Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/03/2002US6488745 Trap apparatus and method for condensable by-products of deposition reactions
12/03/2002US6488730 Comprises deionized water, metallic oxide, and cyclic amines for the chemical mechanical polishing of thin films used in integrated circuit manufacturing
12/03/2002US6488570 Method relating to a polishing system having a multi-phase polishing layer
12/03/2002US6488568 Optical view port for chemical mechanical planarization endpoint detection
12/03/2002US6488509 Plug filling for dual-damascene process
12/03/2002US6488497 Wafer boat with arcuate wafer support arms
12/03/2002US6488407 Radiation temperature measuring method and radiation temperature measuring system
12/03/2002US6488198 Wire bonding method and apparatus
12/03/2002US6488158 Boat for organic and ceramic flip chip package assembly
12/03/2002US6488154 Chip tray
12/03/2002US6488040 Capillary proximity heads for single wafer cleaning and drying
12/03/2002US6488039 State of the art constant flow device
12/03/2002US6488038 Method for cleaning semiconductor substrates
12/03/2002US6488037 Programmable physical action during integrated circuit wafer cleanup
12/03/2002US6488021 Method and apparatus for producing semiconductor element
12/03/2002US6487910 Method and apparatus for quantitative sputter target cleanliness and characterization
12/03/2002US6487794 Substrate changing-over mechanism in vacuum tank
12/03/2002US6487793 Vacuum processing apparatus and operating method therefor
12/03/2002US6487792 Method and apparatus for agitation of workpiece in high pressure environment
12/03/2002US6487791 Vacuum processing apparatus
12/03/2002US6487744 Device for cleaning a wafer of abrasive agent suspension remaining after polishing with brushes and DI water
11/2002
11/28/2002WO2002096172A1 Method for manufacturing ceramic multilayered board
11/28/2002WO2002096170A1 Method for producing a contact substrate, and corresponding contact substrate
11/28/2002WO2002095920A1 Electron tunneling device
11/28/2002WO2002095836A1 Dmos with zener diode for esd protection
11/28/2002WO2002095835A2 Vertical metal oxide semiconductor field-effect diodes
11/28/2002WO2002095834A1 Thin film transistor and active matrix type display unit production methods therefor
11/28/2002WO2002095831A1 Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same
11/28/2002WO2002095830A1 Production method for solid imaging device
11/28/2002WO2002095829A2 Non-volatile memory cells utilizing substrate trenches
11/28/2002WO2002095828A1 Hybrid semiconductor input/output structure
11/28/2002WO2002095827A2 Method for producing a semiconductor storage device
11/28/2002WO2002095822A2 Method for packaging a microelectronic device using on-die bond pad expansion
11/28/2002WO2002095820A2 Hollow structure in an integrated circuit
11/28/2002WO2002095819A2 Structure and method to preserve sti during etching
11/28/2002WO2002095818A1 Oxynitride shallow trench isolation and method of formation
11/28/2002WO2002095817A2 Semiconductor component with at least one semiconductor chip on a base chip serving as substrate and method for production thereof
11/28/2002WO2002095816A1 Method for contacting an electrical component with a substrate comprising a conducting structure
11/28/2002WO2002095815A2 Time-based semiconductor material attachment
11/28/2002WO2002095814A1 Semiconductor device and method therefor________________________
11/28/2002WO2002095813A2 Differential cleaning for semiconductor wafers with copper circuitry
11/28/2002WO2002095812A1 Two-mask trench schottky diode
11/28/2002WO2002095809A2 Apparatus and method for substrate preparation implementing a surface tension reducing process
11/28/2002WO2002095808A1 Smooth multipart substrate support member for cvd
11/28/2002WO2002095807A2 Silicon fixtures useful for high temperature wafer processing
11/28/2002WO2002095806A1 Universal backplane assembly and methods
11/28/2002WO2002095805A2 Laser parrering of devices
11/28/2002WO2002095804A1 Method and device for the thermal treatment of substrates
11/28/2002WO2002095803A1 Method and device for thermally treating substrates
11/28/2002WO2002095802A2 Methods and apparatus for semiconductor testing
11/28/2002WO2002095801A2 Improved connection assembly for integrated circuit sensors
11/28/2002WO2002095800A2 A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
11/28/2002WO2002095799A2 Thin films and production methods thereof
11/28/2002WO2002095798A2 Fibre optic wafer probe
11/28/2002WO2002095795A2 Device for receiving plate-shaped objects
11/28/2002WO2002095794A2 Semiconductor memory device and method for the production thereof
11/28/2002WO2002095789A1 Real-time plasma charging voltage measurement
11/28/2002WO2002095762A2 Flash memory device with increase of efficiency during an apde (automatic program disturb after erase) process
11/28/2002WO2002095586A2 Hierarchical built-in self-test for system-on-chip design
11/28/2002WO2002095502A1 Resist remover composition
11/28/2002WO2002095498A2 Lithographic method of manufacturing a device
11/28/2002WO2002095495A1 Integrated radio frequency using acousto-optical bragg-cell converter
11/28/2002WO2002095493A1 Active plate
11/28/2002WO2002095492A1 Active matrix display substrate
11/28/2002WO2002095432A1 Verification system for verifying system lsi operation, etc.
11/28/2002WO2002095430A2 Test circuit
11/28/2002WO2002095378A1 Method for sample separation and lift-out
11/28/2002WO2002095087A1 Method and device for vacuum treatment
11/28/2002WO2002095086A1 Cooling mechanism with coolant, and treatment device with cooling mechanism
11/28/2002WO2002094957A2 Chemical mechanical polishing compositions and methods relating thereto
11/28/2002WO2002094528A1 Dual laser cutting of wafers
11/28/2002WO2002094462A1 Method for cleaning surface of substrate
11/28/2002WO2002079705A3 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices
11/28/2002WO2002075611A3 Block based design methodology with programmable components
11/28/2002WO2002074445A3 Atomizer
11/28/2002WO2002073122A3 Cyclic error reduction in average interferometric position measurements
11/28/2002WO2002071474A3 Method for broadening active semiconductor areas
11/28/2002WO2002059981A3 Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers
11/28/2002WO2002058133A3 Semiconductor tiling structure and method of formation
11/28/2002WO2002056358A3 Sidewalls as semiconductor etch stop and diffusion barrier
11/28/2002WO2002056351A3 Polishing of semiconductor substrates
11/28/2002WO2002049116A3 Vertical junction field effect semiconductor diodes
11/28/2002WO2002049108A8 Semiconductor device package and lead frame with die overhanging lead frame pad
11/28/2002WO2002047150A3 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters
11/28/2002WO2002044805A3 Method of increasing the conductivity of a transparent conductive layer
11/28/2002WO2002020864A3 System and method for depositing high dielectric constant materials and compatible conductive materials
11/28/2002WO2002017357A3 Three dimensional inspection of leaded ics
11/28/2002WO2002013271A3 Integrated electronic circuit with at least one inductor and method for producing the same
11/28/2002WO2002013244A3 Apparatus and method for handling and testing of wafers
11/28/2002WO2001096955A3 A method and apparatus for etching metal layers on substrates
11/28/2002WO2001088998A3 Etching process for making electrodes
11/28/2002WO2001045141A9 Method and apparatus for smoothing thin conductive films by gas cluster ion beam
11/28/2002WO2001043183A9 Electrostatic chuck, susceptor and method for fabrication
11/28/2002WO2001022478A9 Semiconductor processing equipment having radiant heated ceramic liner
11/28/2002US20020178416 Hierarchical built-in self-test for system-on-chip design
11/28/2002US20020177980 Specimen topography reconstruction
11/28/2002US20020177875 Method and apparatus for processing an array of components
11/28/2002US20020177520 Chemical filter
11/28/2002US20020177395 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer
11/28/2002US20020177394 Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate