| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 10/26/2004 | US6809305 First substrate is poorly microwave absorbing silicon; bonding structures using the selective heating feature of microwave energy |
| 10/26/2004 | US6808955 Method of fabricating an integrated circuit that seals a MEMS device within a cavity |
| 10/26/2004 | US6808954 Vacuum-cavity MEMS resonator |
| 10/26/2004 | US6808745 Method of coating micro-electromechanical devices |
| 10/26/2004 | US6808275 Mirror assembly with elevator lifter |
| 10/21/2004 | WO2004089812A1 Process for fabricating micromachine |
| 10/21/2004 | US20040209413 Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
| 10/21/2004 | US20040209391 Method of integrating the fabrication process for integrated circuits and mem devices |
| 10/21/2004 | US20040207287 Micro-actuator array, micro-actuator device, optical switch, and optical switch system |
| 10/21/2004 | US20040207059 Package structure with a cavity |
| 10/21/2004 | DE102004014444A1 Halbleiteranordnung mit mehreren Substraten A semiconductor device having a plurality of substrates |
| 10/21/2004 | CA2807591A1 Microfluidic devices and methods of using same |
| 10/21/2004 | CA2807564A1 Microfluidic devices and methods of using same |
| 10/20/2004 | EP1469547A1 MEMS volumetric li/ion battery for space, air and terrestrial applications |
| 10/20/2004 | EP1467948A1 A sensor |
| 10/20/2004 | EP1467947A1 Method and zone for sealing between two microstructure substrates |
| 10/20/2004 | EP1467945A2 Covered microchamber structures |
| 10/20/2004 | CN2649568Y MEMS photoswitch |
| 10/19/2004 | US6806993 Method for lubricating MEMS components |
| 10/19/2004 | US6806992 Micro mirror unit including mirror substrate and wiring substrate spaced by conductive spacer |
| 10/19/2004 | US6806624 Microelectromechanical generator using bubbles |
| 10/19/2004 | US6806557 Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
| 10/19/2004 | US6805454 MEMS structure with mechanical overdeflection limiter |
| 10/19/2004 | US6805390 Nanotweezers and nanomanipulator |
| 10/19/2004 | US6804883 Mounting semiconductor pressure pick-up on lead grid; electrically connecting; inserting injection molding die; enclosing in housing; clamping die parts to cover channel |
| 10/14/2004 | WO2004087563A2 Barrier layers for microelectromechanical systems |
| 10/14/2004 | WO2004037712A8 Method for producing a packaged integrated circuit with a microcavity |
| 10/14/2004 | US20040203186 Metal wiring method for an undercut |
| 10/14/2004 | US20040201309 Insertion-type liquid metal latching relay array |
| 10/14/2004 | US20040200281 Ultra-miniature accelerometers |
| 10/14/2004 | DE10314996A1 Micromechanical structure has discharge arrangement that reduces potential difference between elements if potential difference positive and exceeds first value and/or negative and than second value |
| 10/13/2004 | CN1536687A Radio element adopting microelectric mechine system manufacture techqique and its manufacture method |
| 10/13/2004 | CN1535798A Manipulator |
| 10/12/2004 | US6802549 Nanotweezers and nanomanipulator |
| 10/07/2004 | WO2004086499A1 Methods and apparatus for attaching getters inside mems device housing |
| 10/07/2004 | WO2004000719A1 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same |
| 10/07/2004 | US20040197960 Micro-scale interconnect device with internal heat spreader and method for fabricating same |
| 10/07/2004 | US20040197953 Method for protecting encapsulated sensor structures using stack packaging |
| 10/07/2004 | US20040196608 Method and apparatus for protecting wiring and integrated circuit device |
| 10/07/2004 | US20040195851 Manipulator |
| 10/07/2004 | US20040195669 Integrated circuit packaging apparatus and method |
| 10/07/2004 | US20040195638 Micromechanical component as well as a method for producing a micromechanical component |
| 10/06/2004 | EP1464615A2 Method for protecting encapsulated sensor structures using stack packaging |
| 10/06/2004 | EP1463684A2 Method for producing a protective covering for a component |
| 10/06/2004 | EP1463610A1 Sampling and gripper device |
| 10/06/2004 | CN1169706C Electromagnetic microdriver driven glimmer switch |
| 10/05/2004 | US6800946 Selective underfill for flip chips and flip-chip assemblies |
| 10/05/2004 | US6800912 Integrated electromechanical switch and tunable capacitor and method of making the same |
| 09/30/2004 | WO2004084300A1 Electrical connections in substrates |
| 09/30/2004 | WO2004082363A2 Sensor assembly and methods of making and using same |
| 09/30/2004 | WO2004075247A3 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors |
| 09/30/2004 | US20040192047 Method of pre-etching glass substrate for reducing releasing time |
| 09/30/2004 | US20040191957 Wafer scale package and method of assembly |
| 09/30/2004 | US20040191937 Barrier layers for microelectromechanical systems |
| 09/30/2004 | US20040191626 MEMS volumetric Li/ion battery for space, air and terrestrial applications |
| 09/30/2004 | US20040191125 Rotating platform; heating; temperature detector; electron spindle rotors for transferring electricity signal |
| 09/30/2004 | US20040190377 Method and means for isolating elements of a sensor array |
| 09/30/2004 | US20040190112 Optical materials in packaging micromirror devices |
| 09/30/2004 | US20040189198 Microdevice assembly having a fine grain getter layer for maintaining vacuum |
| 09/30/2004 | US20040188821 Wafer scale package and method of assembly |
| 09/30/2004 | US20040188786 Reduced substrate micro-electro-mechanical systems (MEMS) device and system for producing the same |
| 09/30/2004 | US20040188785 Trilayered beam MEMS device and related methods |
| 09/30/2004 | US20040188782 Semiconductor device having multiple substrates |
| 09/30/2004 | US20040188124 Hermetic window assemblies and frames |
| 09/30/2004 | US20040187292 Seal for surface acoustic wave devices |
| 09/30/2004 | CA2519893A1 Electrical connections in substrates |
| 09/29/2004 | EP1461816A2 Mems device having contact and standoff bumps and related methods |
| 09/29/2004 | CN1532889A Multilayer device and its producing method |
| 09/29/2004 | CN1169236C Method of mfg. semiconductor device |
| 09/28/2004 | US6798954 Packaged optical micro-mechanical device |
| 09/28/2004 | US6798113 Flexure with integral electrostatic actuator |
| 09/28/2004 | US6797534 Method of integrating the fabrication process for integrated circuits and MEM devices |
| 09/28/2004 | US6797211 Mechanical patterning of a device layer |
| 09/23/2004 | WO2004080888A1 System and method for buried electrical feedthroughs in a glass-silicon mems process |
| 09/23/2004 | US20040183404 Manipulator |
| 09/23/2004 | US20040183395 Micro-actuator, micro-actuator device, optical switch and optical switch array |
| 09/23/2004 | US20040183214 Depositing a sacrificial layer over mechanical structure; depositing a first encapsulation layer over the sacrificial layer; forming vent through the encapsulation layer to expose portion of the sacrificial layer; removing sacrificial layer to form chamber; introducing gas into the chamber; depositing |
| 09/23/2004 | US20040183189 Multi-layer device and method for producing the same |
| 09/23/2004 | US20040183177 Methods and apparatus for attaching getters to MEMS device housings |
| 09/23/2004 | DE10330739A1 A micromechanical module with a sensor, a control-and-evaluation switch and a semiconductor chip useful for computer microprocessors and other electronic equipment involving semiconductor chips |
| 09/23/2004 | DE102004011442A1 Halbleitersensor für mechanische Grössen Semiconductor sensor for mechanical sizes |
| 09/22/2004 | EP1460038A2 Electromechanical system having a controlled atmosphere, and method of fabricating same |
| 09/22/2004 | EP1460037A1 A multi-layer device and method for producing the same |
| 09/22/2004 | EP1169891B1 Flexible microsystem and building techniques |
| 09/21/2004 | US6794746 Method of manufacturing semiconductor device, semiconductor device, narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device |
| 09/21/2004 | US6794271 Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
| 09/21/2004 | US6793974 Selecting a material for use as the expansive element |
| 09/21/2004 | US6793829 Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices |
| 09/21/2004 | US6793753 Method of making a microfabricated elastomeric valve |
| 09/21/2004 | CA2186896C Integrated chemical synthesizers |
| 09/16/2004 | WO2004080133A2 Integrated sensor and electronics package |
| 09/16/2004 | WO2004079874A1 Miniature 3-dimensional package for mems sensors |
| 09/16/2004 | WO2004055885A3 Encapsulation of mems devices using pillar-supported caps |
| 09/16/2004 | US20040180524 Shielded multi-conductor interconnect bus for MEMS |
| 09/16/2004 | US20040180464 Methods and systems for buried electrical feedthroughs in a glass-silicon mems process |
| 09/16/2004 | US20040177706 Semiconductor mechanical quantity sensor |
| 09/16/2004 | DE10351608A1 Beschleunigungssensor, der auf einer Fläche eines Halbleitersubstrats ausgebildet ist Acceleration sensor which is formed on a surface of a semiconductor substrate |
| 09/16/2004 | DE102004010907A1 Optische Vorrichtung mit Mikrolinsen-Anordnung, sowie Verfahren zu ihrer Herstellung An optical device with micro lens array, and to processes for their preparation |
| 09/15/2004 | EP1457766A1 Substrate and method of forming substrate for mems device with strain gage |
| 09/15/2004 | EP1456673A2 Micro-mechanical inertial sensors |