| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 07/15/2004 | US20040137728 Air gap formation |
| 07/15/2004 | US20040136644 Optical switch with reduced beam divergence |
| 07/15/2004 | US20040136414 Wavelength-tunable semiconductor optical device |
| 07/14/2004 | EP1437325A1 MICRO−ACTUATOR, MICRO−ACTUATOR DEVICE, OPTICAL SWITCH AND OPTICAL SWITCH ARRAY |
| 07/14/2004 | EP1437036A1 Latching micro magnetic relay packages and methods of packaging |
| 07/13/2004 | US6762868 Electro-optical package with drop-in aperture |
| 07/13/2004 | US6762116 System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
| 07/13/2004 | US6762072 SI wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method |
| 07/08/2004 | DE10258478A1 Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures |
| 07/06/2004 | US6759670 Method for dynamic manipulation of a position of a module in an optical system |
| 07/06/2004 | US6759590 Hermetically sealed micro-device package with window |
| 07/06/2004 | US6759309 Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates |
| 07/06/2004 | US6759273 Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| 07/01/2004 | WO2004055885A2 Encapsulation of mems devices using pillar-supported caps |
| 07/01/2004 | WO2004021382A3 Micro-electromechanical switch performance enhancement |
| 07/01/2004 | WO2003054925A3 Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein |
| 07/01/2004 | US20040126953 Processes for hermetically packaging wafer level microscopic structures |
| 07/01/2004 | US20040124957 Meso-microelectromechanical system package |
| 06/30/2004 | EP1434031A2 Mems gyroscope and fabrication method thereof |
| 06/30/2004 | EP1433742A2 Electronic devices and production methods |
| 06/30/2004 | EP1433741A2 Method for the closure of openings in a film |
| 06/30/2004 | EP1433740A1 Method for the closure of openings in a film |
| 06/30/2004 | EP1432581A1 Inkjet printhead having thermal bend actuator heating element electrically isolated from nozzle chamber ink |
| 06/29/2004 | US6757459 Piezoelectrically driven, liquid-actuated optical cross-bar switch |
| 06/29/2004 | US6756545 Micro-device assembly with electrical capabilities |
| 06/29/2004 | US6756310 Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques |
| 06/29/2004 | US6756138 Micro-electromechanical devices |
| 06/24/2004 | US20040121517 Placement tool for wafer scale caps |
| 06/24/2004 | US20040121506 Release etch method for micromachined sensors |
| 06/24/2004 | US20040121454 Microreactor |
| 06/24/2004 | US20040120058 Shock protectors for micro-mechanical systems |
| 06/24/2004 | US20040120057 Apparatus, method and system for providing enhanced mechanical protection for thin beams |
| 06/24/2004 | US20040119490 Parallel, individually addressable probes for nanolithography |
| 06/24/2004 | US20040119143 Packaged microchip with isolator having selected modulus of elasticity |
| 06/24/2004 | US20040118599 Attaching flip chips to printed circuits; applying underfill to one zone; electrically heating |
| 06/24/2004 | US20040118192 Fluid delivery for scanning probe microscopy |
| 06/23/2004 | EP1431243A1 Device for the encapsulation of integrated microelectromechanical systems and method for its manufacture |
| 06/23/2004 | EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same |
| 06/23/2004 | EP1431240A2 Apparatus, method and system for providing enhanced mechanical protection for thin beams |
| 06/23/2004 | CN1507023A Side welding method for flip-chip semiconductor device |
| 06/23/2004 | CN1506298A Floating entry protective apparatus and method for preventing circuit from short-circuiting |
| 06/22/2004 | US6753037 Re-coating MEMS devices using dissolved resins |
| 06/17/2004 | WO2004051744A2 Mems control chip integration |
| 06/17/2004 | WO2004009492A3 Diamondoid-based components in nanoscale construction |
| 06/17/2004 | US20040115856 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 06/17/2004 | US20040112937 Microstructure component |
| 06/17/2004 | US20040112133 Methods and systems for decelerating proof mass movements within mems structures |
| 06/16/2004 | EP1428255A1 Microelectronic mechanical system and methods |
| 06/15/2004 | US6750775 Integrated sensor having plurality of released beams for sensing acceleration and associated methods |
| 06/15/2004 | US6750596 Generator for use in a microelectromechanical system |
| 06/15/2004 | US6750521 Surface mount package for a micromachined device |
| 06/15/2004 | US6750083 Method of masking microelectronic semiconductor chips with protective caps |
| 06/10/2004 | WO2004049017A2 Spatial light modulators with light absorbing areas |
| 06/10/2004 | WO2004011368A3 Low temperature anodic bonding method using focused energy for assembly of micromachined systems |
| 06/10/2004 | WO2003106329A3 Microelectromechanical device with integrated conductive shield |
| 06/09/2004 | EP1426797A1 Variable optical attenuator |
| 06/09/2004 | CN1503023A Variable light attenuator |
| 06/09/2004 | CN1153112C Miniature connectory array |
| 06/08/2004 | US6747863 Electrostatic drive |
| 06/08/2004 | US6747390 Micromirror actuator |
| 06/08/2004 | US6746891 Trilayered beam MEMS device and related methods |
| 06/03/2004 | WO2004047148A2 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 06/03/2004 | WO2004021398A3 Wafer-level seal for non-silicon-based devices |
| 06/03/2004 | US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 06/03/2004 | US20040104460 Wafer-level hermetic micro-device packages |
| 06/03/2004 | US20040104453 Method of forming a surface micromachined MEMS device |
| 06/03/2004 | US20040104444 MEMS device with alternative electrical connections |
| 06/02/2004 | EP1423714A1 Microstructure with movable mass |
| 06/02/2004 | EP1423713A1 Hermetically sealed silicon micro-machined electromechanical system (mems) device having diffused conductors |
| 06/02/2004 | CN1151954C Radio frequency microelectronic mechanical single knife commutator and its producing method |
| 06/01/2004 | US6743988 Optically controlled switches |
| 06/01/2004 | US6743656 MEMS wafer level package |
| 05/27/2004 | WO2004044986A1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates |
| 05/27/2004 | WO2004044518A2 High-g acceleration protection of a proof mass by electrostatical fixation |
| 05/27/2004 | US20040101992 Chips with wafer scale caps formed by molding |
| 05/27/2004 | US20040101245 Variable optical attenuator |
| 05/27/2004 | US20040100680 Spatial light modulators with light absorbing areas |
| 05/27/2004 | US20040100677 Spatial light modulators with light blocking/absorbing areas |
| 05/27/2004 | US20040099951 Air gap interconnect structure and method |
| 05/27/2004 | US20040099921 MEMS package |
| 05/27/2004 | US20040099917 Microstructures; bonding contacting wafers on supports, forming connectors enclosing in housing |
| 05/27/2004 | US20040099909 Micro-electro mechanical systems (MEMS) device using silicon on insulator (SOI) wafer, and method of fabricating and grounding the same |
| 05/26/2004 | CN1151367C Grain growth of electrical interconnection for microelectromechanical systems (MEMS) |
| 05/25/2004 | US6739199 Substrate and method of forming substrate for MEMS device with strain gage |
| 05/21/2004 | WO2001009622A3 Micro-mechanical inertial sensors |
| 05/20/2004 | US20040097066 Method of making an integrated electromechanical switch and tunable capacitor |
| 05/20/2004 | US20040096992 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 05/19/2004 | EP1419102A2 Method for producing micro-electromechanical components |
| 05/19/2004 | EP1295335B1 Miniature microdevice package and process for making same |
| 05/19/2004 | DE202004004206U1 Plate shaped body for forming pressure measurement elements has a number of blind holes, the remaining thin area of which forms a pressure membrane for a pressure measurement element that also comprises a bridge circuit |
| 05/19/2004 | CN1496832A Print head using radio-frequency micro-electromechanical system spary head |
| 05/19/2004 | CN1150604C Flat multi-layer ceramic component with subadjacent grooves |
| 05/19/2004 | CN1150596C Method and device for forming polyparaxylene MEMS |
| 05/18/2004 | US6738338 Near-field optical head, method of fabricating same, and optical drive using same |
| 05/13/2004 | WO2003089368A3 Low temperature method for forming a microcavity on a substrate and article having same |
| 05/13/2004 | WO2003084861A3 Method of manufacturing an electronic device in a cavity with a cover |
| 05/13/2004 | WO2003081968A8 A method for integrating microparticles into mems |
| 05/13/2004 | WO2003078302A3 Micro-electromechanical systems |
| 05/13/2004 | WO2002001638A3 Microelectronic packages including reactive components, and methods of fabricating the same |
| 05/13/2004 | US20040093575 Chemically synthesized and assembled electronic devices |