Patents for B81B 7 - Micro-structural systems (8,983)
01/2003
01/23/2003WO2002042716A3 Wafer eutectic bonding of mems gyros
01/23/2003US20030015729 Structure and method for fabricating dielectric resonators on a compliant substrate
01/21/2003US6510222 Miniature connector array
01/16/2003WO2003004403A2 Micromechanical cap structure and a corresponding production method
01/16/2003WO2001087765A3 Micromechanical component and method for producing the same
01/16/2003US20030010131 Grain growth of electrical interconnection for microelectromechanical systems (mems)
01/15/2003EP1276152A2 Passive devices and modules for transceiver and manufacturing method thereof
01/15/2003EP1276126A1 Microelectromechanical device
01/15/2003EP1275030A1 Device for homogeneous heating of an object
01/15/2003EP1274647A1 Micromechanical component and corresponding production method
01/15/2003CN1391281A Multi-layer integrated circuit for join of substrates with wide gaps
01/15/2003CN1391280A Electronic device and manufacture thereof
01/15/2003CN1390774A Micro ion pumps used for low-pressure miniature devices
01/14/2003US6507103 Semiconductor device
01/14/2003US6507082 Flip-chip assembly of protected micromechanical devices
01/09/2003US20030006502 Hermetically sealed microstructure package
01/08/2003EP1272422A2 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
01/07/2003US6504643 Structure for an optical switch on a substrate
01/07/2003US6504641 Driver and method of operating a micro-electromechanical system device
01/07/2003US6504292 Field emitting device comprising metallized nanostructures and method for making the same
01/03/2003WO2003001217A1 Acceleration sensor and method of manufacture thereof
01/03/2003WO2003000422A1 Microfabricated two-pin liquid sample dispensing system
01/03/2003WO2001089681A3 Modular chemical production system incorporating a microreactor
01/03/2003CA2451201A1 Microfabricated two-pin liquid sample dispensing system
01/02/2003US20030002782 Imaging technique for use with optical MEMS devices
01/02/2003US20030002447 Distributed actuation allocation for large assemblies of implementation units
01/02/2003US20030002265 Mems package with flexible circuit interconnect
01/02/2003US20030001251 Wafer level interconnection
01/02/2003US20030001221 Micromechanical component as well as a method for producing a micromechanical component
01/02/2003US20030000737 Masking layer in substrate cavity
01/02/2003EP1271200A1 Imaging technique and optical switch using optical MEMS devices
01/02/2003EP1270507A2 Passivation of anodic bonding regions in microelectromechanical systems
01/02/2003EP1268121A1 Method for assembling cassette-loaded microcomponents
01/02/2003CA2389820A1 Microelectromechanical component
12/2002
12/31/2002US6501107 Addressable fuse array for circuits and mechanical devices
12/31/2002US6500760 Gold-based electrical interconnections for microelectronic devices
12/31/2002US6499515 Gas cushion proportioning microsystem
12/31/2002US6499297 Micromachined parylene membrane valve and pump
12/19/2002WO2002101352A2 Electronic and opto-electronic devices fabricated from nanostructured high surface to volume ratio thin films
12/19/2002WO2002100770A2 Wafer assembly and a method for producing a wafer assembly
12/19/2002WO2002100769A2 A circuit encapsulation technique utilizing electroplating
12/19/2002US20020192920 Passive devices and modules for transceiver and manufacturing method thereof
12/19/2002US20020191893 Device and method for switching optical signals
12/19/2002DE10127960A1 Wafer arrangement used in combinatorial analysis comprises chips arranged on a wafer, electrical connections between the chips, and a control unit coupled to and for controlling a part of the chips
12/18/2002EP1267399A2 Electronic device having a cap body sealed to a substrate and method for manufacturing the same
12/18/2002EP1267385A1 Micro ion pump for a low-pressure microdevice microenclosure
12/18/2002EP1266863A2 Multi-level integrated circuit for wide-gap substrate bonding
12/18/2002EP1265708A1 Microreactor
12/18/2002CN1385359A Carbon nano tube film micromechanical infrared detector
12/17/2002US6495895 Bi-level multilayered microelectronic device package with an integral window
12/12/2002WO2002044033A3 Mems device with integral packaging
12/12/2002US20020187509 Methods for detecting interaction between a test moiety and a plurality of target moieties
12/12/2002US20020185947 Micro ion pump for a low-pressure microdevice microenclosure
12/12/2002US20020185737 Multi-level integrated circuit for wide-gap substrate bonding
12/12/2002US20020185712 Circuit encapsulation technique utilizing electroplating
12/11/2002EP1263532A2 Microlaboratory devices and methods
12/05/2002WO2002097767A2 Fabrication integration of micro-components
12/05/2002US20020181838 Optical MEMS device and package having a light-transmissive opening or window
12/05/2002US20020180031 Semiconductor device
12/05/2002US20020179986 MEMS wafer level package
12/05/2002US20020179921 Compliant hermetic package
12/03/2002US6489670 Sealed symmetric multilayered microelectronic device package with integral windows
12/03/2002US6489178 Method of fabricating a molded package for micromechanical devices
11/2002
11/28/2002US20020176649 Optically controlled switches
11/21/2002WO2002093122A2 Sensor arrangement, in particular micro-mechanical sensor arrangement
11/21/2002WO2002082101A8 Micromechanical capacitive acceleration sensor
11/21/2002US20020173080 Microelectromechanical system device package and packaging method
11/21/2002US20020173067 Method of forming patterned metalization on patterned semiconductor wafers
11/21/2002US20020172639 Applying carbon nanotubes to low-viscosity dispersion medium to obtain a high-viscosity dispersing liquid which includes carbon nanotubes; forming a network of carbon nanotubes having electrical and/or magnetic connections by removing
11/21/2002US20020171121 Integrated electromechanical switch and tunable capacitor and method of making the same
11/21/2002US20020170175 Method for producing micromechanical structures
11/21/2002DE10123039A1 Sensor arrangement used as a micromechanical sensor comprises a sensor section to deliver sensor signals, and a covering section arranged on the sensor section to form a hermetically sealed sensor inner chamber
11/19/2002US6483160 Micromechanical enclosure
11/14/2002WO2002091464A1 Optical cross-connect system
11/14/2002WO2002091439A1 Fabrication of a microelectromechanical system (mems) device
11/14/2002WO2002075794A3 A method for making a micromechanical device by using a sacrificial substrate
11/14/2002US20020168144 Micro-opto-electro-mechanical system (MOEMS)
11/14/2002US20020167712 Optical-electrical MEMS devices and method
11/14/2002US20020167135 Integrated pneumatic o-ring gasket for mems devices
11/13/2002EP1255642A1 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
11/12/2002US6479320 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
11/12/2002US6478974 Microfabricated filter and shell constructed with a permeable membrane
11/07/2002US20020163055 Flip-chip assembly of protected micromechanical devices
11/06/2002EP1255149A2 A micro-opto-electro-mechanical system (MOEMS)
11/06/2002CN1378224A Electronic parts
11/05/2002US6476971 Method of manufacturing a microlens array mold and a microlens array
10/2002
10/31/2002WO2002058111A3 Silicon-based mems and treatment of silicon-based surfaces to reduce surface charging
10/31/2002US20020159218 Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
10/31/2002US20020158480 Nanotweezers and nanomanipulator
10/30/2002EP1252028A2 Temporary bridge for micro machined structures
10/30/2002CN1376631A Miniature manipulate with piezoelectric-type flexible drive and adjustable range
10/29/2002US6472739 Encapsulated microelectromechanical (MEMS) devices
10/24/2002WO2002084335A2 Light transmissive substrate for an optical mems device
10/23/2002EP1251546A2 Electronic device sealed under vacuum containing a getter and method of operation
10/22/2002US6469909 MEMS package with flexible circuit interconnect
10/22/2002US6467348 Microgyroscope with two resonant plates
10/17/2002WO2002082101A1 Micromechanical capacitive acceleration sensor
10/17/2002US20020152006 Programmable smart membranes and methods therefor
10/17/2002US20020151776 Methods and devices for sealing microchip reservoir devices
10/17/2002US20020149096 Electronic device sealed under vacuum containing a getter and method of operation
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