| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 04/10/2003 | WO2003009318A8 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 04/10/2003 | WO2002093122A3 Sensor arrangement, in particular micro-mechanical sensor arrangement |
| 04/10/2003 | US20030066957 Microfluidic system (mdi) |
| 04/09/2003 | EP1299939A2 Mems actuator with lower power consumption and lower cost simplified fabrication |
| 04/09/2003 | EP1299564A2 Integrated microarray devices |
| 04/09/2003 | CN1409869A Method for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby |
| 04/03/2003 | US20030062480 Infrared ray detector having a vacuum encapsulation structure |
| 04/03/2003 | US20030062332 Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
| 04/02/2003 | EP1296886A2 Micromechanical component and method for producing the same |
| 04/01/2003 | US6541833 Micromechanical component with sealed membrane openings and method of fabricating a micromechanical component |
| 04/01/2003 | US6541832 Plastic package for micromechanical devices |
| 03/27/2003 | WO2003026369A1 Latching micro magnetic relay packages and methods of packaging |
| 03/27/2003 | WO2003025500A2 Microgyroscope with electronic alignment and tuning |
| 03/27/2003 | WO2003024865A2 Method for producing micro-electromechanical components |
| 03/27/2003 | WO2003024864A1 Micro-actuator, micro-actuator device, optical switch and optical switch array |
| 03/27/2003 | US20030060051 Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques |
| 03/26/2003 | EP1296374A1 Process for bonding and electrically connecting microsystems integrated in several distinct substrates |
| 03/26/2003 | EP1295389A1 Nano-electromechanical filter |
| 03/26/2003 | EP1295335A1 Miniature microdevice package and process for making thereof |
| 03/26/2003 | CN1405081A Electric-static driven large-displacement micro structure |
| 03/25/2003 | US6538362 Piezoelectric/electrostrictive device and method of manufacturing same |
| 03/25/2003 | US6538312 Multilayered microelectronic device package with an integral window |
| 03/25/2003 | US6537892 Glass frit wafer bonding process and packages formed thereby |
| 03/25/2003 | US6536213 Micromachined parylene membrane valve and pump |
| 03/20/2003 | WO2003023849A1 Microelectronic mechanical system and methods |
| 03/20/2003 | WO2003023414A1 Microstructure with movable mass |
| 03/20/2003 | US20030054588 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 03/20/2003 | US20030054584 Method of intergrating mems device with low-resistivity silicon substrates |
| 03/20/2003 | US20030052404 Flip-chip assembly of protected micromechanical devices |
| 03/20/2003 | US20030052392 Support for microelectronic, microoptoelectronic or micromechanical devices |
| 03/20/2003 | US20030051339 Method for assembling cassette-loaded microcomponents |
| 03/19/2003 | EP1293478A2 Method of sealing electrodes |
| 03/19/2003 | EP1292450A1 Ink jet printhead nozzle array |
| 03/19/2003 | EP1255642A4 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby |
| 03/19/2003 | EP1036433B1 Electrostatic microactuators, active three-dimensional microcatheters using same and method for making same |
| 03/19/2003 | CN1404143A Semiconductor device |
| 03/18/2003 | US6534876 Flip-chip micromachine package |
| 03/18/2003 | US6534850 Hermetic sealed electrical and electronic apparatus having transistors formed on silicon, dielectric multilayer coverings and scavengers comprising metals and/or alloys |
| 03/18/2003 | US6534413 Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch |
| 03/13/2003 | WO2002084335A3 Light transmissive substrate for an optical mems device |
| 03/13/2003 | US20030049878 Micromechanical component and corresponding production method |
| 03/13/2003 | US20030048520 Vacuum-cavity MEMS resonator |
| 03/13/2003 | US20030047804 Semiconductor device |
| 03/13/2003 | US20030047799 Wafer level interconnection |
| 03/13/2003 | US20030047450 Microelectrode, microelectrode array and method for manufacturing the microelectrode |
| 03/12/2003 | EP1289660A1 High-performance system for parallel and selective dispensing of micro-droplets |
| 03/12/2003 | CN1103115C Integrated microstructures of semiconductor material and method of fabricating same |
| 03/11/2003 | US6531341 Method of fabricating a microelectronic device package with an integral window |
| 03/11/2003 | US6531331 Monolithic integration of a MOSFET with a MEMS device |
| 03/11/2003 | US6531232 System for assembling substrates to bonding zones provided with cavities |
| 03/11/2003 | US6530515 Micromachine stacked flip chip package fabrication method |
| 03/06/2003 | WO2003019201A1 Hermetically sealed silicon micro-machined electromechanical system (mems) device having diffused conductors |
| 03/06/2003 | US20030045025 A plastic land-grid array package, a ball-grid array package, and a plastic leaded package or micromechanical components are fabricated |
| 03/05/2003 | EP1286904A2 Microchannel device for heat or mass transfer |
| 03/05/2003 | EP1286761A2 Modular chemical production system incorporating a microreactor |
| 03/04/2003 | US6529310 Deflectable spatial light modulator having superimposed hinge and deflectable element |
| 03/04/2003 | US6528724 Microdevice and its production method |
| 03/04/2003 | US6528344 Chip scale surface-mountable packaging method for electronic and MEMS devices |
| 02/27/2003 | WO2003016206A2 System and method for precise positioning of microcomponents |
| 02/27/2003 | WO2003016205A2 Mems and method of manufacturing mems |
| 02/27/2003 | US20030038327 Hermetically sealed silicon micro-machined electromechanical system (MEMS) device having diffused conductors |
| 02/26/2003 | EP1286465A1 Microelectromechanical device |
| 02/25/2003 | US6525864 Integrated mirror array and circuit device |
| 02/25/2003 | US6525759 Induction charge mirror |
| 02/20/2003 | US20030034535 Mems devices suitable for integration with chip having integrated silicon and compound semiconductor devices, and methods for fabricating such devices |
| 02/18/2003 | US6522015 Micromachine stacked wirebonded package |
| 02/18/2003 | US6521477 Vacuum package fabrication of integrated circuit components |
| 02/18/2003 | US6520014 Microsensor having a sensor device connected to an integrated circuit by a solder joint |
| 02/13/2003 | WO2003012886A1 Electro ceramic components |
| 02/13/2003 | WO2002079814A3 Method for fabricating a through-wafer optical mems device having an anti-reflective coating |
| 02/13/2003 | US20030030998 Microelectromechanical component |
| 02/13/2003 | US20030030527 Microelectromechanical component |
| 02/11/2003 | US6519161 Molded electronic package, method of preparation and method of shielding-II |
| 02/11/2003 | US6516671 Grain growth of electrical interconnection for microelectromechanical systems (MEMS) |
| 02/06/2003 | WO2003010574A2 Packaged optical micro-mechanical device |
| 02/06/2003 | WO2003010087A2 Self-aligning optical micro-mechanical device package |
| 02/06/2003 | WO2002074686A3 A method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| 02/06/2003 | WO2002050874A3 Mems device having an actuator with curved electrodes |
| 02/06/2003 | WO2002038442A3 Microfabricated translational stages for control of aerodynamic loading |
| 02/06/2003 | WO2002024322A3 Microfluidic chip having integrated electrodes |
| 02/06/2003 | WO2002023251A3 Scanner apparatus having optical elements coupled to mems acuators |
| 02/06/2003 | US20030025168 Systems with high density packing of micromachines |
| 02/06/2003 | CA2397187A1 Microelectromechanical component |
| 02/05/2003 | EP1281665A2 Systems with high density packing of micromachines |
| 01/30/2003 | WO2003009318A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 01/30/2003 | WO2002055431A3 Wafer level interconnection |
| 01/30/2003 | US20030022470 Parallel, individually addressable probes for nanolithography |
| 01/30/2003 | US20030022424 Method for manufacturing electro ceramic components |
| 01/30/2003 | US20030022423 Electro ceramic components |
| 01/30/2003 | US20030022417 Micro eletro-mechanical component and system architecture |
| 01/30/2003 | US20030021551 Packaged optical micro-mechanical device |
| 01/30/2003 | US20030021541 Self-aligning optical micro-mechanical device package |
| 01/30/2003 | US20030021004 Method for fabricating a through-wafer optical MEMS device having an anti-reflective coating |
| 01/30/2003 | US20030020086 Tuned delay components for an integrated circuit |
| 01/30/2003 | US20030019833 Microfabricated elastomeric valve and pump systems |
| 01/29/2003 | CN1394276A Grain growth of electrical interconnection for microelectromechanical systems (MEMS) |
| 01/29/2003 | CN1393710A Imaging technique using optical MEMS device |
| 01/28/2003 | US6512300 Water level interconnection |
| 01/28/2003 | US6511859 IC-compatible parylene MEMS technology and its application in integrated sensors |
| 01/23/2003 | WO2003007050A1 Optical multilayer structure and its production method, optical switching device, and image display |