| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 09/13/2005 | US6943495 Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same |
| 09/13/2005 | US6943419 Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
| 09/13/2005 | US6942771 Microfluidic systems in the electrochemical detection of target analytes |
| 09/09/2005 | CA2556492A1 Implant having mems flow module with movable, flow-controlling baffle |
| 09/08/2005 | US20050196933 Single crystal silicon sensor with additional layer and method of producing the same |
| 09/08/2005 | US20050194685 Method for mounting semiconductor chips and corresponding semiconductor chip system |
| 09/08/2005 | US20050194677 Hermetically sealed package for optical, electronic, opto-electronic and other devices |
| 09/08/2005 | US20050194662 Semiconductor component and micromechanical structure |
| 09/07/2005 | EP1571704A1 Method for depositing a solder material on a substrate in the form of a predetermined pattern |
| 09/07/2005 | EP1234326A4 Integrated packaging of micromechanical sensors and associated control circuits |
| 09/07/2005 | CN1664523A Method for making nano-scaled micro temperature sensor |
| 09/06/2005 | US6940260 Microenergy device for producing mechanically modulated microenergy output from digital microenergy input |
| 09/06/2005 | US6939784 Wafer scale package and method of assembly |
| 09/06/2005 | US6939734 Method for producing a protective cover for a device |
| 09/06/2005 | US6939451 Substrate having channel and aperture in fluid communication with channel, cover bonded to substrate such that reservoir is formed at aperture, electroconducting ink pattern on substrate or cover to make electrical contact with test material |
| 09/06/2005 | US6938486 Semiconductor mechanical sensor |
| 09/01/2005 | WO2005081288A2 Mechanical sensor with pyramid socket suspension |
| 09/01/2005 | WO2005057437A3 A system and method for three-dimensional visualization and postprocessing of a system model |
| 09/01/2005 | US20050191790 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 09/01/2005 | US20050191789 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 09/01/2005 | US20050190023 Micro-switching element fabrication method and micro-switching element |
| 09/01/2005 | US20050189635 Packaged acoustic and electromagnetic transducer chips |
| 09/01/2005 | US20050189622 Packaged acoustic and electromagnetic transducer chips |
| 09/01/2005 | DE102004020685B3 Getter layer for use in IR sensor is installed on inside surface of sensor cap, and has gap through which IR passes to absorber and signal-generating layer |
| 09/01/2005 | DE102004002908A1 Halbleiterbauelement sowie mikromechanische Struktur Semiconductor device and micro-mechanical structure |
| 08/31/2005 | CN1661769A Micro-switching element fabrication method and micro-switching element |
| 08/30/2005 | US6937131 Self-shadowing MEM structures |
| 08/30/2005 | US6936950 Micro-actuator utilizing electrostatic and Lorentz forces, and micro-actuator device, optical switch and optical switch array using the same |
| 08/30/2005 | US6936918 MEMS device with conductive path through substrate |
| 08/30/2005 | US6936902 Sensor with at least one micromechanical structure and method for production thereof |
| 08/30/2005 | US6936494 Processes for hermetically packaging wafer level microscopic structures |
| 08/30/2005 | US6936491 Method of fabricating microelectromechanical systems and devices having trench isolated contacts |
| 08/30/2005 | CA2384072C Imaging technique for use with optical mems devices |
| 08/25/2005 | WO2005078458A1 Capped sensor |
| 08/25/2005 | WO2005077817A1 Wafer packaging and singulation method |
| 08/25/2005 | WO2005000733A3 Integrated circuit on high performance chip |
| 08/25/2005 | US20050186703 Method for packaging semiconductor chips and corresponding semiconductor chip system |
| 08/25/2005 | US20050185812 Miniature silicon condenser microphone and method for producing the same |
| 08/25/2005 | US20050185248 Microelectromechanical device packages with integral heaters |
| 08/25/2005 | US20050184822 Reference oscillator frequency stabilization |
| 08/25/2005 | US20050183609 Micromechanical latching switch |
| 08/25/2005 | DE102005006156A1 Sensor für eine physikalische Größe, welcher einen Sensorchip und einen Schaltungschip aufweist Sensor for a physical quantity that has a sensor chip and a circuit chip |
| 08/25/2005 | DE102004033475A1 Corrosion protection for micromechanical sensor elements, e.g. for a pressure sensor, comprises a passivating agent that at least partially covers electrical components and a material layer applied to the top of the passivator |
| 08/24/2005 | EP1565932A2 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 08/24/2005 | CN1659684A Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/24/2005 | CN1657290A Ink-jet printing head with isolated nozzle controller |
| 08/23/2005 | US6934439 Piano MEMs micromirror |
| 08/23/2005 | US6933163 Fabricating integrated micro-electromechanical systems using an intermediate electrode layer |
| 08/23/2005 | US6931928 Microstructure with movable mass |
| 08/18/2005 | WO2005076679A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 08/18/2005 | WO2005076480A1 Reference oscillator frequency stabilization |
| 08/18/2005 | WO2005076247A1 Mechanical structure including a layer of polymerised liquid crystal and method of manufacturing such |
| 08/18/2005 | WO2005076246A1 Mechanical shutter with polymerised liquid crystal layer |
| 08/18/2005 | WO2005028549A3 Nano-composite materials for thermal management applications |
| 08/18/2005 | US20050181658 Microconnectors and non-powered microassembly therewith |
| 08/18/2005 | US20050181636 Sockets for microassembly |
| 08/18/2005 | US20050181532 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/18/2005 | US20050180686 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/18/2005 | US20050179982 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/18/2005 | US20050178204 Pyramid socket suspension |
| 08/18/2005 | US20050178203 Physical quantity sensor having sensor chip and circuit chip |
| 08/18/2005 | DE102004005255A1 Verfahren zum Anordnen einer Leitungsstruktur auf einem Substrat und Substrat mit der Leitungsstruktur A method of disposing a line structure on a substrate and substrate with the conduit structure |
| 08/17/2005 | EP1564183A2 Microconnectors and non-powered microassembly therewith |
| 08/17/2005 | CN1654925A Physical quantity sensor having sensor chip and circuit chip |
| 08/17/2005 | CN1654310A Microconnectors and non-powered microassembly therewith |
| 08/17/2005 | CN1654215A Ink-jetting printing head with nozzle assembly array |
| 08/17/2005 | CN1215377C Device for homogeneous heating of an object |
| 08/16/2005 | US6930368 MEMS having a three-wafer structure |
| 08/16/2005 | US6930364 Microelectronic mechanical system and methods |
| 08/11/2005 | WO2005050257A8 High temperature imaging device |
| 08/11/2005 | WO2004107829A3 A novel packaging method for microstructure and semiconductor devices |
| 08/11/2005 | US20050176212 MEMS device and method of forming MEMS device |
| 08/11/2005 | US20050176166 Wafer packaging and singulation method |
| 08/11/2005 | US20050173711 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/11/2005 | DE102005002990A1 Fluid channel system for use in analysis of human blood serum comprises cartridge, into which support for biochip fits, cartridge being made up of two plates and fluid channels being formed by surface where they contact each other |
| 08/11/2005 | DE102004003413A1 Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung A method of packaging a semiconductor chip and corresponding semiconductor chip assembly |
| 08/11/2005 | CA2554240A1 Crystal forming devices and systems and methods for making and using the same |
| 08/10/2005 | EP1561243A1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates |
| 08/10/2005 | EP1358489A4 Accelerometer protected by caps applied at the wafer scale |
| 08/10/2005 | CN1652995A Silicon carbide microelectromechanical devices with electronic circuitry |
| 08/09/2005 | US6927482 Surface mount package and method for forming multi-chip microsensor device |
| 08/09/2005 | US6927098 Methods and apparatus for attaching MEMS devices to housing |
| 08/09/2005 | US6925875 Packaged accelerometer |
| 08/04/2005 | WO2005070817A2 Methods and systems for providing mems devices with a top cap and upper sense plate |
| 08/04/2005 | WO2005070675A1 Inkjet printer system with removable cartridge |
| 08/04/2005 | US20050170656 Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity |
| 08/04/2005 | US20050170614 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/04/2005 | US20050170609 Conductive bond for through-wafer interconnect |
| 08/04/2005 | US20050170560 Method of manufacturing an electronic device |
| 08/04/2005 | US20050170557 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/04/2005 | US20050170547 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/04/2005 | US20050170546 Metod for making a micromechanical device by using a sacrificial substrate |
| 08/04/2005 | US20050170540 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/04/2005 | US20050168793 Drive circuit of switch and relay circuit |
| 08/04/2005 | US20050168306 MEMS device with integral packaging |
| 08/04/2005 | US20050168224 Receiver electronics proximate antenna |
| 08/04/2005 | US20050168103 Wafer-level seal for non-silicon-based devices |
| 08/04/2005 | US20050167795 Electronic devices and its production methods |
| 08/04/2005 | US20050166677 Vertically integrated MEMS structure with electronics in a hermetically sealed cavity |
| 08/04/2005 | CA2541201A1 Methods and systems for providing mems devices with a top cap and upper sense plate |