| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 03/07/2006 | US7008819 Method of fabricating an array of wafer scale polymeric caps |
| 03/07/2006 | US7008817 Method for manufacturing micro electro-mechanical systems using solder balls |
| 03/07/2006 | US7008812 Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation |
| 03/02/2006 | WO2006023016A1 Silicon condenser microphone and manufacturing method |
| 03/02/2006 | US20060045842 Microsystem process networks |
| 03/01/2006 | EP1629255A1 Methods and apparatus for shielding mems devices |
| 03/01/2006 | EP1332547B1 Electrostatic/pneumatic actuators for active surfaces |
| 03/01/2006 | EP1252028A4 Temporary bridge for micro machined structures |
| 03/01/2006 | CN2761576Y Film microbridge structure |
| 03/01/2006 | CN1740913A Optical micro-electromechanical component and producing method thereof |
| 02/28/2006 | US7005775 Microfabricated torsional drive utilizing lateral electrostatic force |
| 02/28/2006 | US7005732 Methods and systems for providing MEMS devices with a top cap and upper sense plate |
| 02/28/2006 | US7004015 Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein |
| 02/27/2006 | CA2516625A1 System and method of sensing actuation and release voltages of an interferometric modulator |
| 02/27/2006 | CA2514625A1 Staggered column drive circuit systems and methods |
| 02/23/2006 | WO2006020744A2 Structure and method of forming capped chips |
| 02/23/2006 | DE102004062973A1 Complementary metal oxide semiconductor image sensor has planarization layer including microlenses of concave pattern formed corresponding to respective photodiodes, on color filter layers |
| 02/23/2006 | DE102004062954A1 Complementary metal oxide semiconductor image sensor comprises micro lens with refractive index distribution formed on planarization layer, that focuses light on photodiode, based on ion injection profile |
| 02/23/2006 | DE102004039924A1 Micromechanical sensor for use as e.g. inertial sensor, has ground wires symmetrical to middle electrode conductor for isolating counter electrode conductors, where conductors connect functional part and electronic evaluating processor unit |
| 02/22/2006 | EP1627675A1 Component separating device, method of producing the device, and method of separating component by using the device |
| 02/22/2006 | EP1626926A2 Method for producing a packaged integrated circuit |
| 02/22/2006 | CN1738765A Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
| 02/21/2006 | US7002727 Optical materials in packaging micromirror devices |
| 02/21/2006 | US7002436 Vacuum-cavity MEMS resonator |
| 02/21/2006 | US7002215 Floating entrance guard for preventing electrical short circuits |
| 02/21/2006 | US7001793 Method of protecting microfabricated devices with protective caps |
| 02/16/2006 | WO2006017005A1 Interconnecting integrated circuits using mems |
| 02/16/2006 | US20060034755 Microsystem process networks |
| 02/16/2006 | US20060034754 Microsystem process networks |
| 02/16/2006 | DE102004062972A1 Complementary metal oxide semiconductor image sensor, for converting optic image to electric signal, has microlens with second insulating layer covering projected portion of first insulating layer having uneven surface to form dome shape |
| 02/16/2006 | DE102004036214A1 Micro-fluids system for recording fluid measured variables like pressure, temperature and flow has fluid channels, sensors and plate-shaped units to contain fluids |
| 02/15/2006 | EP1625623A2 A novel packaging method for microstructure and semiconductor devices |
| 02/15/2006 | EP1625095A2 Microelectromechanical device packages with integral heaters |
| 02/15/2006 | EP1247293A4 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby |
| 02/15/2006 | CN1241826C System and method for constraining totally released micro-components |
| 02/14/2006 | US6998689 Fluid delivery for scanning probe microscopy |
| 02/14/2006 | US6998533 Electronic device and method of manufacturing same |
| 02/14/2006 | US6998236 Methods for detecting interaction between a test moiety and a plurality of target moieties |
| 02/09/2006 | US20060027915 Device packages with low stress assembly process |
| 02/09/2006 | DE10013013B4 Chemisch synthetisierte und aufgebaute elektronische Bauelemente Chemically synthesized and structured electronic components |
| 02/08/2006 | EP1289660B1 High-performance system for parallel and selective dispensing of micro-droplets |
| 02/08/2006 | CN1732590A Meso-microelectromechanical system package |
| 02/08/2006 | CN1241021C Acceleration sensor and method of manufacture thereof |
| 02/07/2006 | US6995469 Semiconductor apparatus and fabricating method for the same |
| 02/07/2006 | US6995040 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 02/07/2006 | US6995034 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 02/07/2006 | US6994950 Method for integrating micro- and nanoparticles into MEMS and apparatus including the same |
| 02/02/2006 | WO2006012255A1 Module integrating mems and passive components |
| 02/02/2006 | US20060022784 Microtechnological device comprising magnetically assembled structures and assembly process |
| 02/01/2006 | EP1621516A1 Microtechnological device with magnetically assembled structures and assembling method |
| 02/01/2006 | EP1620355A1 Methods and apparatus for attaching mems devices to housing |
| 02/01/2006 | EP1620354A1 Vacuum package fabrication of integrated circuit components |
| 02/01/2006 | EP1620353A1 Anti-reflective sub-wavelengh structures for silicon wafers |
| 02/01/2006 | EP1432581A4 Inkjet printhead having thermal bend actuator heating element electrically isolated from nozzle chamber ink |
| 02/01/2006 | EP0923099B1 Micro-relay and method for manufacturing the same |
| 02/01/2006 | CN1239324C Print head using radio-frequency micro-electromechanical system spray head |
| 02/01/2006 | CN1239236C Method and apparatus for the manipulation of particles by means of dielectrophoresis |
| 01/31/2006 | US6992399 Die connected with integrated circuit component for electrical signal passing therebetween |
| 01/31/2006 | US6992375 for holding getter materials in place within micromechanical device package substrate; microelectronics; semiconductors/integrated circuits; lithography |
| 01/31/2006 | US6991953 Microelectronic mechanical system and methods |
| 01/26/2006 | WO2005086532A3 Packaged acoustic and electromagnetic transducer chips |
| 01/26/2006 | US20060019421 Semiconductor mechanical sensor |
| 01/26/2006 | DE112004000353T5 Kapazitiver Beschleunigungssensor Capacitive Accelerometer |
| 01/26/2006 | DE102004032176A1 Beschichteter mikromechanischer Strahler Coated micromechanical spotlight |
| 01/25/2006 | CN1725067A Micro-electromechanical structure display unit |
| 01/25/2006 | CN1238192C Ink jet nozzle assembly |
| 01/24/2006 | US6989582 Method for making a multi-die chip |
| 01/24/2006 | US6989292 Chips with wafer scale caps formed by molding |
| 01/24/2006 | US6988407 Acceleration sensor |
| 01/24/2006 | CA2384071C Optical mems switch with imaging system |
| 01/19/2006 | WO2006005643A1 Method and system for improving alignment precision of parts in mems |
| 01/19/2006 | DE102004030972A1 Micromechanical sensor such as acceleration sensor for airbags has functional micromechanical part evaluation circuit with parameter memory and external control unit |
| 01/19/2006 | DE102004030380A1 Mikromechanische Membran- oder Brückenstruktur, insbesondere mikromechanischer Sensor oder Aktor, und Verfahren zum Selbsttest einer solchen Micromechanical membrane or bridge structure, in particular micromechanical sensor or actuator, and method for self-testing of such |
| 01/18/2006 | EP1286904B1 Microchannel device for heat or mass transfer |
| 01/18/2006 | CN1721993A System and method for moving an object employing piezo actuators |
| 01/18/2006 | CN1721911A Resonance assembly, double-shaft assembly and method for manufacturing double-shaft assembly and micro-system assembly |
| 01/17/2006 | US6987312 Semiconductor device with sensor and/or actuator surface and method for producing it |
| 01/17/2006 | US6987304 Methods and apparatus for particle reduction in MEMS devices |
| 01/17/2006 | US6986278 Capped microsensor |
| 01/12/2006 | WO2006004751A2 Methods and apparatus for attaching a die to a substrate |
| 01/12/2006 | US20060007517 Structure of a micro electro mechanical system |
| 01/12/2006 | US20060006514 Interconnecting integrated circuits using MEMS |
| 01/12/2006 | US20060006511 Ultrathin module for semiconductor device and method of fabricating the same |
| 01/11/2006 | CN1719590A Ultrathin module for semiconductor device and method of fabricating the same |
| 01/11/2006 | CN1718532A Packaging structure of microscope element |
| 01/10/2006 | CA2380824C Optically controlled switches |
| 01/05/2006 | US20060001123 Module integrating MEMS and passive components |
| 01/05/2006 | US20060001116 Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production |
| 01/04/2006 | CN1716091A Transfer printing device and method for microwave structure pattern |
| 01/03/2006 | US6982189 Molded wafer scale cap array |
| 01/03/2006 | US6981727 Diode-type nanotweezers and nanomanipulator device using the same |
| 12/29/2005 | US20050286106 Transmission type spatial light modulator and transmission type spatial light modulation array device |
| 12/29/2005 | DE102005024630A1 Dynamikgrössenhalbleitersensor Dynamic size semiconductor sensor |
| 12/29/2005 | DE102004027094A1 Halbleitermodul mit einem Halbleiter-Sensorchip und einem Kunststoffgehäuse sowie Verfahren zu dessen Herstellung Semiconductor module with a semiconductor sensor chip and a plastic housing, as well as method for the production |
| 12/28/2005 | EP1609180A1 Electrical connections in substrates |
| 12/28/2005 | EP1608589A1 Micro-electro-mechanical systems (mems) device and system and method of producing the same |
| 12/28/2005 | EP1608585A2 Microdevice assembly having a fine grain getter layer for maintaining vacuum |
| 12/27/2005 | US6979873 Semiconductor device having multiple substrates |
| 12/27/2005 | US6979872 Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modules |
| 12/27/2005 | US6979599 Chip with molded cap array |