Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
12/2003
12/02/2003US6656768 Flip-chip assembly of protected micromechanical devices
12/02/2003US6656368 Nonstick layer for a micromechanical component
11/2003
11/28/2003CA2429508A1 Piano mems micromirror
11/27/2003WO2003024865A3 Method for producing micro-electromechanical components
11/27/2003WO2002067293A3 Microelectromechanical systems (mems) device including an analog or a digital
11/27/2003WO2002065186A3 Pivoting optical micromirror, array for such micromirrors and method for making same
11/27/2003US20030219220 System and method for precise positioning of microcomponents
11/27/2003US20030218793 Micro mirror unit including mirror substrate and wiring substrate spaced by conductive spacer
11/27/2003US20030218102 Microfabricated translational stages for control of aerodynamic loading
11/27/2003US20030217915 Stiff protective structure; forming cavity in encapsulating structure under vacuum; overcoating with titanium nitride coating
11/25/2003US6654155 Single-crystal-silicon ribbon hinges for micro-mirror and MEMS assembly on SOI material
11/25/2003US6653702 Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrate
11/20/2003WO2003095357A2 On-wafer packaging for rf-mems
11/20/2003WO2002022492A8 Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods
11/20/2003US20030215975 Methods of coating contact holes in MEMS and similar applications
11/20/2003US20030214057 Microstructure fabrication and microsystem integration
11/20/2003US20030214007 Wafer-level package with bump and method for manufacturing the same
11/18/2003US6649998 Passive devices and modules for transceiver
11/18/2003US6648389 Process for manipulating components, a microtool for implementing the process, and a process for manufacturing the microtool or microtool parts
11/13/2003WO2003093167A1 Device for protecting a chip and method for operating a chip
11/13/2003WO2003067657A3 Semiconductor component comprising a sensor surface or an actuator surface, and method for producing the same
11/13/2003WO2003042721A3 Trilayered beam mems device and related methods
11/13/2003WO2000067063A8 Moveable microelectromechanical mirror structures
11/13/2003US20030209357 On-wafer packaging for RF-MEMS
11/12/2003EP1361192A2 Methods of metal coating contact holes in mems and similar applications
11/12/2003EP1360714A1 Wafer scale fiber optic termination
11/12/2003EP1360713A1 Light emitting semiconductor package
11/12/2003EP1360000A1 Device for connecting microcomponents
11/11/2003US6647172 Imaging technique for use with optical MEMS devices
11/11/2003US6647036 Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
11/11/2003US6646364 MEMS actuator with lower power consumption and lower cost simplified fabrication
11/11/2003US6644117 Electro-mechanical component and method for producing the same
11/11/2003US6643902 Piezoelectric/electrostrictive device and method of manufacturing same
11/06/2003WO2003090933A2 Method and structures for improved assembly of mems devices employing a centrifuge
11/05/2003EP1358489A1 Accelerometer protected by caps applied at the wafer scale
11/05/2003CN1453804A Transversely driven micromechanical variable condenser
11/04/2003US6642129 Parallel, individually addressable probes for nanolithography
11/04/2003US6641273 MEMS structure with mechanical overdeflection limiter
10/2003
10/30/2003WO2003089368A2 Low temperature method for forming a microcavity on a substrate and article having same
10/30/2003WO2003004403A3 Micromechanical cap structure and a corresponding production method
10/30/2003WO2002100769A3 A circuit encapsulation technique utilizing electroplating
10/30/2003US20030203158 Stereolithographic fabrication of monolithic housing structures for machines
10/30/2003US20030201654 Microgripper having linearly actuated grasping mechanisms
10/30/2003US20030201513 Multi-level integrated circuit for wide-gap substrate bonding
10/30/2003US20030200785 Passive temperature compensation technique for MEMS devices
10/29/2003EP1357409A1 Optical switch array and method for manufacturing
10/29/2003EP1356514A1 Use of infrared radiation in molding of protective caps
10/29/2003EP1356513A1 Molding of protective caps
10/29/2003EP1356511A1 Use of protective caps as masks at a wafer scale
10/29/2003EP1356510A1 Wafer scale molding of protective caps
10/29/2003EP1356508A1 Inkjet device encapsulated at the wafer scale
10/29/2003CN1452556A Ink jet printhead nozzle array
10/29/2003CN1452553A Ink jet printhead having moving nozzle with externally arranged actuator
10/29/2003CN1451601A Film micromechanical anchor
10/28/2003US6639313 Hermetic seals for large optical packages and the like
10/28/2003US6638784 Hermetic chip scale packaging means and method including self test
10/28/2003US6637901 Mirror assembly with elevator lifter
10/23/2003WO2003086957A1 Method for the production of a microstructure comprising a vacuum cavity and microstructure
10/23/2003WO2003086956A2 Method for producing a housing for a chip having a micromechanical structure
10/23/2003WO2003086955A1 Method and device for operating a micromechanical element
10/23/2003US20030197764 Method of manufacturing semiconductor device, semiconductor device, narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
10/23/2003US20030197446 MEMS device having a flexure with integral actuator
10/23/2003US20030197445 Flexure with integral actuator
10/23/2003US20030197248 Method for making a multi-die chip
10/23/2003US20030196491 Increasing the dynamic range of a MEMS gyroscope
10/23/2003CA2482077A1 Method for the production of a microstructure comprising a vacuum cavity and microstructure
10/22/2003EP1354849A2 Flexure with integral actuator
10/22/2003EP1354848A2 Mems device having a flexure with integral actuator
10/21/2003US6636683 Variable optical attenuator
10/21/2003US6635818 Converting the optical energy from an light source into high-voltage electrical energy by an energy transducer formed of either a piezoelectric element or a photovoltaic element on a micromachine
10/21/2003US6635509 Wafer-level MEMS packaging
10/16/2003WO2003086037A1 Method of manufacturing an electronic device
10/16/2003WO2003086034A1 Electrically insulating body, and electronic device
10/16/2003WO2003085736A1 Electronic device and method of manufacturing same
10/16/2003WO2003085732A1 Micro-electro-mechanical systems packaging
10/16/2003WO2003085442A1 Component comprising at least one cell including a mems structure
10/16/2003WO2003084862A2 Packaging microelectromechanical structures
10/16/2003WO2003084861A2 Method of manufacturing an electronic device in a cavity with a cover
10/16/2003US20030195106 Devices and methods for using centripetal acceleration to drive fluid movement on a microfluidics platform
10/16/2003US20030194172 Optical switching matrix and method of fabricating such a matrix
10/16/2003US20030193096 Wafer-level package with a cavity and fabricating method thereof
10/16/2003US20030192176 Re-assembly process for MEMS structures
10/15/2003EP1353373A2 Hermetically sealed package for an electronic component
10/15/2003EP1352877A2 Wafer-level MEMS packaging
10/14/2003US6633426 Overlaying or covered with an optically transmissive substrate held spaced in inverted preferably flip-chip bonded fashion to the device, with transparent electrodes provided in the substrate for generating an upper mirror-actuating field to
10/14/2003US6633079 Wafer level interconnection
10/14/2003US6632400 Integrated microfluidic and electronic components
10/11/2003CA2423210A1 Matrix of optical switches and process for the manufacture of said matrix
10/09/2003WO2003083952A2 Device and sensor for receiving light signals and method for the production thereof
10/09/2003WO2003083938A1 Hermetically sealed micro-device package with window
10/09/2003WO2003083883A2 Packaging microelectromechanical structures
10/09/2003WO2003082732A2 Packaging microelectromechanical systems
10/09/2003WO2003036767A3 Parallel, individually addressable probes for nanolithography
10/09/2003WO2003010087A3 Self-aligning optical micro-mechanical device package
10/09/2003US20030190776 Module and method of making same
10/09/2003US20030189351 Nanotweezers and nanomanipulator
10/09/2003US20030189350 Nanotweezers and nanomanipulator
10/09/2003US20030189242 Packaging microelectromechanical structures
10/09/2003US20030188881 Hermetically sealed micro-device package using cold-gas dynamic spray material deposition
10/08/2003EP1351285A2 Electrical device comprising two substrates bonded together and method of making same
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