| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 05/30/2001 | CN1297584A Method of mfg. semiconductor device, semiconductor device, narrow pitch connector, electrostatic actuator, ink jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic device |
| 05/29/2001 | US6239372 Electrical connection of a movably disposed electrical component with a flexible, elastic conductor track carrier |
| 05/29/2001 | US6238946 Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing |
| 05/25/2001 | WO2001036320A2 Micromachine package |
| 05/25/2001 | WO2001006543A3 Microelectromechanical device with moving element |
| 05/23/2001 | EP1101730A2 Encapsulation process for microelectromechanical structures |
| 05/23/2001 | CN1296297A Enclosing technology for miniature eletric mechanical structure |
| 05/22/2001 | US6236491 Micromachined electrostatic actuator with air gap |
| 05/22/2001 | US6235550 Integrated sensor having plurality of released beams for sensing acceleration and associated methods |
| 05/15/2001 | US6232150 Process for making microstructures and microstructures made thereby |
| 05/15/2001 | CA2325097A1 Encapsulation process for microelectromechanical structures |
| 05/10/2001 | US20010001060 Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system |
| 05/09/2001 | EP1098170A2 Microgyroscope with two resonant plates |
| 05/09/2001 | EP1097901A2 Method of fabricating micro electro mechanical system structure which can be vacuum-packaged at wafer level |
| 05/09/2001 | EP1096888A1 Shape memory polymer gripper with a release sensing system |
| 05/09/2001 | CN1294303A Miniature mechanical appts. |
| 05/08/2001 | US6229427 Covered sealed pressure transducers and method for making same |
| 05/08/2001 | US6227050 Semiconductor mechanical sensor and method of manufacture |
| 05/03/2001 | WO2000065641A8 Microwave bonding of mems component |
| 05/02/2001 | EP1096260A1 Micromechanical device |
| 05/02/2001 | EP1096259A1 High-vacuum packaged microgyroscope and method for manufacturing the same |
| 05/02/2001 | EP1095671A2 Laser irradiation apparatus |
| 05/01/2001 | US6225692 Flip chip package for micromachined semiconductors |
| 05/01/2001 | US6225145 Method of fabricating vacuum micro-structure |
| 04/26/2001 | WO2001029529A2 Integrated packaging of micromechanical sensors and control circuits |
| 04/26/2001 | CA2388265A1 Integrated packaging of micromechanical sensors and control circuits |
| 04/24/2001 | US6221023 Sensor for intra-corporeal medical device and a method of manufacture |
| 04/19/2001 | WO2001027026A1 Electromechanical component and method for producing said component |
| 04/19/2001 | WO2001027025A1 Electro-mechanical component and method for producing the same |
| 04/19/2001 | DE19940581A1 Verfahren zur Herstellung integrierter Sensoren A process for manufacturing integrated sensors |
| 04/18/2001 | EP1093169A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device |
| 04/18/2001 | EP1093162A1 Hermatic firewall for mems packaging in flip-chip bonded geometry |
| 04/18/2001 | EP1093005A2 Micro-electro-mechanical optical device |
| 04/18/2001 | EP1093003A2 Micro-electro-mechanical optical device |
| 04/17/2001 | US6219253 Molded electronic package, method of preparation using build up technology and method of shielding |
| 04/17/2001 | US6218209 Integrated released beam sensor for sensing acceleration and associated methods |
| 04/17/2001 | US6218205 Post-process depositing shielding for microelectromechanical systems |
| 04/15/2001 | CA2322978A1 Hermatic firewall for mems packaging in flip-chip bonded geometry |
| 04/12/2001 | WO2001026136A2 Encapsulation for a three-dimensional microsystem |
| 04/12/2001 | WO2001024934A1 Method and device for moving and placing liquid drops in a controlled manner |
| 04/12/2001 | DE19947788A1 Verfahren und Vorrichtung zum Bewegen von Flüssigkeiten Method and device for moving liquids |
| 04/11/2001 | EP1090419A1 Device and method for forming a device having a cavity with controlled atmosphere |
| 04/11/2001 | CN1290968A Semiconductor structure and its producing method |
| 04/10/2001 | US6215221 Electrostatic/pneumatic actuators for active surfaces |
| 04/10/2001 | US6214644 Flip-chip micromachine package fabrication method |
| 04/05/2001 | WO2001024228A2 Temporary bridge for micro machined structures |
| 04/05/2001 | DE10045340A1 Semiconductor structure used in sensors comprises a deformable crosspiece arrangement on a substrate |
| 04/04/2001 | EP1089358A2 Piezoelectric/electrostrictive device and method of manufacturing same |
| 03/22/2001 | WO2001020948A2 Mems digital-to-acoustic transducer with error cancellation |
| 03/22/2001 | DE19940512A1 Verfahren zur Verkappung eines Bauelementes mit einer Kavernenstruktur und Verfahren zur Herstellung der Kavernenstruktur A method for capping a component having a cavity structure and process for producing the cavity structure |
| 03/20/2001 | US6203673 Forming insulation layer on substrate; forming platinum layer on substrate by sputtering; forming insulation layer on platinum; performing patterning of platinum through etching to produce thin-film resistor |
| 03/15/2001 | WO2001018857A1 Process for fabrication of 3-dimensional micromechanisms |
| 03/14/2001 | EP1083601A2 Micromachined silicon beam interconnect |
| 03/13/2001 | US6199430 Acceleration sensor with ring-shaped movable electrode |
| 03/01/2001 | WO2001014842A1 Semiconductor pressure sensor and pressure sensing device |
| 03/01/2001 | WO2001014248A2 Assembly process for delicate silicon structures |
| 02/28/2001 | EP1079435A1 Process for manufacturing integrated sensors |
| 02/28/2001 | EP1079431A2 Encapsulation process for components with cavities and cavity producing process |
| 02/28/2001 | EP1078287A1 Structure for micro-machine optical tooling and method for making and using |
| 02/15/2001 | DE19938205A1 Micro-mechanical sensor has improved sealing arrangement between upper cover and lower sensor to provide an effective hermetic seal between the two without unwanted sealant leakage into the sensor measurement area |
| 02/14/2001 | EP1075602A1 Microvalve battery |
| 02/13/2001 | US6186008 Semiconductor sensor component |
| 02/08/2001 | WO2001009622A2 Micro-mechanical inertial sensors |
| 02/06/2001 | US6185107 MEMS based tile assemblies and methods of fabrication |
| 01/30/2001 | US6180428 Monolithic scanning light emitting devices using micromachining |
| 01/25/2001 | WO2001006543A2 Microelectromechanical device with moving element |
| 01/25/2001 | CA2379537A1 Microelectromechanical device with moving element |
| 01/24/2001 | EP1070677A2 Microcap wafer-level package |
| 01/18/2001 | WO2001004938A1 Mechanical patterning of a device layer |
| 01/18/2001 | WO2001004595A1 Micromechanical component with contact leadthroughs and method for the production of a micromechanical component |
| 01/18/2001 | CA2343227A1 Mechanical patterning of a device layer |
| 01/17/2001 | EP1069588A2 Field emitting device comprising metalized nanostructures and method for making the same |
| 01/17/2001 | EP1069552A1 Process for assembling a microactuator and a transducer in a hard disk R/W unit |
| 01/17/2001 | EP1068638A1 Wafer-pair having deposited layer sealed chambers |
| 01/09/2001 | US6171886 Method of making integrated hybrid silicon-based micro-actuator devices |
| 01/04/2001 | WO2001001025A2 Microfabricated elastomeric valve and pump systems |
| 01/04/2001 | DE10006912A1 Process for fixing a microsensor to a wafer comprises etching a holder of a base wafer, applying a sacrificial layer, forming a recess in a separate assembly wafer |
| 01/04/2001 | CA2767084A1 Microfabricated elastomeric valve and pump systems |
| 01/03/2001 | EP1065378A2 Microfabricated elastomeric valve and pump systems |
| 12/28/2000 | DE19929028A1 Completing pressure sensor by injection-molding around sensor assembly, is assisted by clamping lead frame mounting section in injection mold during injection of casing |
| 12/28/2000 | DE19929025A1 Pressures sensor has moulded housing, pressure channel to semiconducting pressure transducer formed by interior vol. of cap formed by cap upper side, cap wall and opening |
| 12/27/2000 | CN1278326A Microelectromechanical positioning apparatus |
| 12/27/2000 | CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit |
| 12/26/2000 | US6166478 Method for assembly of microelectromechanical systems using magnetic actuation |
| 12/12/2000 | US6160714 Molded electronic package and method of preparation |
| 12/12/2000 | US6160371 Robot system, control method, and recording medium |
| 12/12/2000 | US6158283 Semiconductor acceleration sensor |
| 12/07/2000 | WO2000073839A1 Micromachined electrostatic actuator with air gap |
| 12/07/2000 | DE10027234A1 Microsensor has micro electro-mechanical sensor element mounted directly on integrated circuit, connected with positional accuracy and electrically conductively via peripheral solder seam |
| 12/06/2000 | EP1057779A2 Flip chip package for micromachined semiconductors |
| 12/05/2000 | US6156652 Post-process metallization interconnects for microelectromechanical systems |
| 11/30/2000 | DE19931773C1 Micromechanical component has contact ducts formed as metal wires which are recast from the molten glass during the manufacture of the first wafer |
| 11/23/2000 | WO2000069565A1 Method and apparatus for the manipulation of particles by means of dielectrophoresis |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 11/16/2000 | DE19922075A1 Bonding two microstructured plastics workpieces together, comprises introducing a plastics-dissolving organic solvent into a groove between the workpieces |
| 11/14/2000 | US6146917 Fabrication method for encapsulated micromachined structures |
| 11/09/2000 | WO2000067063A1 Moveable microelectromechanical mirror structures |
| 11/09/2000 | CA2371182A1 Moveable microelectromechanical mirror structures |
| 11/08/2000 | EP1049921A1 Micromachined gas-filled chambers and method of microfabrication |
| 11/07/2000 | US6142358 Wafer-to-wafer transfer of microstructures using break-away tethers |