| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 03/24/2005 | US20050062122 Wafer-level packaging of optoelectronic devices |
| 03/24/2005 | US20050062120 Packaging microelectromechanical structures |
| 03/24/2005 | US20050061770 MEMS digital-to-acoustic transducer with error cancellation |
| 03/23/2005 | EP1517344A1 Micro-relay and method for manufacturing the same |
| 03/23/2005 | EP1516736A2 Managing bubbles in a fluid-ejection device |
| 03/23/2005 | CN1599806A Support for microelectronic, microoptoelectronic or micromechanical devices |
| 03/23/2005 | CN1599064A Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head |
| 03/23/2005 | CN1598983A T-shaped beam parallel plate micromechanical variable capacitor and manufacturing process thereof |
| 03/22/2005 | US6870259 Wafer scale fiber optic termination |
| 03/22/2005 | US6869818 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 03/22/2005 | US6868727 Semiconductor mechanical sensor |
| 03/22/2005 | CA2482165A1 Sunken electrode configuration for mems micromirror |
| 03/22/2005 | CA2482163A1 Two-step electrode for mems micromirrors |
| 03/18/2005 | CA2482099A1 Managing bubbles in a fluid-ejection device |
| 03/17/2005 | US20050058856 For use as the expansive element in a thermoelastic design, micro-electomechanical system |
| 03/17/2005 | US20050057331 Micro electro mechanical systems device, method of manufacturing the same and micro electro mechanical systems module |
| 03/17/2005 | US20050056917 Wafer level package type FBAR device and manufacturing method thereof |
| 03/17/2005 | US20050056870 Stress sensitive microchip with premolded-type package |
| 03/17/2005 | DE10316776B4 Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement A method for generating a protective cover for a component |
| 03/16/2005 | EP1454349A4 Trilayered beam mems device and related methods |
| 03/16/2005 | EP1108203B1 Micromechanical component protected against environmental influences |
| 03/15/2005 | US6867543 Microdevice assembly having a fine grain getter layer for maintaining vacuum |
| 03/15/2005 | US6867443 Parallel, individually addressable probes for nanolithography |
| 03/15/2005 | US6867060 Wafer-level packaging of electronic devices before singulation |
| 03/15/2005 | US6866067 Micro channel unit |
| 03/15/2005 | US6865944 Methods and systems for decelerating proof mass movements within MEMS structures |
| 03/10/2005 | WO2005020659A2 Microchemical method and apparatus for synthesis and coating of colloidal nanoparticles |
| 03/10/2005 | US20050054212 Sub-wavelength structures for reduction of reflective properties |
| 03/10/2005 | US20050054135 Barrier layers for microelectromechanical systems |
| 03/10/2005 | US20050054134 Method for manufacturing a microsystem |
| 03/10/2005 | US20050054133 Wafer level capped sensor |
| 03/09/2005 | EP1512176A1 Die connected with integrated circuit component |
| 03/09/2005 | EP1412087A4 Microfabricated two-pin liquid sample dispensing system |
| 03/09/2005 | EP1078287A4 Structure for micro-machine optical tooling and method for making and using |
| 03/09/2005 | CN1591023A 加速度传感器 Acceleration sensor |
| 03/09/2005 | CN1590278A Die carrier |
| 03/08/2005 | US6862938 Differential capacitive type MEMS sensor apparatus with capacitance compensator having MEMS structure |
| 03/03/2005 | WO2005001859A3 Micromechanical apparatus and method of forming a micromechanical device layer |
| 03/03/2005 | US20050048757 Method for generating a protective cover for a device |
| 03/03/2005 | US20050048688 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 03/03/2005 | US20050046044 Simple, low cost construction; reliable; plastic housing has free, open cutout for active chip area within metal frame; pressure, sound oscillation, temperature, gas detection; electrical measuring devices |
| 03/03/2005 | US20050045974 Die carrier |
| 03/03/2005 | US20050045973 Micromechanical cap structure and a corresponding production method |
| 03/03/2005 | US20050044953 Acceleration sensor |
| 03/03/2005 | DE10336091A1 Component used as a micro-acoustic component, preferably SAW or FBAR component, comprises a component body consisting of a crystalline or ceramic layer and a metallization arranged on the body |
| 03/03/2005 | DE102004033162A1 MEMS mit Drei-Wafer-Struktur MEMS with three-wafer structure |
| 03/03/2005 | DE10054964B4 Beschleunigungssensor mit einem Beschleunigungsdetektorchip in dem Durchgangsloch eines Signalverarbeitungschips auf einem Montageträger Acceleration sensor having an acceleration detector chip in the through hole of a signal processing chips on a mounting bracket |
| 03/02/2005 | EP1510825A1 Sensor package |
| 03/02/2005 | EP1510500A2 Die carrier for a MEMS with a fluid chamber |
| 03/02/2005 | CN1587023A Micro liquid drop driver based on power-on wetting of medium layer |
| 03/02/2005 | CN1586653A Piezoelectric driven array micro spray and its processing method |
| 03/02/2005 | CN1191743C Flexible microsystem and building techniques and micro photoelectric motor |
| 03/02/2005 | CN1191609C Method for patterning device layer in producing process for apparatus |
| 03/01/2005 | US6861720 Placement template and method for placing optical dies |
| 03/01/2005 | US6861332 Air gap interconnect method |
| 03/01/2005 | US6860419 Apparatus and method for controlling movement of a device after packaging |
| 02/24/2005 | WO2005017954A2 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 02/24/2005 | US20050042839 Vacuum package fabrication of integrated circuit components |
| 02/24/2005 | US20050042802 Method of fabricating an array of wafer scale polymeric caps |
| 02/24/2005 | US20050042792 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 02/24/2005 | US20050042790 Method of fabricating an integrated circuit that seals a MEMS device within a cavity |
| 02/24/2005 | US20050042117 Optical interference display panel and manufacturing method thereof |
| 02/24/2005 | US20050041278 Semiconductor device |
| 02/24/2005 | DE10332315A1 Apparatus for transporting biological fluids has contact surface, below which heaters are mounted, producing thermal gradient which moves fluid along |
| 02/24/2005 | DE10022266B4 Verfahren zum Herstellen und Verschließen eines Hohlraums für Mikrobauelemente oder Mikrosysteme und entsprechendes Mikrobauelement A method of manufacturing and closing a cavity for micro devices or systems and corresponding micro microdevice |
| 02/24/2005 | CA2535390A1 Optical detector for a particle sorting system |
| 02/23/2005 | EP1508942A1 Electrical connection device between two boards and method of use in a microelectronic component |
| 02/23/2005 | EP1508829A2 MEMS deformable mirror |
| 02/23/2005 | CN1583542A Microcooling observing and controlling system and machining method thereof |
| 02/22/2005 | US6859121 Optical deflector and electromagnetic actuator |
| 02/22/2005 | US6859119 Meso-microelectromechanical system package |
| 02/22/2005 | US6858943 Release resistant electrical interconnections for MEMS devices |
| 02/22/2005 | US6858910 A plastic land-grid array package, a ball-grid array package, and a plastic leaded package or micromechanical components are fabricated |
| 02/22/2005 | US6858541 Etch stop control for MEMS device formation |
| 02/22/2005 | US6858184 Microlaboratory devices and methods |
| 02/17/2005 | US20050036269 Vacuum-cavity MEMS resonator |
| 02/17/2005 | US20050035446 Packaged microchip with premolded-type package |
| 02/17/2005 | DE19745387B4 Halbleiter-Beschleunigungserfassungsvorrichtung Semiconductor acceleration detecting device |
| 02/17/2005 | DE10332303A1 Components retainer/holder especially for micro-electronic circuits and micro-mechanical components e.g. revs sensor, has slightly deformable zone and badly deformable zone |
| 02/17/2005 | DE102004028716A1 Halbleitervorrichtung Semiconductor device |
| 02/16/2005 | CN1580861A MEMS device and its making method and MEMS assembly |
| 02/10/2005 | US20050029827 Nano-gripper and method of producing same |
| 02/10/2005 | US20050029548 Charge control of micro-electromechanical device |
| 02/10/2005 | US20050028582 Capped microsensor |
| 02/10/2005 | DE10333189A1 Integrated microsystem manufacturing method e.g. for resonator, acceleration sensor or rotation rate sensor, has substrate provided with first function layer and structured mechanical function layer in succession |
| 02/09/2005 | EP1504236A2 Microelectromechanical system and method for determining temperature and moisture profiles within pharmaceutical packaging |
| 02/09/2005 | CN1576853A 半导体器件 Semiconductor devices |
| 02/09/2005 | CN1576229A Fluidic mems device |
| 02/08/2005 | US6853067 Microelectromechanical systems using thermocompression bonding |
| 02/08/2005 | US6852926 Packaging microelectromechanical structures |
| 02/03/2005 | WO2004071943A3 Electronic device and its manufacturing method device |
| 02/03/2005 | US20050026312 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 02/03/2005 | US20050023656 Vertical system integration |
| 02/03/2005 | US20050023629 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 02/03/2005 | US20050023547 MEMS having a three-wafer structure |
| 02/03/2005 | DE10331322A1 Elektronisches Bauelement und Verfahren zur Herstellung An electronic device and method for producing |
| 02/03/2005 | DE10329326B3 Manufacturing packages with electrical, electronic, micromechanical components or microelectromechanical systems involves providing protective wafer of ceramic, metal or plastic |
| 02/02/2005 | EP1501756A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/02/2005 | CN1572718A Semiconductor device and manufacturing method of the same |
| 02/02/2005 | CN1572717A Micro-actuator, fabrication method thereof and micro-actuating valve |