Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
11/2000
11/02/2000WO2000065641A1 Microwave bonding of mems component
10/2000
10/31/2000US6140709 Bonding pad structure and method for manufacturing the bonding pad structure
10/31/2000US6140144 Method for packaging microsensors
10/26/2000WO2000062931A1 The use of microfluidic systems in the electrochemical detection of target analytes
10/26/2000WO2000062919A1 Modular chemical microsystem
10/26/2000DE19916960A1 Micro-tool, especially a micro-gripper for precise positioning of e.g. micro-lenses in micro-optical system assembly, has a gripper arm acceleration mechanism for overcoming adhesive force between a held component and a gripping face
10/26/2000DE19916277A1 Teleskopartiger Mikromanipulator mit Piezomaterialien Telescope-like micro manipulator with piezoelectric materials
10/26/2000DE10013013A1 Chemical synthesized components, intersects pair of crossing conductors which form crossing which has function for measurement in nanometer range
10/26/2000CA2370879A1 The use of microfluidic systems in the electrochemical detection of target analytes
10/24/2000US6137172 Method and device for positioning and retaining micro-building-blocks
10/19/2000WO2000062352A1 Telescope-type micro-manipulator comprising piezoelectric materials
10/19/2000DE19917398A1 Micromodular, rapidly-assembled, computer-controlled, virtual chemical plant with full complement of unit operations, is used e.g. to assess processes for new and hazardous products and to optimize yield
10/11/2000EP1043716A2 A micromirror device and an optical pick-up using the same
10/11/2000EP1042945A1 Molded electronic package, method of preparation and method of shielding
10/05/2000WO2000059050A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
09/2000
09/26/2000US6124632 Monolithic silicon mass flow control structure
09/26/2000US6124145 Microfabrication of gas-filled chambers made from silicon and/or glass wafers using anodic and/or fusion bonding
09/26/2000US6123316 Conduit system for a valve array
09/20/2000EP1036433A1 Electrostatic microactuators, active three-dimensional microcatheters using same and method for making same
09/19/2000US6121552 Microfabricated high aspect ratio device with an electrical isolation trench
09/14/2000WO2000054312A1 Ic-compatible parylene mems technology and its application in integrated sensors
09/12/2000US6118166 Thin-film microstructure sensor having a temperature-sensitive resistor to provide a large TCR with little variation
09/12/2000US6116756 Monolithic scanning light emitting devices
08/2000
08/29/2000US6109113 Silicon micromachined capacitive pressure sensor and method of manufacture
08/23/2000EP1029353A1 Sensor package arrangement
08/23/2000EP1029218A1 Microelectromechanical positioning apparatus
08/15/2000US6102917 Shape memory polymer (SMP) gripper with a release sensing system
08/08/2000US6100108 Method of fabricating electronic circuit device
08/08/2000US6100107 Microchannel-element assembly and preparation method thereof
08/02/2000EP1023469A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
07/2000
07/27/2000WO2000044208A1 Flexible microsystem and building techniques
07/26/2000CN1261026A Flat multi-layer ceramic component with subadjacent grooves
07/25/2000US6093576 Semiconductor sensor and manufacturing method thereof
07/06/2000WO2000039467A1 Electrostatic/pneumatic actuators for active surfaces
06/2000
06/29/2000WO2000038208A1 Micromachine switch and its production method
06/22/2000WO2000012987A3 Micromechanical component protected against environmental influences
06/21/2000EP1010361A1 Microfabricated high aspect ratio device with electrical isolation and interconnections
06/21/2000DE19857550A1 Encapsulation of metallic microcomponents on analyzing circuit on substrate wafer, e.g. for car, machine control and consumer purposes, has protective coating on circuit covered by bonding medium on cap wafer
06/20/2000US6078103 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
06/06/2000US6071819 Flexible skin incorporating mems technology
05/2000
05/24/2000EP1003211A2 Multilayer ceramic structure
05/16/2000US6063589 Devices and methods for using centripetal acceleration to drive fluid movement on a microfluidics system
05/16/2000US6062461 Process for bonding micromachined wafers using solder
05/11/2000WO2000026963A1 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
05/11/2000WO2000026958A1 System for assembling substrates to bonding zones provided with cavities
05/09/2000US6058781 Pressure sensor structure
05/09/2000US6058778 Integrated sensor having plurality of released beams for sensing acceleration
05/02/2000US6055859 Non-contact micromanipulation method and apparatus
04/2000
04/27/2000WO2000007225A3 Method of and apparatus for sealing an hermetic lid to a microelectronic machine
04/25/2000US6054335 Fabrication of scanning III-V compound light emitters integrated with Si-based actuators
04/11/2000US6049650 Structure for micro-machine optical tooling and method for making and using
03/2000
03/21/2000US6040625 Sensor package arrangement
03/09/2000WO2000012987A2 Micromechanical component protected against environmental influences
03/09/2000WO2000012428A1 Micromechanical component with sealed membrane openings
03/09/2000DE19839122A1 Vor Umwelteinflüssen geschützter mikromechanischer Sensor Protected from environmental influences micromechanical sensor
03/08/2000EP0983504A2 Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system
03/07/2000US6034430 Integrated thermal coupling for a heat generating device
02/2000
02/22/2000US6028343 Integrated released beam sensor for sensing acceleration and associated methods
02/22/2000US6028301 Method for controlling a micro electro-mechanical systems and verifying the state thereof using light
02/16/2000CN1244918A Housing for semiconductor sensor arrangement and process for producing the same
02/10/2000WO2000007420A1 Biometric sensor device comprising a positive engaging load compensation device between a flexible conductor strip and a chip housing
02/10/2000WO2000007225A2 Method of and apparatus for sealing an hermetic lid to a microelectronic machine
02/10/2000CA2338691A1 Method of and apparatus for sealing a hermetic lid to a semiconductor die
02/08/2000US6021670 Semiconductor acceleration detecting device with shock absorbing structure
02/03/2000DE19834720A1 Biometrische Sensoreinrichtung mit formschlüssiger Zugentlastungseinrichtung zwischen Flexleiterband und Chipgehäuse Biometric sensor device with positive strain relief between flex conductor strip and chip package
02/02/2000EP0912223A4 Microfabricated filter and shell constructed with a permeable membrane
02/01/2000US6020272 Method for forming suspended micromechanical structures
01/2000
01/27/2000WO2000003643A1 Shape memory polymer gripper with a release sensing system
01/27/2000CA2337189A1 Shape memory polymer gripper with a release sensing system
01/11/2000US6012336 Capacitance pressure sensor
01/05/2000DE19829609A1 Micro-system, integrated on an IC chip, production
12/1999
12/30/1999DE19826426A1 Manufacture of positive, gas-tight, conductive connection between solderable, unencapsulated semiconductor chip and encased metallized support
12/29/1999WO1999067818A1 Device and method for forming a device having a cavity with controlled atmosphere
12/29/1999WO1999054761A8 Structure for micro-machine optical tooling and method for making and using
12/08/1999EP0962275A2 Process for bonding micromachined wafers using solder
12/08/1999EP0833589A4 Microfabricated therapeutic actuator mechanisms
11/1999
11/30/1999US5994161 Temperature coefficient of offset adjusted semiconductor device and method thereof
11/30/1999US5994159 Self-assemblying micro-mechanical device
11/23/1999US5987989 Semiconductor physical quantity sensor
11/18/1999WO1999058859A1 Microvalve battery
11/17/1999EP0957509A2 Process for the fabrication of a device containing a microstructured layer
11/16/1999US5983721 Micromechanical component having closely spaced apart anchoring areas for a surface structure disposed thereon
11/11/1999DE19820816A1 Bond pad structure used for micromechanical sensors
11/10/1999EP0955473A1 Valve array
11/10/1999CN1234884A Miniature connector array
11/04/1999DE19819456A1 Micromechanical component manufacturing method, e.g. for micromechanical acceleration sensor manufacture
11/03/1999CN1234173A Method and device for positioning and retaining micro-building-blocks
10/1999
10/28/1999WO1999054761A1 Structure for micro-machine optical tooling and method for making and using
10/27/1999EP0951640A1 Housing for semiconductor sensor arrangement and process for producing the same
10/27/1999CN1233343A Micro-relay and method for manufacturing the same
10/20/1999EP0951068A1 Method of fabrication of a microstructure having an inside cavity
10/19/1999US5970315 Particularly useful for data storage applications, isotropically etching sacrificial layer under at least a beam portion of said microelectromechanical device
10/12/1999US5966009 Electromagnetic actuator and manufacturing method therefor
10/07/1999WO1999050905A1 Wafer-pair having deposited layer sealed chambers
10/07/1999WO1999024783A9 Microelectromechanical positioning apparatus
10/05/1999US5963788 Method for integrating microelectromechanical devices with electronic circuitry
10/05/1999US5962949 Microelectromechanical positioning apparatus
09/1999
09/23/1999DE19911916A1 Semiconductor component e.g. an acceleration or pressure sensor chip
09/23/1999DE19812583A1 Component with micromechanical surface structures, e.g. sensor elements or micro-motor actuators, is produced
09/21/1999US5955818 Machine structures fabricated of multiple microstructure layers
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