Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
11/2005
11/01/2005US6960488 Method of fabricating a microfabricated high aspect ratio device with electrical isolation
11/01/2005US6959583 Passive temperature compensation technique for MEMS devices
10/2005
10/27/2005US20050237598 Laminated package
10/27/2005US20050236644 Sensor packages and methods of making the same
10/26/2005EP1587698A2 Integrated pressure and acceleration measurement device and a method of manufacture thereof
10/26/2005CN1689227A Micro-electromechanical varactor with enhanced tuning range
10/26/2005CN1689166A Wafer-level seal for non-silicon-based devices
10/25/2005US6958531 Multi-substrate package and method for assembling same
10/25/2005US6958529 Acceleration sensor and method of manufacture thereof
10/25/2005US6958285 Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings
10/20/2005WO2005097668A1 System and method for direct-bonding of substrates
10/20/2005WO2005038418A3 Integrated spectroscopy system
10/20/2005US20050233518 Electronic circuit device having silicon substrate
10/20/2005US20050230767 Fabrication and integration of polymeric bioMEMS
10/20/2005US20050230708 Sensor with at least one micromechanical structure, and method for producing it
10/20/2005US20050229711 Capacitive pressure sensor and method of manufacture
10/18/2005US6956283 Encapsulants for protecting MEMS devices during post-packaging release etch
10/18/2005US6956274 TiW platinum interconnect and method of making the same
10/18/2005US6955950 Method for generating a protective cover for a device
10/13/2005WO2005047558A3 Process for manufacturing devices which require a non evaporable getter material for their working
10/13/2005US20050227413 Method for depositing a solder material on a substrate
10/13/2005US20050227400 Encapsulation wafer process
10/13/2005US20050226742 Microfabricated elastomeric valve and pump systems
10/13/2005US20050224975 High density nanostructured interconnection
10/13/2005US20050224155 System and method for direct-bonding of substrates
10/13/2005US20050223827 Microelectromechanical system and method for determning temperature and moisture profiles within pharmaceutical packaging
10/12/2005EP1584105A2 Encapsulation of mems devices using pillar-supported caps
10/12/2005CN1681108A Electronic circuit device having silicon substrate
10/12/2005CN1680186A Interlaced array of piano mems micromirrors
10/12/2005CN1222972C Electronic parts
10/11/2005US6953990 Wafer-level packaging of optoelectronic devices
10/11/2005US6953985 Wafer level MEMS packaging
10/11/2005US6953982 Flexible skin incorporating MEMS technology
10/11/2005US6953268 Light modulating device and exposure apparatus using the same
10/11/2005US6952965 Vertical MEMS gyroscope by horizontal driving
10/06/2005WO2005092783A1 Vacuum sealed microdevice packaging with getters
10/06/2005WO2005092782A1 Single crystal silicon sensor with additional layer and method of producing the same
10/06/2005WO2005081288A3 Mechanical sensor with pyramid socket suspension
10/06/2005US20050221528 Microelectronic mechanical system and methods
10/06/2005US20050218488 Electronic component having micro-electrical mechanical system
10/06/2005CA2557740A1 Vacuum sealed microdevice packaging with getters
10/05/2005EP1583146A2 High density nanostructured interconnection
10/05/2005EP1582499A2 Encapsulation wafer process
10/05/2005CN1679130A Micro-electromechanical switch performance enhancement
10/05/2005CN1678513A Microchip with thermal stress relief means
10/05/2005CN1677706A Method and means for isolating elements of a sensor array
10/05/2005CN1677705A Electronic component, electronic component module and mfg. method for said electronic component
10/05/2005CN1222024C Method for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
10/04/2005US6952042 Microelectromechanical device with integrated conductive shield
10/02/2005CA2501012A1 Interlaced array of piano mems micromirrors
09/2005
09/29/2005WO2005090228A1 Flip chip bonded micro-electro-mechanical system (mems) device
09/29/2005US20050214976 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
09/29/2005US20050214969 Method for forming a chamber in an electronic device and device formed thereby
09/29/2005US20050214933 Ultrasonic micromixer with radiation perpendicular to mixing interface
09/29/2005US20050214661 Structure formed with template having nanoscale features
09/29/2005US20050214635 Microbattery and systems using microbattery
09/29/2005US20050213878 Microactuator device and optical switching system using the same
09/29/2005US20050212067 Microelectromechanical devices with lubricants and getters formed thereon
09/29/2005US20050211559 Use of microfluidic systems in the electrochemical detection of target analytes
09/29/2005DE10353767B4 Vorrichtung zur Häusung einer mikromechanischen Struktur und Verfahren zur Herstellung derselben An apparatus for package features a micromechanical structure and method of manufacturing the same
09/29/2005DE102004028888A1 Electronic component, especially regulator or micromechanical sensor element for automobiles, with gel layer of specific hardness for protecting circuitry against corrosion, temperature and vibration
09/29/2005DE102004011203A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
09/28/2005EP1580596A2 Structure formed with template having nanoscale features
09/28/2005EP1580161A1 Method for forming a chamber in an electronic device and device formed thereby
09/28/2005CN2729035Y Low-threshold direct DC separatable microelectronic mechanical switch
09/28/2005CN1675127A Etch stop control for MEMS device formation
09/28/2005CN1675126A Low temperature plasma Si or SiGe for MEMS applications
09/28/2005CN1675125A MEMS array, manufacturing method thereof, and MEMS device manufacturing method based on the same
09/28/2005CN1675124A Microelectromechanical device with integrated conductive shield
09/28/2005CN1673723A Dynamic stress testing method for micro-electromechanical system
09/28/2005CN1672929A Method for forming a chamber in an electronic device and device formed thereby
09/27/2005US6950596 Variable optical attenuator
09/27/2005US6949807 Signal routing in a hermetically sealed MEMS device
09/27/2005US6949217 Use of infrared radiation in molding of protective caps
09/22/2005WO2005088710A1 Device comprising a semiconductor chip and a microfluidic system, and method for the production thereof
09/22/2005US20050208739 Methods and apparatus for attaching getters to MEMS device housings
09/22/2005US20050206987 Mirror rocking member for optical deflector
09/22/2005US20050206986 Micro-actuator utilizing electrostatic and lorentz forces, and micro-actuator device, optical switch and optical switch array using the same
09/22/2005US20050205959 Capped sensor
09/22/2005US20050205951 Flip chip bonded micro-electromechanical system (MEMS) device
09/22/2005DE102004010499A1 Mikrostrukturierter Sensor Micro-structured sensor
09/21/2005EP1576690A2 Meso-microelectromechanical system package
09/21/2005EP1454333A4 Mems device having a trilayered beam and related methods
09/21/2005EP1428255A4 Microelectronic mechanical system and methods
09/21/2005CN1669905A Minisize circulating flow passage device made by lead frame
09/20/2005US6947719 Nano-electromechanical filter
09/20/2005US6946742 isolator modulus of elasticity has a relationship with the package modulus of elasticity and this relationship causes no more than a negligible thermal stress to be transmitted to the microchip
09/20/2005US6946366 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
09/20/2005US6946326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
09/20/2005US6944941 Method for assembling cassette-loaded microcomponents
09/15/2005WO2005086532A2 Packaged acoustic and electromagnetic transducer chips
09/15/2005WO2005085808A1 Micro-structured sensor
09/15/2005WO2005085126A1 Hermetically sealed package for optical, electronic, opto-electronic and other devices
09/15/2005US20050202594 Vacuum sealed microdevice packaging with getters
09/15/2005US20050199971 Integrated sensor and electronics package
09/15/2005DE10393265T5 Mikrovorrichtung und Verfahren zu deren Herstellung A micro-device and process for their preparation
09/14/2005EP1575084A2 Method for depositing a solder material on a substrate
09/14/2005EP1574475A2 Integrated driver electronics for MEMS device using high voltage thin film transistors
09/14/2005EP1573272A2 Methods and systems for decelarating proof mass movements within mems structures
09/14/2005EP1572575A2 Encapsulated microstructure and method of producing one such microstructure
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