Patents for B81B 7 - Micro-structural systems (8,983)
02/2004
02/05/2004US20040020676 Hermetically sealed micro-device package with window
02/05/2004US20040020173 Low temperature anodic bonding method using focused energy for assembly of micromachined systems
02/05/2004DE10232190A1 Verfahren zur Herstellung eines Bauelements mit tiefliegenden Anschlußflächen Method for manufacturing a device with deep pads
02/04/2004EP1386347A2 Microelectromechanical system (mens) device
02/04/2004EP1386343A1 A microfluidic system (edi)
02/04/2004CN1472133A Bridge for microelectromechanical structure
02/03/2004US6686653 Miniature microdevice package and process for making thereof
02/03/2004US6686642 Micro-machined system comprising logic circuitry or electron emitter array; second surface with gradual incline; evacuation, hermetic sealing
02/03/2004US6684699 Micromechanical device
02/03/2004US6684469 Electrostatic activators comprising multilayer sheets having electroconductive thin films, dielectrics and electrodes, bonded at spacings using adhesives to form three-dimensional microstructure cells
01/2004
01/29/2004WO2004010739A1 Microwave bonding on thin film metal coated substrates
01/29/2004WO2004009492A2 Diamondoid-based components in nanoscale construction
01/29/2004US20040017419 Method of forming a through-substrate interconnect
01/29/2004US20040017078 Connectors for microfluidic devices
01/29/2004US20040016995 MEMS control chip integration
01/29/2004US20040016397 Diamondoid-based components in nanoscale construction
01/28/2004EP1383708A1 Printed circuit board integrated switch
01/22/2004WO2004008522A2 Method for producing a component having submerged connecting areas
01/22/2004WO2003030252A3 Process for producing interconnects
01/22/2004US20040012298 MEMS device having electrothermal actuation and release and method for fabricating
01/22/2004US20040012087 Method and apparatus for forming a DMD window frame with molded glass
01/22/2004US20040012057 Monolithic integration of a MOSFET with a MEMS device
01/22/2004US20040011783 Microwave bonding of thin film metal coated substrates
01/22/2004DE10326555A1 Brücken für mikroelektromechanische Strukturen Bridges for microelectromechanical structures
01/22/2004DE10231730A1 Mikrostrukturbauelement und Verfahren zu dessen Herstellung Microstructure component and process for its preparation
01/15/2004WO2003057618A3 Method for producing a protective covering for a component
01/15/2004WO2002091439A9 Fabrication of a microelectromechanical system (mems) device
01/15/2004US20040007970 Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same
01/15/2004US20040007750 Integrated sensor and electronics package
01/13/2004US6678458 System and method for precise positioning of microcomponents
01/13/2004US6677709 Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same
01/13/2004US6677227 Metal contactor flanges; connecting circuits
01/13/2004US6677225 System and method for constraining totally released microcomponents
01/13/2004US6675671 Planar-constructed spatial micro-stage
01/13/2004US6675630 Microgyroscope with electronic alignment and tuning
01/08/2004WO2004003965A2 Mems capping method and apparatus
01/08/2004WO2004003619A1 Mems structure with mechanical overdeflection limiter
01/08/2004US20040005734 Dicing method for micro electro mechanical system chip
01/08/2004US20040005114 Electrostatic drive mirror apparatus
01/08/2004US20040004592 MEMS element, GLV device, and laser display
01/08/2004US20040004364 Diode-type nanotweezers and nanomanipulator device using the same
01/08/2004DE10122133B4 Integriertes Mikrosystem Integrated Microsystems
01/07/2004EP1377517A1 A unitary flexible and mechanically and chemically robust microsystem and a method for producing same
01/07/2004CN1465520A Method for making low friction factor microelectronic mechanical mould adopting electroforming
01/06/2004US6674159 Bi-level microelectronic device package with an integral window
01/06/2004US6673697 Packaging microelectromechanical structures
01/06/2004US6673254 Methods for fabricating a micro heat barrier
01/06/2004US6672795 System and method for coupling microcomponents
01/02/2004EP1377140A2 Improved film cooling for microcircuits
01/02/2004EP1375417A2 Bridges for microelectromechanical structures
01/01/2004US20040001263 MEMS structure with mechanical overdeflection limiter
12/2003
12/31/2003WO2004001481A1 Micromirror unit, method for fabricating the same and optical switch comprising it
12/31/2003WO2004001335A2 Increasing the dynamic range of a mems gyroscope
12/31/2003WO2004000718A2 Bridges for microelectromechanical structures
12/31/2003CN1464986A Optical multilayer structure and its production method, optical switching device, and image display
12/31/2003CA2483711A1 Increasing the dynamic range of a mems gyroscope
12/30/2003US6669256 Nanotweezers and nanomanipulator
12/25/2003US20030234703 Bridges for microelectromechanical structures
12/25/2003US20030234594 Microelement piezoelectric feedback type picking and releasing device
12/24/2003WO2003107397A2 Microelectromechanical system and method for determining temperature and moisture profiles within pharmaceutical packaging
12/24/2003WO2003106927A2 Passive temperature compensation technique for mems devices
12/24/2003WO2003106329A2 Microelectromechanical device with integrated conductive shield
12/24/2003WO2003106328A2 Micromechanical component and corresponding production method
12/24/2003WO2003068671A3 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
12/24/2003WO2003062133A3 Covered microchamber structures
12/24/2003WO2003054927A3 Structure and process for packaging rf mems and other devices
12/24/2003WO2003024865A8 Method for producing micro-electromechanical components
12/24/2003CA2490393A1 Microelectromechanical device with integrated conductive shield
12/24/2003CA2484323A1 Passive temperature compensation technique for mems devices
12/23/2003US6667837 Method and apparatus for configuring an aperture edge
12/23/2003US6667558 Module and method of making same
12/23/2003CA2322122C Micro-electro-mechanical optical device
12/19/2003CA2432490A1 Improved film cooling for microcircuits
12/18/2003WO2003105198A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
12/18/2003WO2002071371A3 Fabrication integration of micro-components
12/18/2003US20030230798 Wafer level MEMS packaging
12/18/2003US20030230793 Support for microelectronic, microoptoelectronic or micromechanical devices
12/18/2003US20030230147 Microelectromechanical device with integrated conductive shield
12/17/2003EP1183102B1 The use of microfluidic systems in the electrochemical detection of target analytes
12/16/2003US6664779 Package with environmental control material carrier
12/16/2003US6664126 Process for fabrication of 3-dimensional micromechanisms
12/11/2003WO2003103048A1 Die connected with integrated circuit component
12/11/2003WO2003083883A3 Packaging microelectromechanical structures
12/11/2003US20030228411 Method for integrating micro- and nanoparticles into MEMS and apparatus including the same
12/11/2003US20030227094 Wafer level packaging of micro electromechanical device
12/11/2003CA2483272A1 Die connected with integrated circuit component
12/10/2003EP1369730A1 Micro mirror unit including mirror substrate and wiring substrate spaced by conductive spacer
12/10/2003EP1075602B1 Microvalve battery
12/10/2003CN1461420A Integrated planar optical waveguide and shutter
12/10/2003CN1461018A Electrostatic driven micromachine changeable inductor
12/09/2003US6661084 Single level microelectronic device package with an integral window
12/09/2003US6661069 Micro-electromechanical varactor with enhanced tuning range
12/09/2003US6660564 Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby
12/09/2003US6660552 Reduced surface charging in silicon-based devices
12/04/2003US20030224559 Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates
12/04/2003US20030223679 Piano MEMs micromirror
12/04/2003US20030222337 Die connected with integrated circuit component for electrical signal passing therebetween
12/04/2003DE10224155C1 Sensor unit has individual sensors embedded in input surface connected in sensor groups via conductor path structure on underside of input surface
12/03/2003EP1366518A1 In-situ cap and method of fabricating same for an integrated circuit device
12/03/2003CN1459643A Micro-mirror surface unit containing mirror surface base plate and wiring substrate isolated with conductive lining
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