aluminum alloy products
11/28/2002	US20020174885 Method and apparatus for enhanced chamber cleaning
11/28/2002	US20020174882 Substrate processing apparatus and substrate processing method
11/28/2002	US20020174881 First section for supporting a semiconductor wafer at a first level and a second section for supporting the water at a second lower level; tilting to separate from water during processing; conveying to brush boxes
11/28/2002	US20020174879 Method for cleaning a semiconductor wafer
11/28/2002	US20020174861 Method for cutting slices from a workpiece
11/28/2002	US20020174833 Apparatus for epitaxially for growing semiconductor device structures with submicron group III nitride layer utilizing HVPE
11/28/2002	US20020174828 Thermal annealing process for producing silicon wafers with improved surface characteristics
11/28/2002	US20020174825 Method of growing oriented single crystals with reuseable crystal seeds or crystal nuclei
11/28/2002	US20020174709 Air-sampling carrier, apparatus and method for analyzing air in a semiconductor process tool
11/28/2002	US20020174667 Method of and an apparatus for regulating the temperature of an electrostatic chuck
11/28/2002	US20020174627 Surface package type semiconductor package and method of producing semiconductor memory
11/28/2002	US20020174539 Method of repairing disconnected wiring and multilevel wiring structure
11/28/2002	DE10222083A1 Insulating process used for a semiconductor device comprises forming an insulating mask layer pattern on zones of a semiconductor substrate, forming a trench up to a required height
11/28/2002	DE10220173A1 Flüssigkristallanzeige-Vorrichtung und Verfahren zum Herstellen derselben A liquid crystal display device and method of manufacturing the same
11/28/2002	DE10220129A1 Vergrösserung der Tiefgrabenkapazität durch eine zentrale Masseelektrode Enlargement of the deep grave capacity by a central ground electrode
11/28/2002	DE10163429A1 HF-Schaltungschip, HF-Schaltungsvorrichtung mit HF-Schaltungschip und Herstellungsverfahren davon RF circuit chip, RF circuit device having RF circuit die and production method thereof
11/28/2002	DE10144462C1 Electronic component used as a semiconductor component comprises a passive component, and a semiconductor chip electrically connected to a wiring structure
11/28/2002	DE10128271C1 Diode manufacturing method uses shaker with reception openings for alignment of diode chips before adhering to lower conductor layers provided by base plate
11/28/2002	DE10126294C1 Fabrication of integrated circuit by reversing the doping of first section of lower conductive layer of interconnect to second conduction type, and etching lower conductive layer second section with first section as etching stop
11/28/2002	DE10125905C1 Releasable coupling between IC chip and carrier uses interlocking mechanical coupling elements provided by IC chip and carrier
11/28/2002	DE10124803A1 Polarisator und Mikrolithographie-Projektionsanlage mit Polarisator Polarizer and microlithography projection system with polarizer
11/28/2002	DE10124366A1 Production of a semiconductor memory cell has spacer elements formed by depositing a material region for a first passivating region and subsequently polishing with a stop on a common level of storage elements or a protective layer
11/28/2002	DE10123858A1 Verfahren zum Bilden von Silicium-haltigen Dünnschichten durch Atomschicht-Abscheidung mittels SI2CL6 und NH3 A method of forming silicon-containing thin films by atomic layer deposition using SI2CL6 and NH3
11/28/2002	DE10123594A1 Integrated semiconductor circuit e.g. embedded DRAM includes MOSFETs with different average switching frequencies and having dielectric layers with different thickness
11/28/2002	DE10123593A1 Magnetic memory arrangement has second supply device that sets current direction according to information to be written, first current supply device that changes current direction
11/28/2002	DE10123510A1 Production of a semiconductor element comprises depositing a polysilicon layer, a tungsten-containing precursor layer and a protective layer on a substrate, tempering, structuring and forming side wall spacers
11/28/2002	DE10123509A1 Planarization of semiconductor structure involves providing second area on layer to be planarized that is continuously masked using pre-planarizing mask
11/28/2002	DE10123363A1 Structure for integrated circuit arranged above substrate has elements separated by distance greater than/equal to resolution of lithographic technique used to structure at least parts of structure
11/28/2002	DE10123332A1 Thin film magnetic memory device e.g. MRAM enables adjacent magnetic memory cells to share mutual write word lines that are selectively activated based on row selection result
11/28/2002	DE10121657A1 Mikroelektronische Struktur mit einer Wasserstoffbarrierenschicht Microelectronic structure with a hydrogen barrier layer
11/28/2002	DE10120446A1 Projection exposure system, especially for micro-lithography, has position sensitive correction sensor element that detects wavefront of measurement light beam or beams
11/28/2002	CA2448460A1 Methods and apparatus for semiconductor testing
11/28/2002	CA2447722A1 Vertical metal oxide semiconductor field-effect diodes
11/28/2002	CA2349033A1 Initial plasma treatment for vertical dry etching of sio2
11/28/2002	CA2349032A1 Method for deep and vertical dry etching of sio2
11/27/2002	EP1261133A2 System and method for asymmetric routing lines
11/27/2002	EP1261127A2 Semiconductor integrated circuit device
11/27/2002	EP1261040A1 Semiconductor device and method for fabricating the same
11/27/2002	EP1261036A2 Power MOSFET semiconductor device and method of manufacturing the same
11/27/2002	EP1261035A2 Enhancement- and depletion-mode phemt device and method of forming same
11/27/2002	EP1261033A2 On chip inductive structure
11/27/2002	EP1261032A2 Semiconductor switching device
11/27/2002	EP1261031A2 Tape for forming resin tie bar on a lead frame
11/27/2002	EP1261030A1 Bonding pad for integrated circuit
11/27/2002	EP1261029A2 Semiconductor device and method of production of same
11/27/2002	EP1261026A1 Device having resin package and method of producing the same
11/27/2002	EP1261025A2 Semiconductor device and method of fabricating same
11/27/2002	EP1261024A2 Atomic resolution storage system
11/27/2002	EP1261023A2 Atomic resolution storage system
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system
11/27/2002	EP1261020A1 Wafer manufacturing method, polishing apparatus, and wafer
11/27/2002	EP1261019A2 Plate member separating apparatus and method
11/27/2002	EP1260991A1 Porous materials
11/27/2002	EP1260871A2 Position detecting method and apparatus, exposure apparatus and device manufacturing method
11/27/2002	EP1260868A2 Method for removing resist material
11/27/2002	EP1260865A2 Device for exposure of a peripheral area of a wafer
11/27/2002	EP1260861A1 Method of manufacturing a reflector, reflector manufactured thereby, phase shift mask and lithographic apparatus making use of them
11/27/2002	EP1260849A1 Polarisation compensator and microlithography projection device with polarisation compensator
11/27/2002	EP1260845A2 Catadioptric reduction lens
11/27/2002	EP1260745A2 System and method for using bent pipes in high-purity fluid handling systems
11/27/2002	EP1260743A2 Fluid control apparatus
11/27/2002	EP1260720A2 Hydrostatic bearing and stage apparatus using same
11/27/2002	EP1260614A1 Tin plating

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