B81B 7 - Micro-structural systems

Patents for B81B 7 - Micro-structural systems (8,983)
12/2004
12/16/2004	WO2004108585A2 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
12/16/2004	WO2004068094A3 Integrated pressure and acceleration measurement device and a method of manufacture thereof
12/16/2004	WO2004013039A3 Low temperature plasma si or sige for mems applications
12/16/2004	US20040253765 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
12/16/2004	US20040251524 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
12/16/2004	US20040251439 Micro-actuator, fabrication method thereof, and micro-actuating valve
12/16/2004	CA2529935A1 Optical microelectromechanical structure
12/16/2004	CA2514230A1 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
12/15/2004	EP1486682A2 Micro-actuator, fabrication method thereof and micro-actuating valve
12/15/2004	EP1485328A1 A method for integrating microparticles into mems
12/15/2004	EP1485318A2 Micro-electromechanical systems
12/15/2004	CN1555339A Micro-actuator, micro-actuator device, optical switch and optical switch array
12/09/2004	WO2004107829A2 A novel packaging method for microstructure and semiconductor devices
12/09/2004	WO2004106222A1 Microelectromechanical pressure sensor and method for the production thereof
12/09/2004	WO2004106221A2 Microelectromechanical device packages with integral heaters
12/09/2004	US20040245586 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
12/09/2004	US20040244484 Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process
12/09/2004	DE10323146A1 Gehäuse zu definierten Verfüllung Housing to defined filling
12/08/2004	EP1484796A2 Semiconductor device and manufacturing method of the same
12/08/2004	EP1483196A1 Deflectable microstructure and method of manufacturing the same through bonding of wafers
12/08/2004	CN1554119A Parallel, individually addressable probes for nanolithography
12/07/2004	US6829132 Charge control of micro-electromechanical device
12/07/2004	US6829131 MEMS digital-to-acoustic transducer with error cancellation
12/07/2004	US6828674 Microelectrical-mechanical systems devices; microstructure and cap wafers bonded with frit glass sealant, connected by wire bond, and protected by overmold
12/07/2004	US6828640 Integrated electromechanical microstructure comprising pressure adjusting means in a sealed cavity and pressure adjustment process
12/07/2004	US6828143 Nanoscale chemical synthesis
12/02/2004	WO2004023490A3 Fluid delivery for scanning probe microscopy
12/02/2004	WO2004013038A3 Etch stop control for mems device formation
12/02/2004	WO2003095357A3 On-wafer packaging for rf-mems
12/02/2004	US20040238600 Novel packaging method for microstructure and semiconductor devices
12/01/2004	CN1551985A Microstructure with movable mass
12/01/2004	CN1550783A Capacitor type mechanical mass sensor
11/2004
11/30/2004	US6824278 Self-shadowing MEM structures
11/25/2004	WO2004102119A1 Methods and apparatus for shielding mems devices
11/25/2004	WO2004101428A1 Methods and apparatus for attaching mems devices to housing
11/25/2004	US20040232535 Microelectromechanical device packages with integral heaters
11/25/2004	US20040232533 Semiconductor apparatus and fabricating method for the same
11/25/2004	US20040232500 Sensor arrangement,in particular a micro-mechanical sensor arrangement
11/25/2004	US20040232455 Methods and apparatus for attaching a die to a substrate
11/25/2004	DE10356802A1 Flüssigmetallverriegelungsrelaisarray vom Einfügungstyp Liquid metal latching relay array of insertion type
11/25/2004	CA2522606A1 Metal mems devices and methods of making same
11/24/2004	EP1480268A2 Housing for defined filling
11/24/2004	EP1479647A2 Electrical X-talk shield for MEMs micromirrors
11/23/2004	US6822326 Wafer bonding hermetic encapsulation
11/23/2004	US6822324 Wafer-level package with a cavity and fabricating method thereof
11/23/2004	US6822304 Sputtered silicon for microstructures and microcavities
11/23/2004	CA2468139A1 Electrical cross-talk shields for mems micromirrors
11/23/2004	CA2468132A1 Electrode configuration for piano mems micromirror
11/18/2004	WO2004099065A1 Vacuum package fabrication of integrated circuit components
11/18/2004	WO2004099064A1 Anti-reflective sub-wavelengh structures for silicon wafers
11/18/2004	US20040227787 Printer head using a radio frequency micro-electromechanical system (RF MEMS) sprayer
11/18/2004	US20040227201 Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modules
11/18/2004	US20040226369 Vertical MEMS gyroscope by horizontal driving and fabrication method thereof
11/18/2004	DE10319661A1 Encapsulated micro-sensor for pressure measurement, has a current conductor within its chamber that has at least two voltage taps to permit determination of a gaseous medium thermodynamic value to detect leaks in the encapsulation
11/17/2004	EP1476394A2 Thin film encapsulation of mems devices
11/17/2004	EP1301344A4 Ink jet printhead having a moving nozzle with an externally arranged actuator
11/17/2004	CN1547226A Deep etching plane magnet coil and making method
11/11/2004	WO2004044986A9 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates
11/11/2004	US20040224091 forming collar which narrows opening and applying heat/pressure, then reflowing sealing layer; chemical/physical vapor deposition; for use in microelectronics, microelectromechanical systems
11/11/2004	US20040223373 Methods and apparatus for attaching MEMS devices to housing
11/11/2004	US20040222468 Methods and apparatus for particle reduction in MEMS devices
11/11/2004	DE10316776A1 Method for forming protective cover for electronic component, e.g. acoustic wave filter, resonator, sensor and/or actuator, involves depositing second layer onto first cover layer and forming aperture in second cover layer
11/11/2004	DE10314875A1 Temperature-resistant electronic sensor/actuator has element fixed in housing on stack of layers with different thermal expansion coefficient to stepwise adapt element coefficient to that of housing
11/10/2004	EP1474357A2 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
11/10/2004	CN1545484A Process for producing microelectromechanical components
11/10/2004	CN1175290C Minitype tool and method for manufacturing same
11/09/2004	US6815866 Cantilever having step-up structure and method for manufacturing the same
11/04/2004	WO2004095573A1 Wafer scale package and method of assembly
11/04/2004	WO2004095508A2 Meso-microelectromechanical system package
11/04/2004	WO2004094302A1 Micro-electro-mechanical systems (mems) device and system and method of producing the same
11/04/2004	WO2004094298A2 Microdevice assembly having a fine grain getter layer for maintaining vacuum
11/04/2004	WO2004015764A3 Vertical system integration
11/04/2004	US20040219764 Vacuum package fabrication of integrated circuit components
11/04/2004	US20040219706 System and method of fabricating micro cavities
11/04/2004	US20040219704 Sub-wavelength structures for reduction of reflective properties
11/04/2004	US20040218341 Charge control of micro-electromechanical device
11/04/2004	US20040218334 Selective update of micro-electromechanical device
11/04/2004	US20040218244 Scanner apparatus having electromagnetic radiation devices coupled to mems actuators
11/03/2004	EP1473691A2 Charge control of micro-electromechanical device
11/03/2004	EP1472735A1 Light emitting display device with mechanical pixel switch
11/03/2004	EP1472727A2 Semiconductor component comprising a sensor surface or an actuator surface, and method for producing the same
11/03/2004	EP1472546A2 Method of manufacturing an accelerometer
11/03/2004	CN1543048A Charge control of micro-electromechanical device
11/03/2004	CN1542885A Selective update of micro-electromechanical device
11/03/2004	CN1173827C Method for attaching micromechanical device to manifold, and fluid control system produced thereby
11/02/2004	US6812810 Bridges for microelectromechanical structures
11/02/2004	US6812617 MEMS device having a flexure with integral electrostatic actuator
11/02/2004	US6812558 Wafer scale package and method of assembly
11/02/2004	US6812456 Microfluidic system (EDI)
11/02/2004	US6812062 Molded wafer scale cap
10/2004
10/28/2004	WO2004092746A1 Ultra-miniature accelerometers
10/28/2004	WO2004091793A1 Micro-device for the collective transfer of a plurality of liquids
10/28/2004	US20040214380 Process for producing microelectromechanical components
10/28/2004	US20040212907 Micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays
10/28/2004	US20040212206 Micro/nano clutching mechanism
10/28/2004	DE102004010905A1 Kapazitiver Halbleitersensor Capacitive semiconductor sensor
10/27/2004	EP1470444A1 Aperture edge in a digital micromirror housing
10/26/2004	US6809413 Microelectronic device package with an integral window mounted in a recessed lip
10/26/2004	US6809412 Packaging of MEMS devices using a thermoplastic
10/26/2004	US6809384 Method and apparatus for protecting wiring and integrated circuit device

1 ... 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 ... 90