| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 12/27/2005 | US6979597 Wafer-level package with silicon gasket |
| 12/27/2005 | US6979585 Micro-electromechanical system |
| 12/25/2005 | CA2747236A1 Shape-acceleration measurement device and method |
| 12/22/2005 | WO2005122194A1 Microfabricated system for magnetic field generation and focusing |
| 12/22/2005 | WO2005121018A1 Vent closing method and the use of an ultrasonic bonding machine for carrying out said method |
| 12/22/2005 | WO2005076679A3 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 12/22/2005 | WO2004055885A8 Encapsulation of mems devices using pillar-supported caps |
| 12/22/2005 | US20050280331 Two-axis device and manufacturing method therefor |
| 12/22/2005 | US20050280106 MEMS structure and method for fabricating the same |
| 12/22/2005 | US20050279166 Semiconductor acceleration sensor device and method for manufacturing the same |
| 12/22/2005 | DE102004038093A1 Anordnung eines mikrooptischen Bauelements auf einem Substrat, Verfahren zur Justierung der Anordnung und optisches System mit der Anordnung Arrangement of a microoptical component on a substrate, method for adjusting the arrangement and optical system having the arrangement |
| 12/22/2005 | DE102004027501A1 Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren Micromechanical component having a plurality of cavities and methods of manufacture |
| 12/21/2005 | EP1607781A2 Assembly of micro-optical elements on a substrate, method for adjusting the assembly and optical system comprising the assembly |
| 12/21/2005 | EP1606840A1 Wafer scale package and method of assembly |
| 12/21/2005 | CN1711623A Method for producing and testing a corrosion-resistant channel in a silicon device |
| 12/21/2005 | CN1710427A Semiconductor acceleration sensor device and method for manufacturing the same |
| 12/21/2005 | CN1232343C Devices and methods for carrying out chemical reactions using photobiological reagents |
| 12/20/2005 | US6977461 System and method for moving an object employing piezo actuators |
| 12/20/2005 | US6977189 Wafer scale caps located by molding |
| 12/15/2005 | WO2005118464A1 Microelectromechanical systems (mems) devices integrated in a hermetically sealed package |
| 12/15/2005 | WO2005118463A1 Micromechanical component with a number of chambers and production method |
| 12/15/2005 | WO2004106221A3 Microelectromechanical device packages with integral heaters |
| 12/15/2005 | US20050276542 Arrangement of a micro-optical component on a substrate, a method for adjustment of the arrangement, and an optical system with the arrangement |
| 12/15/2005 | US20050275497 Microfabricated system for magnetic field generation and focusing |
| 12/15/2005 | US20050275079 Wafer-level hermetic micro-device packages |
| 12/15/2005 | US20050275075 Micro-electro-mechanical system (MEMS) package with spacer for sealing and method of manufacturing the same |
| 12/14/2005 | EP1604399A1 Methods and apparatus for attaching getters inside mems device housing |
| 12/14/2005 | EP1499560B1 Device for protecting a chip and method for operating a chip |
| 12/13/2005 | US6973844 Semiconductor mechanical quantity sensor |
| 12/08/2005 | WO2005117090A1 Integrated circuit with impurity barrier |
| 12/08/2005 | US20050269688 Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package |
| 12/08/2005 | US20050269687 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
| 12/08/2005 | DE102004005255B4 Verfahren zum Anordnen einer Leitungsstruktur mit Nanoröhren auf einem Substrat A method of disposing a line structure with nanotubes on a substrate |
| 12/07/2005 | EP1602896A2 Gyro-sensor comprising a plurality of component units, and fabricating method thereof |
| 12/07/2005 | EP1602625A1 Semiconductor module with a semiconductor sensor and a plastic package and its method of fabrication. |
| 12/07/2005 | EP1602124A2 Micromachined assembly with a multi-layer cap defining cavity |
| 12/07/2005 | EP1601611A1 System and method for buried electrical feedthroughs in a glass-silicon mems process |
| 12/06/2005 | US6973365 System and method for handling microcomponent parts for performing assembly of micro-devices |
| 12/01/2005 | WO2005020659A3 Microchemical method and apparatus for synthesis and coating of colloidal nanoparticles |
| 12/01/2005 | US20050263838 Semiconductor dynamic quantity sensor |
| 12/01/2005 | US20050262941 Gyro-sensor comprising a plurality of component units, and fabricating method thereof |
| 12/01/2005 | US20050262929 Wafer level capped sensor |
| 12/01/2005 | DE10246101B4 Verfahren zum Herstellen eines Gehäuses für einen Chip mit einer mikromechanischen Struktur A method of manufacturing a housing for a chip with a micro-mechanical structure |
| 11/30/2005 | EP1360714A4 Wafer scale fiber optic termination |
| 11/30/2005 | EP1292450A4 Ink jet printhead nozzle array |
| 11/30/2005 | CN1703369A Microactuator device and optical switching system using the same |
| 11/29/2005 | US6969667 Electrical device and method of making |
| 11/29/2005 | US6969639 Wafer level hermetic sealing method |
| 11/29/2005 | US6969635 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 11/29/2005 | US6969630 Method of making an integrated electromechanical switch and tunable capacitor |
| 11/24/2005 | WO2005110915A1 Reduction of etching charge damage in manufacture of microelectromechanical devices |
| 11/24/2005 | WO2005110914A1 Modifying the electro-mechanical behavior of micromachined devices |
| 11/24/2005 | US20050260793 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 11/24/2005 | US20050260792 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 11/24/2005 | US20050258516 Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same |
| 11/23/2005 | EP1597761A2 Packaged microchip with thermal stress relief |
| 11/23/2005 | CN1701438A Packaged microchip |
| 11/17/2005 | WO2005109009A1 Micromechanical sensor |
| 11/17/2005 | WO2005108283A1 Temperature resistant hermetic sealing formed at low temperatures for mems packages |
| 11/17/2005 | WO2005049957A3 High temperature environment tool system and method |
| 11/17/2005 | US20050255677 Integrated circuit with impurity barrier |
| 11/17/2005 | US20050253282 Temperature resistant hermetic sealing formed at low temperatures for MEMS packages |
| 11/17/2005 | US20050253240 Micromechanical component and corresponsing production method |
| 11/17/2005 | US20050253207 Microelectronic assembly having a perimeter around a MEMS device |
| 11/17/2005 | US20050252755 Acceleration switch |
| 11/17/2005 | US20050252293 Magnetic MEMS device and method of forming thereof |
| 11/17/2005 | DE102004021693A1 Mikromechanischer Sensor Micromechanical sensor |
| 11/17/2005 | DE102004019357A1 Verfahren zur Funktionalisierung von Biosensor-Chips A process for the functionalization of biosensor chips |
| 11/17/2005 | DE102004011667A1 Vorrichtung mit einem Halbleiterchip und einem mikrofluidischen System und Verfahren zur Herstellung Device having a semiconductor chip and a microfluidic system and method for producing |
| 11/16/2005 | EP1596407A1 Acceleration switch |
| 11/16/2005 | EP1596203A1 Magnetic micro-electromechanical sytem (MEMS) sensor and method for its manufacture |
| 11/16/2005 | EP1141554B1 Electrostatic/pneumatic actuators for active surfaces |
| 11/16/2005 | CN1697108A Acceleration switch |
| 11/16/2005 | CN1696759A Micro-mirror element |
| 11/15/2005 | US6965107 Semiconductor-based encapsulated infrared sensor and electronic device |
| 11/15/2005 | US6964894 Apparatus and method of forming a device layer |
| 11/10/2005 | WO2005106478A1 Method for functionalizing biosensor chips |
| 11/10/2005 | WO2005105661A1 Techniques for providing a structure with through-holes that may be used in a sub-assembly for micro-components |
| 11/10/2005 | US20050250238 Method of making electrical connections to hermetically sealed MEMS devices |
| 11/10/2005 | US20050249966 Method of manufacture for microelectromechanical devices |
| 11/10/2005 | US20050248862 Light deflector, light deflection array, image forming apparatus, and image projection display apparatus |
| 11/10/2005 | US20050247989 Method for integrating micro and nanoparticles into MEMS and apparatus including the same |
| 11/10/2005 | US20050247477 Modifying the electro-mechanical behavior of devices |
| 11/10/2005 | DE102004020204A1 Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung An encapsulated electrical component and method for preparing |
| 11/09/2005 | EP1593649A2 Method of making electrical connections to hermetically sealed MEMS devices |
| 11/09/2005 | EP1592643A2 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
| 11/09/2005 | CN1695233A Three beam MEMS device and correlation method |
| 11/09/2005 | CN1694842A Thermoelastic actuator design. |
| 11/09/2005 | CN1693182A Deep submicron three-dimensional rolling mould and its mfg. method |
| 11/09/2005 | CN1693181A Integrated driver electronics for mems device using high voltage thin film transistors |
| 11/08/2005 | US6963134 Semiconductor sensor with substrate having a certain electric potential |
| 11/08/2005 | US6962834 Wafer-level hermetic micro-device packages |
| 11/03/2005 | WO2005103793A1 A micro-electro-mechanical two dimensional mirror with articulated suspension structures for hight fill factor arrays |
| 11/03/2005 | WO2005102911A1 Mems device with conductive path through substrate |
| 11/03/2005 | WO2005102910A1 Encapsulated electrical component and production method |
| 11/03/2005 | US20050244099 Cantilevered micro-electromechanical switch array |
| 11/03/2005 | US20050241135 Techniques for providing a structure with through-holes that may be used in a sub-assembly for micro components |
| 11/03/2005 | DE102004018408A1 Kapazitiver Drucksensor und Verfahren zur Herstellung A capacitive pressure sensor and A process for preparing |
| 11/03/2005 | CA2526231A1 A micro-electro-mechanical two dimensional mirror with articulated suspension structures for high fill factor arrays |
| 11/01/2005 | US6961182 Micro electro mechanical systems device, method of manufacturing the same and micro electro mechanical systems module |