| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 05/17/2005 | US6892582 Semiconductor pressure sensor and pressure sensing device |
| 05/17/2005 | US6892577 Acceleration sensor formed on surface of semiconductor substrate |
| 05/12/2005 | WO2005043173A1 Trapped charge field bias vibrating beam accelerometer |
| 05/12/2005 | WO2005042401A1 Method and device for secure, insulated and electrically conductive assembling of treated semiconductor wafers |
| 05/12/2005 | WO2004068189A3 Hermetic window assemblies and frames |
| 05/12/2005 | US20050101161 Sensor module |
| 05/12/2005 | US20050101139 System and method for producing a reduced substrate micro-electro-mechanical systems (MEMS) device |
| 05/12/2005 | US20050101048 Self-shadowing MEM structures |
| 05/12/2005 | US20050101040 Method of forming a through-substrate interconnect |
| 05/12/2005 | US20050100748 Ultra-hard low friction coating based on AlMgB14 for reduced wear of MEMS and other tribological components and system |
| 05/12/2005 | US20050099671 Optical deflector array |
| 05/12/2005 | DE10352528B3 Micro-electromechanical system device e.g. for ultrasonic diagnostic imaging apparatus, communicating with transmission and/or reception transducer provided by support substrate component |
| 05/12/2005 | CA2543736A1 Method and device for secure, insulated and electrically conductive assembling of treated semiconductor wafers |
| 05/11/2005 | EP1529217A1 Micromechanical component |
| 05/11/2005 | EP1529013A2 Etch stop control for mems device formation |
| 05/10/2005 | US6891278 Semiconductor component |
| 05/10/2005 | US6891239 Package including substrate, microelectromechanical sensor die bonded to one side, electronic chips bonded to opposite side, internal electrical connections running from sensor die through substrate to chips, and input/output connections |
| 05/10/2005 | US6890834 Electronic device and method for manufacturing the same |
| 05/06/2005 | WO2004095508A3 Meso-microelectromechanical system package |
| 05/05/2005 | US20050096878 Micro-electromechanical switch performance enhancement |
| 05/05/2005 | US20050095143 Pumping apparatus using thermal transpiration micropumps |
| 05/05/2005 | US20050094944 Optical fiber terminator package |
| 05/05/2005 | US20050093398 Generator for use with a micro system having dual diaphragms |
| 05/05/2005 | US20050093134 Device packages with low stress assembly process |
| 05/04/2005 | EP1528609A2 Generator for use with a micro system having dual diaphragms |
| 05/04/2005 | CN1613154A MEMS device having contact and standoff bumps and related methods |
| 05/04/2005 | CN1613128A MEMS device having a trilayered beam and related methods |
| 05/03/2005 | US6888256 Compliant relief wafer level packaging |
| 05/03/2005 | US6888233 Systems for buried electrical feedthroughs in a glass-silicon MEMS process |
| 04/28/2005 | WO2005038422A1 Surface mount package and method for forming multi-chip microsensor device |
| 04/28/2005 | WO2005038418A2 Integrated spectroscopy system |
| 04/28/2005 | WO2005006432A3 Electronic component and method for production thereof |
| 04/28/2005 | US20050088765 Self-shadowing MEM structures |
| 04/28/2005 | US20050087826 Self-shadowing MEM structures |
| 04/28/2005 | US20050087756 Light transmissive cover, device provided with same and methods for manufacturing them |
| 04/28/2005 | US20050087356 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
| 04/27/2005 | CN1610087A Micro-mechanical chip testing card and producing method thereof |
| 04/27/2005 | CN1608686A Air bag controlled micro medicine conveying executor |
| 04/27/2005 | CN1199154C Micro driving unit having balanced dynamic characteristic |
| 04/26/2005 | US6884650 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 04/26/2005 | CA2368129C Micromachined electrostatic actuator with air gap |
| 04/21/2005 | WO2005036698A2 Microelectromechanical system package with environmental and interference shield |
| 04/21/2005 | US20050084998 Methods and systems for providing MEMS devices with a top cap and upper sense plate |
| 04/21/2005 | US20050083533 Integrated spectroscopy system |
| 04/20/2005 | EP1523463A2 Diamondoid-based components in nanoscale construction |
| 04/20/2005 | CN1607682A Wafer-level packaging of optoelectronic devices |
| 04/19/2005 | US6882264 Electrothermal self-latching MEMS switch and method |
| 04/14/2005 | WO2004082363A3 Sensor assembly and methods of making and using same |
| 04/14/2005 | WO2004074168A3 Packaged microchip with thermal stress relief |
| 04/14/2005 | US20050079684 Method of manufacturing an accelerometer |
| 04/14/2005 | US20050078920 Micro optical communication device package |
| 04/14/2005 | US20050078348 Structure of a micro electro mechanical system and the manufacturing method thereof |
| 04/14/2005 | US20050077612 Bond ring for micro-electromechanical system |
| 04/14/2005 | US20050077285 Device for homogeneous heating of an object |
| 04/14/2005 | US20050076719 Capacitive sensor |
| 04/14/2005 | DE10216267B4 Verfahren zum Herstellen eines Gehäuses für einen Chip mit einer mikromechanischen Struktur A method of manufacturing a housing for a chip with a micro-mechanical structure |
| 04/14/2005 | DE102004001892A1 Wafer level package type film bulk acoustic resonator device for wireless communication device, has internal electrodes provided on substrate as external electrodes without separately processing external electrodes |
| 04/13/2005 | EP1522521A1 Capacitive sensor |
| 04/13/2005 | EP1522095A2 Method for producing a component having submerged connecting areas |
| 04/13/2005 | CN1605560A Capacitive sensor |
| 04/13/2005 | CN1197170C Semiconductor structure and its producing method |
| 04/12/2005 | US6879147 Package with environmental control material carrier |
| 04/12/2005 | US6879088 Insertion-type liquid metal latching relay array |
| 04/12/2005 | US6879048 Glass frit wafer bonding process and packages formed thereby |
| 04/12/2005 | US6879035 Vacuum package fabrication of integrated circuit components |
| 04/12/2005 | US6879016 Microcomponent having intra-layer electrical isolation with mechanical robustness |
| 04/12/2005 | US6878638 Multi-level integrated circuit for wide-gap substrate bonding |
| 04/12/2005 | US6878626 TiW platinum interconnect and method of making the same |
| 04/12/2005 | US6878566 Method of reinforcing a mechanical microstructure |
| 04/12/2005 | US6877209 Method for sealing an active area of a surface acoustic wave device on a wafer |
| 04/07/2005 | WO2005030635A1 Surface micromachined mems device with structure and circuitry |
| 04/07/2005 | US20050075572 Focusing micromachined ultrasonic transducer arrays and related methods of manufacture |
| 04/07/2005 | US20050074919 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 04/07/2005 | US20050073735 MEMS device and method of forming MEMS device |
| 04/07/2005 | DE102004028927A1 Beschleunigungssensor Acceleration sensor |
| 04/06/2005 | EP1520622A1 Method and apparatus for controlling the flow resistance of a fluid on nanostructured or microstructured surfaces |
| 04/06/2005 | EP1301346A4 Buckle resistant thermal bend actuators |
| 04/06/2005 | CN1603883A Microelectromechanical system and method for fabricating the same |
| 04/06/2005 | CN1603765A Soft-magnetic multilayer film force-sensitive sensor and preparation method thereof |
| 04/06/2005 | CN1603226A Method and apparatus for controlling the flow resistance of a fluid on nanostructured or microstructured surfaces |
| 04/05/2005 | US6876482 MEMS device having contact and standoff bumps and related methods |
| 04/05/2005 | US6876071 Masking layer in substrate cavity |
| 04/05/2005 | US6876048 Micromechanical component as well as a method for producing a micromechanical component |
| 04/05/2005 | US6876047 MEMS device having a trilayered beam and related methods |
| 04/05/2005 | US6875257 Particle filter for microelectromechanical systems |
| 04/05/2005 | US6874363 Trapped charge field bias vibrating beam accelerometer |
| 03/31/2005 | WO2005029555A2 Nanostructure augmentation of surfaces for enhanced thermal transfer |
| 03/31/2005 | WO2005028549A2 Nano-composite materials for thermal management applications |
| 03/31/2005 | US20050069458 Apparatus wherein closed-cell nanostructured surface is used in a way such that when pressure of first fluid within cells of surface is decreased to or below a desired level, a droplet disposed on that surface is caused to partially penetrate surface; achieves desired level of flow resistance |
| 03/31/2005 | US20050067666 Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device |
| 03/31/2005 | US20050067633 Microelectromechanical system and method for fabricating the same |
| 03/31/2005 | US20050067179 Hermetically sealed micro-device package with window |
| 03/31/2005 | CA2539692A1 Medical device having mems functionality and methods of making same |
| 03/30/2005 | EP1461816A4 Mems device having contact and standoff bumps and related methods |
| 03/30/2005 | CN1602439A Aperture edge in a digital micromirror housing |
| 03/29/2005 | US6872984 Method of sealing a hermetic lid to a semiconductor die at an angle |
| 03/29/2005 | US6872902 MEMS device with integral packaging |
| 03/24/2005 | WO2005026040A2 Wafer level capped sensor |
| 03/24/2005 | US20050064644 Process for producing microelectromechanical components and a housed microelectromechanical component |
| 03/24/2005 | US20050062814 Managing bubbles in a fluid-ejection device |