Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/27/2002EP1260606A2 Low dielectric constant material and method of processing by cvd
11/27/2002EP1260605A1 Vapour deposition system and process
11/27/2002EP1260481A2 Atomic resolution storage system
11/27/2002EP1260315A1 Semiconductor substrate holder for chemical-mechanical polishing comprising a movable plate
11/27/2002EP1260312A1 Improvement in and relating to edge grinding
11/27/2002EP1260309A2 Table system with angular position controls
11/27/2002EP1260126A2 Component mounting apparatus and component mounting method, and, recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
11/27/2002EP1260125A2 Thermal management system
11/27/2002EP1260021A1 Structural element with an integrated high-frequency circuit
11/27/2002EP1259989A1 Monolithically integrated semiconductor component
11/27/2002EP1259987A1 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound
11/27/2002EP1259986A2 Device for packing electronic components using injection moulding technology
11/27/2002EP1259985A2 Method and apparatus for processing thin metal layers
11/27/2002EP1259984A2 Nitride layer forming methods
11/27/2002EP1259983A1 Electrical connection between two surfaces of a substrate and method for producing same
11/27/2002EP1259982A1 Method of reducing the specific resistance of an electrically conducting molybdenum layer
11/27/2002EP1259981A1 Device and method for encapsulating electronic components mounted on a carrier
11/27/2002EP1259980A1 Two etchant etch method
11/27/2002EP1259979A2 Method of etching a shaped cavity
11/27/2002EP1259978A2 Method and device for producing group iii-n, group iii-v-n and metal-nitrogen component structures on si substrates
11/27/2002EP1259977A1 Apparatus and method for processing electronic components
11/27/2002EP1259976A2 Capacitive pressure-responsive devices and their fabrication
11/27/2002EP1259859A1 In-situ lithography mask cleaning
11/27/2002EP1259829A2 Vertical counter balanced test head manipulator
11/27/2002EP1259663A2 Method and device for growing large-volume oriented monocrystals
11/27/2002EP1259165A2 Modelling and testing of an integrated circuit
11/27/2002EP1216125A4 A homogenization enhancing thermoplastic foam extrusion screw
11/27/2002EP1208385A4 Sensor design and process
11/27/2002EP1117714B1 Water soluble positive-working photoresist composition
11/27/2002EP1112145B1 Polishing pad for a semiconductor substrate
11/27/2002EP1103050B1 Resistive ferroelectric storage cell
11/27/2002EP1091965B1 Precursors for growth of heterometal-oxide films by mocvd
11/27/2002EP1020104B1 Method for mounting semiconductor element to circuit board, and semiconductor device
11/27/2002EP0976147A4 Method for forming a silicide region on a silicon body
11/27/2002EP0968533B1 High performance display pixel for electronic displays
11/27/2002EP0932500A4 Method to control cavity dimensions of fired multilayer circuit boards on a support
11/27/2002EP0931333B1 Process for the manufacture of a highly epsilon-dielectric or ferroelectric coating
11/27/2002EP0842307B1 System for the plasma treatment of large area substrates
11/27/2002EP0812468B1 A METHOD OF MANUFACTURING A HIGH VOLTAGE GaN-AlN BASED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MADE
11/27/2002EP0766829B1 Method of cleaning probe tips of probe cards
11/27/2002EP0751560B1 Process for forming an integrated circuit comprising non-volatile memory cells and side transistors of at least two different types, and corresponding IC
11/27/2002EP0751559B1 Process for forming an integrated circuit comprising non-volatile memory cells and side transistors and corresponding IC
11/27/2002EP0738425B1 Pellet for encapsulating lead frames
11/27/2002EP0731983B1 Improved isolation between diffusion lines in a memory array
11/27/2002EP0731504B1 Process for the manufacturing of integrated circuits comprising lateral low-voltage and high-voltage DMOS-technology power devices and non-volatile memory cells
11/27/2002CN1382306A Copper deposit process
11/27/2002CN1382305A Compositions and processes for spin etch planarization
11/27/2002CN1382304A Nanoporous silica treated with siloxane polymers for ULSI applications
11/27/2002CN1382268A Antireflective coating material for photoresists
11/27/2002CN1382011A Manufacturing method for multilayer ceramic substrate
11/27/2002CN1381952A Compound semiconductor switched circuit device
11/27/2002CN1381901A Complementing biopolar transistor and its manufacturing method
11/27/2002CN1381900A Lateral transistor with graded base region, semiconductor integrated circu8it and manufacturing method
11/27/2002CN1381899A Panel display and its manufacturing method
11/27/2002CN1381898A Panel display and its manufacturing method
11/27/2002CN1381895A Non-volatile memory unit and its making process
11/27/2002CN1381894A Complementary bipolar transistor and its manufacturing method
11/27/2002CN1381893A Complementary bipolar transistor and its manufacturing method
11/27/2002CN1381892A Cross stack type dual-chip package and its preparing process
11/27/2002CN1381890A Semiconductor device and its manufacturing method
11/27/2002CN1381889A IC package and its preparing process
11/27/2002CN1381888A Wiring pad with edge reinforcing structure for integrated circuit
11/27/2002CN1381887A Wiring pad with edge-reinforcing structure
11/27/2002CN1381886A Semiconductor device and packaging and its manufacturing method
11/27/2002CN1381884A EEPROM unit and its preparing process
11/27/2002CN1381883A EEPROM unit and its preparing process
11/27/2002CN1381882A Process for preparing high-density mask-type ROM
11/27/2002CN1381881A Process for preparing bipolar IC
11/27/2002CN1381880A Outline-control method for etching metal layer
11/27/2002CN1381879A Observer for semiconductor element
11/27/2002CN1381878A Method for increasing tested failure coverage of circuit
11/27/2002CN1381877A Method for coupling exposed pad type semiconductor device with PCB
11/27/2002CN1381876A Process for preparing passived circular bipolar glass crystal
11/27/2002CN1381875A Method for making insulation layer and semiconductor device and semiconductor device made by it
11/27/2002CN1381874A Semiconductor device with waved deep slot and technology for preparing waved deep slot
11/27/2002CN1381873A Chemicomechanical grinder with temp control
11/27/2002CN1381872A Chemical vapour-phase deposition device and chemical vapour-phase deposition method
11/27/2002CN1381871A High-contrast ratio diaphragm mask
11/27/2002CN1381870A Technology for obtaining large-area high-quality GaN self-supporting substrate
11/27/2002CN1381869A Preparation method of semiconductor substrate
11/27/2002CN1381868A Semiconductor making equipment with heating assembly
11/27/2002CN1381849A Content-addressed memory unit
11/27/2002CN1381774A 电压控制电路 Voltage control circuit
11/27/2002CN1381769A Method for increasing focusing depth in heliography
11/27/2002CN1095315C Producing system and method for print board assembly in system controlled by computer
11/27/2002CN1095204C Semiconductor device and transistor
11/27/2002CN1095203C Semiconductor storage device and method of manufacture of device
11/27/2002CN1095202C Semiconductor device and method for producing semiconductor device
11/27/2002CN1095201C Electronic package with thermally conductive support member and manufacturing method thereof
11/27/2002CN1095200C Method for fabricating nonvolatile memory device
11/27/2002CN1095199C Method of fabricating semiconductor device with cavity interposed between wirings
11/27/2002CN1095198C Semiconductor element with crystal wafer applied and burnt before head and method
11/27/2002CN1095197C 半导体晶片 Semiconductor wafer
11/27/2002CN1095196C Transistor with ultra shallow tip and method of fabrication thereof
11/27/2002CN1095195C Method for forming field oxide of semiconductor device
11/27/2002CN1095194C Repairing test method for semiconductor device
11/27/2002CN1095094C Automated non-visual method of locating periodically arranged sub-micron objects
11/27/2002CN1095093C Exposure mask and method for forming photoetching rubber pattern using the exposure mask
11/27/2002CN1094799C Palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
11/26/2002USRE37913 Exposure method and projection exposure apparatus
1 ... 4864 4865 4866 4867 4868 4869 4870 4871 4872 4873 4874 4875 4876 4877 4878 4879 4880 4881 4882 4883 4884 ... 6590