| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/03/2002 | US6488745 Trap apparatus and method for condensable by-products of deposition reactions |
| 12/03/2002 | US6488730 Comprises deionized water, metallic oxide, and cyclic amines for the chemical mechanical polishing of thin films used in integrated circuit manufacturing |
| 12/03/2002 | US6488570 Method relating to a polishing system having a multi-phase polishing layer |
| 12/03/2002 | US6488568 Optical view port for chemical mechanical planarization endpoint detection |
| 12/03/2002 | US6488509 Plug filling for dual-damascene process |
| 12/03/2002 | US6488497 Wafer boat with arcuate wafer support arms |
| 12/03/2002 | US6488407 Radiation temperature measuring method and radiation temperature measuring system |
| 12/03/2002 | US6488198 Wire bonding method and apparatus |
| 12/03/2002 | US6488158 Boat for organic and ceramic flip chip package assembly |
| 12/03/2002 | US6488154 Chip tray |
| 12/03/2002 | US6488040 Capillary proximity heads for single wafer cleaning and drying |
| 12/03/2002 | US6488039 State of the art constant flow device |
| 12/03/2002 | US6488038 Method for cleaning semiconductor substrates |
| 12/03/2002 | US6488037 Programmable physical action during integrated circuit wafer cleanup |
| 12/03/2002 | US6488021 Method and apparatus for producing semiconductor element |
| 12/03/2002 | US6487910 Method and apparatus for quantitative sputter target cleanliness and characterization |
| 12/03/2002 | US6487794 Substrate changing-over mechanism in vacuum tank |
| 12/03/2002 | US6487793 Vacuum processing apparatus and operating method therefor |
| 12/03/2002 | US6487792 Method and apparatus for agitation of workpiece in high pressure environment |
| 12/03/2002 | US6487791 Vacuum processing apparatus |
| 12/03/2002 | US6487744 Device for cleaning a wafer of abrasive agent suspension remaining after polishing with brushes and DI water |
| 11/28/2002 | WO2002096172A1 Method for manufacturing ceramic multilayered board |
| 11/28/2002 | WO2002096170A1 Method for producing a contact substrate, and corresponding contact substrate |
| 11/28/2002 | WO2002095920A1 Electron tunneling device |
| 11/28/2002 | WO2002095836A1 Dmos with zener diode for esd protection |
| 11/28/2002 | WO2002095835A2 Vertical metal oxide semiconductor field-effect diodes |
| 11/28/2002 | WO2002095834A1 Thin film transistor and active matrix type display unit production methods therefor |
| 11/28/2002 | WO2002095831A1 Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same |
| 11/28/2002 | WO2002095830A1 Production method for solid imaging device |
| 11/28/2002 | WO2002095829A2 Non-volatile memory cells utilizing substrate trenches |
| 11/28/2002 | WO2002095828A1 Hybrid semiconductor input/output structure |
| 11/28/2002 | WO2002095827A2 Method for producing a semiconductor storage device |
| 11/28/2002 | WO2002095822A2 Method for packaging a microelectronic device using on-die bond pad expansion |
| 11/28/2002 | WO2002095820A2 Hollow structure in an integrated circuit |
| 11/28/2002 | WO2002095819A2 Structure and method to preserve sti during etching |
| 11/28/2002 | WO2002095818A1 Oxynitride shallow trench isolation and method of formation |
| 11/28/2002 | WO2002095817A2 Semiconductor component with at least one semiconductor chip on a base chip serving as substrate and method for production thereof |
| 11/28/2002 | WO2002095816A1 Method for contacting an electrical component with a substrate comprising a conducting structure |
| 11/28/2002 | WO2002095815A2 Time-based semiconductor material attachment |
| 11/28/2002 | WO2002095814A1 Semiconductor device and method therefor________________________ |
| 11/28/2002 | WO2002095813A2 Differential cleaning for semiconductor wafers with copper circuitry |
| 11/28/2002 | WO2002095812A1 Two-mask trench schottky diode |
| 11/28/2002 | WO2002095809A2 Apparatus and method for substrate preparation implementing a surface tension reducing process |
| 11/28/2002 | WO2002095808A1 Smooth multipart substrate support member for cvd |
| 11/28/2002 | WO2002095807A2 Silicon fixtures useful for high temperature wafer processing |
| 11/28/2002 | WO2002095806A1 Universal backplane assembly and methods |
| 11/28/2002 | WO2002095805A2 Laser parrering of devices |
| 11/28/2002 | WO2002095804A1 Method and device for the thermal treatment of substrates |
| 11/28/2002 | WO2002095803A1 Method and device for thermally treating substrates |
| 11/28/2002 | WO2002095802A2 Methods and apparatus for semiconductor testing |
| 11/28/2002 | WO2002095801A2 Improved connection assembly for integrated circuit sensors |
| 11/28/2002 | WO2002095800A2 A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
| 11/28/2002 | WO2002095799A2 Thin films and production methods thereof |
| 11/28/2002 | WO2002095798A2 Fibre optic wafer probe |
| 11/28/2002 | WO2002095795A2 Device for receiving plate-shaped objects |
| 11/28/2002 | WO2002095794A2 Semiconductor memory device and method for the production thereof |
| 11/28/2002 | WO2002095789A1 Real-time plasma charging voltage measurement |
| 11/28/2002 | WO2002095762A2 Flash memory device with increase of efficiency during an apde (automatic program disturb after erase) process |
| 11/28/2002 | WO2002095586A2 Hierarchical built-in self-test for system-on-chip design |
| 11/28/2002 | WO2002095502A1 Resist remover composition |
| 11/28/2002 | WO2002095498A2 Lithographic method of manufacturing a device |
| 11/28/2002 | WO2002095495A1 Integrated radio frequency using acousto-optical bragg-cell converter |
| 11/28/2002 | WO2002095493A1 Active plate |
| 11/28/2002 | WO2002095492A1 Active matrix display substrate |
| 11/28/2002 | WO2002095432A1 Verification system for verifying system lsi operation, etc. |
| 11/28/2002 | WO2002095430A2 Test circuit |
| 11/28/2002 | WO2002095378A1 Method for sample separation and lift-out |
| 11/28/2002 | WO2002095087A1 Method and device for vacuum treatment |
| 11/28/2002 | WO2002095086A1 Cooling mechanism with coolant, and treatment device with cooling mechanism |
| 11/28/2002 | WO2002094957A2 Chemical mechanical polishing compositions and methods relating thereto |
| 11/28/2002 | WO2002094528A1 Dual laser cutting of wafers |
| 11/28/2002 | WO2002094462A1 Method for cleaning surface of substrate |
| 11/28/2002 | WO2002079705A3 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices |
| 11/28/2002 | WO2002075611A3 Block based design methodology with programmable components |
| 11/28/2002 | WO2002074445A3 Atomizer |
| 11/28/2002 | WO2002073122A3 Cyclic error reduction in average interferometric position measurements |
| 11/28/2002 | WO2002071474A3 Method for broadening active semiconductor areas |
| 11/28/2002 | WO2002059981A3 Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers |
| 11/28/2002 | WO2002058133A3 Semiconductor tiling structure and method of formation |
| 11/28/2002 | WO2002056358A3 Sidewalls as semiconductor etch stop and diffusion barrier |
| 11/28/2002 | WO2002056351A3 Polishing of semiconductor substrates |
| 11/28/2002 | WO2002049116A3 Vertical junction field effect semiconductor diodes |
| 11/28/2002 | WO2002049108A8 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 11/28/2002 | WO2002047150A3 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters |
| 11/28/2002 | WO2002044805A3 Method of increasing the conductivity of a transparent conductive layer |
| 11/28/2002 | WO2002020864A3 System and method for depositing high dielectric constant materials and compatible conductive materials |
| 11/28/2002 | WO2002017357A3 Three dimensional inspection of leaded ics |
| 11/28/2002 | WO2002013271A3 Integrated electronic circuit with at least one inductor and method for producing the same |
| 11/28/2002 | WO2002013244A3 Apparatus and method for handling and testing of wafers |
| 11/28/2002 | WO2001096955A3 A method and apparatus for etching metal layers on substrates |
| 11/28/2002 | WO2001088998A3 Etching process for making electrodes |
| 11/28/2002 | WO2001045141A9 Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
| 11/28/2002 | WO2001043183A9 Electrostatic chuck, susceptor and method for fabrication |
| 11/28/2002 | WO2001022478A9 Semiconductor processing equipment having radiant heated ceramic liner |
| 11/28/2002 | US20020178416 Hierarchical built-in self-test for system-on-chip design |
| 11/28/2002 | US20020177980 Specimen topography reconstruction |
| 11/28/2002 | US20020177875 Method and apparatus for processing an array of components |
| 11/28/2002 | US20020177520 Chemical filter |
| 11/28/2002 | US20020177395 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer |
| 11/28/2002 | US20020177394 Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate |