Patents for B81B 7 - Micro-structural systems (8,983)
10/2003
10/08/2003CN1447921A Acceleration sensor and method of manufacture thereof
10/02/2003WO2003081968A1 A method for integrating microparticles into mems
10/02/2003WO2003081315A1 Micro light modulator arrangement
10/02/2003WO2003079752A2 Unit cell architecture for electrical interconnects
10/02/2003WO2003040338A3 Micro-scale interconnect device with internal heat spreader and method for fabricating same
10/02/2003US20030186672 Nano-electromechanical filter
10/02/2003US20030184889 Mirror assembly with elevator lifter
10/02/2003US20030183921 Electronic device and method for manufacturing the same
10/02/2003US20030183920 Hermetic electric component package
10/02/2003US20030183916 Packaging microelectromechanical systems
10/02/2003US20030183407 Packaging microelectromechanical structures
10/02/2003US20030183307 Electrical device and method of making
09/2003
09/30/2003US6627814 Hermetically sealed micro-device package with window
09/25/2003WO2003078302A2 Micro-electromechanical systems
09/25/2003WO2003078301A2 Micro-electromechanical systems
09/25/2003WO2003078300A1 Microbattery and systems using microbattery
09/25/2003WO2003009318A3 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
09/25/2003US20030180190 Wall forming recesses; fluid flow; covering with lid; multilayer laminate
09/25/2003US20030178635 Perpendicular torsion micro-electromechanical switch
09/25/2003US20030178403 Method and system for locally connecting microstructures and devices formed thereby
09/24/2003EP1346949A2 Si wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method
09/24/2003EP1346601A2 Miniature silicon condenser microphone and method for producing same
09/24/2003EP1345843A2 System and method for constraining totally released microcomponents
09/24/2003CN1444738A Micromirror elements, package for micromirror elements, and projection system therefor
09/23/2003US6624921 Micromirror device package fabrication method
09/23/2003US6624003 Integrated MEMS device and package
09/18/2003WO2003076330A2 Silicon carbide microelectromechanical devices with electronic circuitry
09/18/2003WO2003025500A3 Microgyroscope with electronic alignment and tuning
09/18/2003US20030176046 Method for tiling unit cells
09/18/2003US20030174929 Self-shadowing MEM structures
09/18/2003US20030174035 Optical deflector and electromagnetic actuator
09/18/2003US20030173654 Shielded multi-conductor interconnect bus for MEMS
09/18/2003US20030173649 Unit cell architecture for electrical interconnects
09/18/2003US20030173648 Multi-die chip and method for making the same
09/18/2003US20030173112 Interconnect bus crossover for MEMS
09/17/2003EP1222031B1 Method and device for moving and placing liquid drops in a controlled manner
09/16/2003US6621134 Vacuum sealed RF/microwave microresonator
09/12/2003WO2003041133A3 Electrothermal self-latching mems switch and method
09/11/2003US20030170966 SI wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method
09/10/2003CN1441749A System and method for constraining totally released microcomponents
09/10/2003CN1441703A Microreactor
09/09/2003US6617264 SOG materials for spacer anodic bonding and method of preparing the same
09/04/2003WO2003072487A2 Bonding for a micro-electro-mechanical system (mems) and mems based devices
09/04/2003WO2002060810A3 Micro-element substrate interconnection
09/04/2003US20030166310 Method of reinforcing a mechanical microstructure
09/02/2003US6613605 Interconnection method entailing protuberances formed by melting metal over contact areas
08/2003
08/28/2003WO2003070625A2 Thin film encapsulation of mems devices
08/28/2003US20030160543 Microelectromechanical generator using bubbles
08/28/2003US20030160021 Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
08/28/2003US20030159513 Semiconductor acceleration sensor
08/27/2003EP1338912A1 Mirror rocking member for optical deflector
08/21/2003WO2003068671A2 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
08/21/2003WO2003068669A1 Deflectable microstructure and method of manufacturing the same through bonding of wafers
08/21/2003WO2002024322A9 Microfluidic chip having integrated electrodes
08/21/2003US20030157426 Glass frit wafer bonding process and packages formed thereby
08/21/2003US20030155643 Thin film encapsulation of MEMS devices
08/21/2003US20030155622 Acceleration sensor and method of manufacture therof
08/21/2003CA2473836A1 Deflectable microstructure and method of manufacturing the same through bonding of wafers
08/20/2003EP1335878A1 Microstructure component
08/19/2003US6607526 Laser irradiation apparatus
08/19/2003CA2139108C Dispersive microlens
08/14/2003WO2003067657A2 Semiconductor component comprising a sensor surface or an actuator surface, and method for producing the same
08/14/2003WO2003067647A2 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents
08/14/2003WO2002101352A8 Electronic and opto-electronic devices fabricated from nanostructured high surface to volume ratio thin films
08/14/2003US20030153116 Encapsulation of MEMS devices using pillar-supported caps
08/14/2003US20030151479 Latching micro magnetic relay packages and methods of packaging
08/13/2003CN1436099A High-performance system for parallel and selective dispensing of micro-droplets
08/12/2003US6605339 Micro heat barrier
08/07/2003WO2003065104A1 Aperture edge in a digital micromirror housing
08/07/2003WO2003065052A2 Method of manufacturing an accelerometer
08/07/2003WO2003065050A2 Method of manufacturing an accelerometer
08/07/2003WO2002100770A3 Wafer assembly and a method for producing a wafer assembly
08/06/2003EP1332547A1 Electrostatic/pneumatic actuators for active surfaces
08/05/2003US6603238 Micro-relay and method for manufacturing the same
08/05/2003US6603182 Packaging micromechanical devices
07/2003
07/31/2003WO2003063223A1 Method for making a gas permeable enclosure for micromachine devices
07/31/2003WO2003062136A2 Method and system for locally connecting microstructures
07/31/2003WO2003062135A1 A sensor
07/31/2003WO2003062133A2 Covered microchamber structures
07/31/2003US20030143775 Wafer-level through-wafer packaging process for mems and mems package produced thereby
07/31/2003US20030143773 Process for sealing devices incorporating microstructures
07/31/2003US20030141291 Device for homogeneous heating of an object
07/30/2003EP1331201A2 Resonant thermal out-of-plane buckle-beam acuator
07/30/2003EP1330411A1 Thermoelastic actuator design
07/30/2003CN1433133A Electrostatic driver
07/29/2003US6600851 Electrostatically actuated micro-electro-mechanical system (MEMS) device
07/29/2003US6600201 Systems with high density packing of micromachines
07/29/2003US6599736 Microfluidic bioreactor; for use in resolution and analysis of microstructures
07/24/2003WO2003061007A1 Light emitting display device with mechanical pixel switch
07/24/2003WO2003059806A1 Method and zone for sealing between two microstructure substrates
07/24/2003US20030139040 Nonstick layer for a micromechanical component
07/24/2003US20030138986 Microelectronic mechanical system and methods
07/23/2003EP1330017A2 Electrostatic drive
07/17/2003WO2003057618A2 Method for producing a protective covering for a component
07/17/2003WO2002002227A8 Devices and methods for carrying out chemical reactions using photogenerated reagents
07/17/2003US20030133252 Electrostatic drive
07/17/2003US20030132522 TiW platinum interconnect and method of making the same
07/17/2003US20030132514 Non-evaporable getter material disposed on same substrate as active transistors and other logic; includes layer of non-evaporable getter material disposed on dielectric layer, vacuum device disposed on substrate
07/17/2003US20030132493 High-vacuum packaged microgyroscope and method for manufacturing the same
07/16/2003CN1429762A Cantilever with step-type structure and its manufacture method
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