Patents for B81B 7 - Micro-structural systems (8,983)
03/2004
03/25/2004WO2004024618A1 Microdevice and manufacturing method
03/25/2004WO2003070625A3 Thin film encapsulation of mems devices
03/25/2004WO2003065050A3 Method of manufacturing an accelerometer
03/25/2004US20040059449 Selecting a material for use as the expansive element
03/25/2004US20040058476 Wafer bonding hermetic encapsulation
03/24/2004EP1400487A2 Semiconductor unit having MEMS
03/24/2004CN1143135C Miniature mechanical appts.
03/23/2004US6711024 Flexible microsystem and building techniques
03/23/2004US6710512 Microelement piezoelectric feedback type picking and releasing device
03/23/2004US6710461 Solder bumps formed on conductor plugs; damage prevention
03/23/2004US6708492 Resonant thermal out-of-plane buckle-beam actuator
03/18/2004WO2004023490A2 Fluid delivery for scanning probe microscopy
03/18/2004WO2004022477A1 Microchip with thermal stress relief means
03/18/2004WO2003090933A3 Method and structures for improved assembly of mems devices employing a centrifuge
03/18/2004WO2003084862A3 Packaging microelectromechanical structures
03/18/2004WO2003036672A3 A multi-layer 3d device and method of manufacturing
03/18/2004WO2003030252B1 Process for producing interconnects
03/18/2004US20040053434 Microelectronic mechanical system and methods
03/18/2004US20040051181 Packaging microelectromechanical structures
03/18/2004US20040050162 Semiconductor mechanical sensor
03/18/2004US20040050161 Micromechanical component and method for producing the same
03/18/2004DE10334341A1 Kaskadierte hydrodynamische Fokussierung in Mikrofluidikkanälen Cascaded hydrodynamic focusing in microfluidic channels
03/17/2004EP1398831A2 Air gaps formation
03/17/2004EP1398297A2 Electronic component with carbon nanotube interconnects and method of manufacturing the same
03/17/2004CN1482369A Cascaded hydrodynamic focusing in microfluidic channels
03/16/2004US6707176 Non-linear actuator suspension for microelectromechanical systems
03/16/2004US6706619 Method for tiling unit cells
03/16/2004US6706549 Multi-functional micro electromechanical devices and method of bulk manufacturing same
03/16/2004US6706548 Method of making a micromechanical device
03/11/2004WO2004021398A2 Wafer-level seal for non-silicon-based devices
03/11/2004WO2004021382A2 Micro-electromechanical switch performance enhancement
03/11/2004WO2004020961A1 Hermetic packaging
03/11/2004WO2004020329A1 Microelectromechanical system comb actuator and manufacturing method thereof
03/11/2004US20040046837 Systems and methods for microelectromechanical system based fluid ejection
03/11/2004US20040046248 Microsystem packaging and associated methods
03/11/2004US20040046245 Microelectromechanical system package with environmental and interference shield
03/11/2004US20040046223 Semiconductor component
03/11/2004DE10238843A1 Semiconductor component used in opto-electronic communications comprises a Peltier element for cooling a micro-structure and a thermal generator coupled together via a coupling unit
03/10/2004EP1396470A2 Fabrication of microstructures with vacuum-sealed cavity
03/10/2004CN1481000A Base plate with minitype connection components and its preparation method
03/10/2004CN1480981A Electronic component and its mfg. method
03/09/2004US6704131 MEMS enclosure
03/09/2004US6703679 Low-resistivity microelectromechanical structures with co-fabricated integrated circuit
03/09/2004US6703675 Particle filter for partially enclosed microelectromechanical systems
03/09/2004US6703203 Integrated microarray devices
03/09/2004US6701779 Perpendicular torsion micro-electromechanical switch
03/04/2004WO2004019402A1 Electrical component
03/04/2004WO2004019048A1 Micromechanical component
03/04/2004US20040043506 Apparatus associated with fluid transport phenomena as well as controlling fluid flow and accurate localization of particles in miniaturized systems
03/04/2004US20040042213 Light modulating device and exposure apparatus using the same
03/04/2004US20040041254 Packaged microchip
03/04/2004US20040041248 Packaged microchip with isolation
03/04/2004US20040041154 Nonconductor substrate enclosing carbon nanotubes; electrodes
03/04/2004US20040041010 Exothermic processing
03/04/2004US20040040828 Micro-electromechanical switch performance enhancement
03/03/2004EP1394826A2 Micro-relay and method for manufacturing the same
03/03/2004EP1394100A2 Apparatus and method for controlling movement of a device after packaging
03/02/2004US6700173 Electrically isolated support for overlying MEM structure
03/02/2004US6699394 Micromachined parylene membrane valve and pump
02/2004
02/26/2004WO2003107397A3 Microelectromechanical system and method for determining temperature and moisture profiles within pharmaceutical packaging
02/26/2004WO2003106927A3 Passive temperature compensation technique for mems devices
02/26/2004US20040037956 Vapor deposition a silane coupling agent on electronics, under control pressure in vacuum chamber; preventing non-uniform coatings
02/26/2004US20040036455 Microenergy device for producing mechanically modulated microenergy output from digital microenergy output from digital microenergy input
02/26/2004US20040036173 Particle filter for microelectromechanical systems
02/26/2004US20040036133 Particle filter for partially enclosed microelectromechanical systems
02/26/2004US20040035481 Micro channel unit
02/26/2004US20040035205 Electrically isolated support for overlying mem structure
02/25/2004EP1391420A2 Method and apparatus for protecting wiring and integrated circuit device
02/25/2004EP1391419A1 Gripper and method of manufacturing the gripper
02/25/2004EP1391241A1 The use of microfluidic systems in the electrochemical detection of target analytes
02/25/2004EP1390793A2 Pivoting optical micromirror, array for such micromirrors and method for making same
02/25/2004CN1477655A Floating structure radio-frequency microinductor and its production process
02/25/2004CN1477054A Microstructure manufacture and microsystem integration
02/24/2004US6696645 On-wafer packaging for RF-MEMS
02/24/2004US6696343 Micro-electromechanical varactor with enhanced tuning range
02/19/2004WO2004015764A2 Vertical system integration
02/19/2004WO2003016206A3 System and method for precise positioning of microcomponents
02/19/2004WO2002068320A3 Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture
02/19/2004US20040033404 Fuel-cell element stack with stress relief and methods
02/19/2004US20040032012 Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator
02/19/2004DE10235372A1 Electrical component, especially micromechanical silicon chip, has layer transparency enabling welding with laser beam with power density in joining plane increased to melt layers by absorption
02/18/2004EP1389307A2 Sensor arrangement, in particular micro-mechanical sensor arrangement
02/14/2004CA2437202A1 Mems-based fuel cell and methods
02/12/2004WO2004013698A1 High-density interconnection of temperature sensitive electronic devices
02/12/2004WO2004013039A2 Low temperature plasma si or sige for mems applications
02/12/2004WO2004013038A2 Etch stop control for mems device formation
02/12/2004WO2003042094A3 Multi-chip module integrating mems mirror array with electronics
02/12/2004WO2003016205A3 Mems and method of manufacturing mems
02/12/2004US20040029360 Wafer-level package with silicon gasket
02/12/2004US20040028849 Low temperature method for forming a microcavity on a substrate and article having same
02/12/2004US20040027701 Optical multilayer structure and its production method, optical switching device, and image display
02/12/2004US20040027218 Latching micro magnetic relay packages and methods of packaging
02/12/2004US20040027034 Piezoelectric actuator array and manufacturing method
02/12/2004DE10235370A1 Micromechanical component especially an acceleration sensor for motor vehicles, has spring with non linear response for reduced sensitivity at high accelerations
02/11/2004CN1137999C Integrated microarray device
02/05/2004WO2004011368A2 Low temperature anodic bonding method using focused energy for assembly of micromachined systems
02/05/2004WO2003062136A3 Method and system for locally connecting microstructures
02/05/2004US20040023433 High-density interconnection of temperature sensitive electronic devices
02/05/2004US20040023429 Low temperature plasma Si or SiGe for MEMS applications
02/05/2004US20040023424 Etch stop control for MEMS device formation
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