| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 05/13/2004 | US20040091197 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and micromechanical technologies on low loss substrates |
| 05/13/2004 | US20040089069 High-G acceleration protection by caging |
| 05/12/2004 | EP1418154A2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 05/12/2004 | EP1417455A2 Microgyroscope with electronic alignment and tuning |
| 05/12/2004 | EP1417152A2 Mems and method of manufacturing mems |
| 05/12/2004 | CN1495916A Micro electromechanical system device |
| 05/12/2004 | CN1495877A FOrmation of air-gap |
| 05/11/2004 | US6734550 In-situ cap and method of fabricating same for an integrated circuit device |
| 05/11/2004 | US6734513 Cap wafer bonded to top surface of base wafer with glass frit interposed in between; hermetic sealing |
| 05/11/2004 | US6733144 Shock protectors for micro-mechanical systems |
| 05/06/2004 | WO2004038916A2 Micro-electromechanical varactor with enhanced tuning range |
| 05/06/2004 | WO2004037712A2 Method for producing a packaged integrated circuit with a microcavity |
| 05/06/2004 | WO2004037711A2 Processes for hermetically packaging wafer level microscopic structures |
| 05/06/2004 | WO2004032230A3 Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
| 05/06/2004 | US20040087043 Package structure and method for making the same |
| 05/06/2004 | US20040084766 System-in-a-package device |
| 05/06/2004 | US20040084738 Flip-chip assembly of protected micromechanical devices |
| 05/06/2004 | EP1416064A2 Method of coating micro-electromechanical devices |
| 05/06/2004 | EP1415951A1 Integrated electromechanical microstructure having means fo regulating pressure and method for regulate pressure |
| 05/06/2004 | EP1415950A2 Wafer-level package for micro-electro-mechanical systems |
| 05/06/2004 | CA2503577A1 Method for producing a packaged integrated circuit with a microcavity |
| 05/05/2004 | CN1494106A Method and device used for protecting wiring and integrated circuit device |
| 05/04/2004 | US6731513 Shielded multi-conductor interconnect bus for MEMS |
| 05/04/2004 | US6730072 Methods and devices for sealing microchip reservoir devices |
| 04/29/2004 | WO2004035461A2 Manufacturing methods and vacuum or hermetically packaged micromachined or mems devices formed thereby having substantially vertical feedthroughs |
| 04/29/2004 | WO2004003965A3 Mems capping method and apparatus |
| 04/29/2004 | US20040082119 Molded wafer scale cap array |
| 04/29/2004 | US20040082115 Mold making method for wafer scale caps |
| 04/29/2004 | US20040082110 Molded wafer scale cap |
| 04/29/2004 | US20040082105 Wafer scale caps located by molding |
| 04/29/2004 | US20040082104 Chip with molded cap array |
| 04/29/2004 | US20040081809 Microstructured component and method for its manufacture |
| 04/29/2004 | US20040080566 Inkjet device encapsulated at the wafer scale |
| 04/29/2004 | US20040080035 Integrated electromechanical microstructure comprising pressure adjusting means in a sealed cavity and pressure adjustment process |
| 04/29/2004 | US20040079862 Two part mold for wafer scale caps |
| 04/28/2004 | EP1412550A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 04/28/2004 | EP1412283A2 Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture |
| 04/28/2004 | EP1412087A1 Microfabricated two-pin liquid sample dispensing system |
| 04/28/2004 | CN1492508A Semiconductor device with micro electromechanical system |
| 04/27/2004 | US6728432 Highly adaptable heterogeneous power amplifier IC micro-systems using flip chip and micromechanical technologies on low loss substrates |
| 04/27/2004 | US6728017 Micromirror actuator |
| 04/27/2004 | US6727436 Interconnect bus crossover for MEMS |
| 04/22/2004 | WO2004033363A1 Micro-actuator device and optical switch system using the same |
| 04/22/2004 | WO2003107397A9 Microelectromechanical system and method for determining temperature and moisture profiles within pharmaceutical packaging |
| 04/22/2004 | WO2003078301A3 Micro-electromechanical systems |
| 04/22/2004 | WO2003042094A8 Multi-chip module integrating mems mirror array with electronics |
| 04/22/2004 | US20040077164 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry |
| 04/22/2004 | US20040077154 Wafer-level package for micro-electro-mechanical systems |
| 04/22/2004 | US20040077139 Wafer scale fiber optic termination |
| 04/22/2004 | US20040074084 Device for connecting microcomponents |
| 04/21/2004 | EP1411025A2 Metal wiring method for an undercut |
| 04/21/2004 | EP1410911A1 Printer head using a radio frequency micro-electromechanical system (RF MEMS) sprayer |
| 04/21/2004 | EP1410436A2 Parallel, individually addressable probes for nanolithography |
| 04/21/2004 | EP1410084A2 Packaged optical micro-mechanical device |
| 04/21/2004 | EP1409399A2 Self-aligning optical micro-mechanical device package |
| 04/20/2004 | US6723379 Coating using the jet of gas so as to form a continuous built-up metallic frame incorporating the initial continuous metallic coating as its base and having an overall thickness that is a predetermined thickness |
| 04/15/2004 | WO2004032230A2 Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
| 04/15/2004 | WO2004031070A1 Micro movable device |
| 04/15/2004 | WO2003072487A3 Bonding for a micro-electro-mechanical system (mems) and mems based devices |
| 04/15/2004 | US20040070858 Mirror assembly with elevator lifter |
| 04/15/2004 | DE10246101A1 Verfahren zum Herstellen eines Gehäuses für einen Chip mit einer mikromechanischen Struktur A method of manufacturing a housing for a chip with a micro-mechanical structure |
| 04/14/2004 | EP1406831A2 Micromechanical cap structure and a corresponding production method |
| 04/14/2004 | CN1145800C Semiconductor device and sensor |
| 04/13/2004 | US6721098 Triple electrode MOEMS tunable filter and fabrication process therefor |
| 04/13/2004 | US6720635 Electronic component |
| 04/13/2004 | US6719682 Electronic spindle for using centripetal acceleration to drive fluid movement in a microfluidics system |
| 04/08/2004 | WO2004028959A2 Method and micromechanical device |
| 04/08/2004 | WO2004028958A2 Electrical and/or micromechanical component and method |
| 04/08/2004 | WO2004028957A1 Micromechanical component and method |
| 04/08/2004 | WO2004008522A3 Method for producing a component having submerged connecting areas |
| 04/08/2004 | WO2003082732A3 Packaging microelectromechanical systems |
| 04/08/2004 | WO2003067647A3 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents |
| 04/08/2004 | US20040067650 Method for manufacturing a housing for a chip having a micromechanical structure |
| 04/08/2004 | US20040067604 Wafer level packaging technique for microdevices |
| 04/08/2004 | US20040066258 MEMS device with integral packaging |
| 04/08/2004 | US20040065932 Sensor with at least one micromechanical structure and method for production thereof |
| 04/08/2004 | DE10244786A1 Mikromechanisches Bauelement und Verfahren Micro-mechanical device and method |
| 04/07/2004 | EP1406109A1 OPTICAL MULTILAYER STRUCTURE AND ITS PRODUCTION METHOD, OPTICAL SWITCHING DEVICE, AND IMAGE DISPLAY |
| 04/07/2004 | EP1405822A2 Process to manufacture a package for a micromechanical (mems) structure on a chip |
| 04/07/2004 | EP1405821A2 Wafer level packaging technique for microdevices |
| 04/06/2004 | US6717254 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture |
| 04/06/2004 | US6716669 High-density interconnection of temperature sensitive electronic devices |
| 04/06/2004 | US6716666 Wafer scale molding of protective caps |
| 04/06/2004 | US6716657 Method for interconnecting arrays of micromechanical devices |
| 04/01/2004 | WO2004001335A3 Increasing the dynamic range of a mems gyroscope |
| 04/01/2004 | WO2002067293A9 Microelectromechanical systems (mems) device including an analog or a digital |
| 04/01/2004 | US20040063325 Semiconductor device having MEMS |
| 04/01/2004 | US20040063239 Fabricating complex micro-electromechanical systems using an intermediate electrode layer |
| 04/01/2004 | US20040061962 Shock protectors for micro-mechanical systems |
| 04/01/2004 | US20040061961 Articulating hinge; optical routing; electrically controlled |
| 04/01/2004 | US20040061492 Package with environmental control material carrier |
| 04/01/2004 | US20040061207 Hermetically sealed microdevices having a single crystalline silicon getter for maintaning vacuum |
| 04/01/2004 | US20040061106 Micro electro mechanical system apparatus |
| 04/01/2004 | DE10243513A1 Elektrisches und/oder mikromechanisches Bauelement und Verfahren Electrical and / or micromechanical device and method |
| 04/01/2004 | DE10243511A1 Verfahren und mikromechanische Vorrichtung Procedures and micromechanical device |
| 03/31/2004 | EP1403950A2 MEMS-based fuel cell and methods |
| 03/31/2004 | EP1403213A2 Floating entrance guard for preventing electrical short circuits |
| 03/30/2004 | US6713828 Monolithic fully-integrated vacuum sealed BiCMOS pressure sensor |
| 03/30/2004 | US6713314 Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
| 03/25/2004 | WO2004025727A1 Method for sealing a microcavity and package comprising at least one microcavity |