Patents for B81B 7 - Micro-structural systems (8,983)
09/2004
09/15/2004CN1166554C Miniature manipulate with piezoelectric-type flexible drive and adjustable range
09/14/2004US6792173 Device and method for switching optical signals
09/14/2004US6791162 Unit cell architecture for electrical interconnects
09/10/2004WO2004077523A2 Micromachined assembly with a multi-layer cap defining cavity
09/09/2004US20040173913 Capacitive semiconductor sensor
09/09/2004US20040173886 Micromachined assembly with a multi-layer cap defining a cavity
09/09/2004US20040173862 Optical device having micro lens array and method for manufacturing the same
09/09/2004US20040173751 Electronic device and method for manufacturing the same
09/09/2004DE10308050A1 Connecting tubes to channels in carrier member e.g. for measuring device, by providing channel with support surface and guide for connecting tube
09/08/2004EP1454349A2 Trilayered beam mems device and related methods
09/08/2004EP1454333A1 Mems device having a trilayered beam and related methods
09/07/2004US6787969 Damped micromechanical device
09/07/2004US6787897 Wafer-level package with silicon gasket
09/02/2004WO2004075247A2 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors
09/02/2004WO2004074168A2 Packaged microchip with thermal stress relief
09/02/2004US20040171206 Electrically isolated support for overlying MEM structure
09/02/2004US20040171186 Method of protecting microfabricated devices with protective caps
09/02/2004US20040171185 Particle filter for partially enclosed microelectromechanical systems
09/02/2004US20040169244 Miniature 3-dimensional package for MEMS sensors
09/01/2004EP1452481A2 Fabrication of advanced silicon-based MEMS devices
08/2004
08/31/2004US6784020 Package structure and method for making the same
08/31/2004US6782748 High-G acceleration protection by caging
08/26/2004WO2004071943A2 Electronic device and its manufacturing method device
08/26/2004WO2004049017A3 Spatial light modulators with light absorbing areas
08/26/2004WO2004037712A3 Method for producing a packaged integrated circuit with a microcavity
08/26/2004WO2003079752A3 Unit cell architecture for electrical interconnects
08/26/2004US20040166688 Method of fabricating microstructures and devices made therefrom
08/26/2004US20040166662 MEMS wafer level chip scale package
08/26/2004US20040166606 Low temperature wafer-level micro-encapsulation
08/26/2004US20040163717 MEMS device assembly
08/26/2004US20040163472 Acceleration sensor formed on surface of semiconductor substrate
08/25/2004EP1449810A2 Method for manufacturing micro-electro-mechanical system using solder balls
08/25/2004CN1522950A Method for manufacturing a housing for a chip having a micromechanical structure
08/24/2004US6781231 Microelectromechanical system package with environmental and interference shield
08/24/2004US6780672 Micro eletro-mechanical component and system architecture
08/19/2004WO2004059250A3 Methods and systems for decelarating proof mass movements within mems structures
08/19/2004WO2004058628A3 Encapsulated microstructure and method of producing one such microstructure
08/19/2004WO2003086956A3 Method for producing a housing for a chip having a micromechanical structure
08/19/2004WO2003076330A3 Silicon carbide microelectromechanical devices with electronic circuitry
08/19/2004US20040161870 Integrated micro electromechanical system encapsulation component and fabrication process of the component
08/19/2004US20040161530 Covering with sheet of radiation transparent material; adhesion og metal frame to sheet; spraying, fusion metal particles
08/18/2004EP1447875A1 Multi-bit phase shifter and manufacturing method thereof
08/18/2004EP1183566B1 Micromachined electrostatic actuator with air gap
08/18/2004EP0933012B1 Device for positioning and retaining micro-building-blocks
08/18/2004CN1521889A Multi-bit phase shifter and manufacturing method thereof
08/17/2004US6778046 Latching micro magnetic relay packages and methods of packaging
08/17/2004US6777767 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
08/17/2004US6777259 Accelerometer protected by caps applied at the wafer scale
08/12/2004WO2004068189A2 Hermetic window assemblies and frames
08/12/2004WO2004068094A2 Integrated pressure and acceleration measurement device and a method of manufacture thereof
08/12/2004WO2004067770A1 Active dna nanocompartment and its preparation
08/12/2004WO2004038916A3 Micro-electromechanical varactor with enhanced tuning range
08/12/2004US20040157426 Fabrication of advanced silicon-based MEMS devices
08/12/2004US20040157367 Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator
08/12/2004US20040155729 Multi-bit phase shifter and manufacturing method thereof
08/11/2004EP1445861A2 Electronic device and method of manufacturing the same
08/11/2004EP1185373B1 Method and apparatus for the manipulation of particles by means of dielectrophoresis
08/10/2004US6773962 Microelectromechanical system device packaging method
08/05/2004WO2004065289A2 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
08/05/2004WO2004044518A3 High-g acceleration protection of a proof mass by electrostatical fixation
08/05/2004WO2004035461A3 Manufacturing methods and vacuum or hermetically packaged micromachined or mems devices formed thereby having substantially vertical feedthroughs
08/05/2004US20040152229 Manufacturing methods and vacuum or hermetically packaged micromachined or MEMS devices formed thereby having substantially vertical feedthroughs
08/05/2004US20040150870 MEMS enclosure
08/05/2004US20040150058 MEMS enclosure
08/05/2004US20040149808 Method for the adhesion of two elements, in particular of an integrated circuit, for example an encapsulation of a resonator, and corresponding integrated circuit
08/05/2004DE10304835A1 Laminated microelectromechanical component, e.g. rotation rate sensor, micro swing mirror, acceleration sensor, comprises electric conductive structure integrated in functional layer
08/05/2004DE10303263A1 Sensor module contains sealing arrangement that acoustically isolates microphone so that detection is only possible in direction perpendicular to active surface over opening in circuit board
08/05/2004CA2511836A1 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
08/04/2004EP1443016A2 Micro-Fabricated device and method of making same
08/04/2004EP1442480A1 Device for the hermetic encapsulation of a component that must be protected against all stresses
08/04/2004EP1240529B1 Method for producing micromechanical structures
08/03/2004US6771859 Self-aligning optical micro-mechanical device package
08/03/2004US6770569 Low temperature plasma Si or SiGe for MEMS applications
08/03/2004US6770506 Release etch method for micromachined sensors
08/03/2004US6770503 Integrated packaging of micromechanical sensors and associated control circuits
08/03/2004US6769303 Multi-functional micro electromechanical silicon carbide accelerometer
07/2004
07/29/2004US20040147056 Micro-fabricated device and method of making
07/29/2004US20040147055 Photoelectric conversion device and manufacturing mehtod therefor
07/29/2004US20040145277 MEMS actuator with lower power consumption and lower cost simplified fabrication
07/27/2004US6768628 Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
07/27/2004US6768196 Packaged microchip with isolation
07/27/2004US6767764 Curable adhesive to bonded a release sheet to flexible package positioning within cavity
07/27/2004US6767757 High-vacuum packaged microgyroscope and method for manufacturing the same
07/22/2004WO2004061934A1 Selective underfill for flip chips and flip-chip assemblies
07/22/2004WO2004037711A3 Processes for hermetically packaging wafer level microscopic structures
07/22/2004WO2004028958A3 Electrical and/or micromechanical component and method
07/22/2004WO2003083952A3 Device and sensor for receiving light signals and method for the production thereof
07/22/2004US20040141682 Control apparatus and control method for optical switch using MEMS mirrors
07/22/2004US20040140557 Wl-bga for MEMS/MOEMS devices
07/22/2004US20040140475 3D MEMS/MOEMS package
07/22/2004DE10300594A1 Electronic and/or micromechanical structural element with chips, a packaging, a gel, and a gel packing agent useful in stress determination
07/20/2004US6764881 Method for manufacturing electro ceramic components
07/20/2004US6764875 Method of and apparatus for sealing an hermetic lid to a semiconductor die
07/20/2004US6763716 Semiconductor acceleration sensor
07/15/2004WO2004059250A2 Methods and systems for decelarating proof mass movements within mems structures
07/15/2004WO2004058628A2 Encapsulated microstructure and method of producing one such microstructure
07/15/2004WO2004047148A3 Method for producing and testing a corrosion-resistant channel in a silicon device
07/15/2004WO2004000718A3 Bridges for microelectromechanical structures
07/15/2004WO2003106328A3 Micromechanical component and corresponding production method
07/15/2004WO2003043038A3 Mems device having contact and standoff bumps and related methods
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