| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 05/24/2006 | EP1181716A4 Microwave bonding of mems component |
| 05/24/2006 | CN1775656A Interconnection of high-density nano structure |
| 05/23/2006 | US7049670 Electro ceramic components |
| 05/23/2006 | US7049175 Method of packaging RF MEMS |
| 05/23/2006 | US7049164 Microelectronic mechanical system and methods |
| 05/18/2006 | WO2006052763A2 Compression and cold weld sealing methods and devices |
| 05/18/2006 | US20060105503 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 05/18/2006 | CA2584851A1 Compression and cold weld sealing methods and devices |
| 05/17/2006 | EP1356514A4 Use of infrared radiation in molding of protective caps |
| 05/17/2006 | EP1356513A4 Molding of protective caps |
| 05/17/2006 | CN1773725A MOS transistor with deformable gate |
| 05/16/2006 | US7046539 Mechanical memory |
| 05/16/2006 | US7045868 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 05/16/2006 | US7045459 Thin film encapsulation of MEMS devices |
| 05/11/2006 | WO2006049731A1 Method of singulating electronic devices |
| 05/11/2006 | US20060097252 Interconnect including a pliable surface and use thereof |
| 05/11/2006 | DE19820816B4 Bondpadstruktur und entsprechendes Herstellungsverfahren Bondpadstruktur and manufacturing method thereof |
| 05/10/2006 | EP1576690A4 Meso-microelectromechanical system package |
| 05/10/2006 | CN1770870A System with server based control of client device display features |
| 05/10/2006 | CN1770869A System and method for transmitting video data |
| 05/09/2006 | US7043309 Distributed actuation allocation for large assemblies of implementation units |
| 05/09/2006 | US7042076 Vacuum sealed microdevice packaging with getters |
| 05/09/2006 | US7042075 Electronic device sealed under vacuum containing a getter and method of operation |
| 05/09/2006 | US7040338 Microfabricated elastomeric valve and pump systems |
| 05/09/2006 | US7040165 Semiconductor mechanical sensor |
| 05/04/2006 | WO2006045653A1 Method for assembling semiconductor chips, and corresponding semiconductor chip assembly |
| 05/04/2006 | DE102005039465A1 Micromachined ultrasonic transducer device for medical diagnostic ultrasound imaging system, has unit switch cells, each includes switches for closing pathways to connection point that is connected to respective sensor |
| 05/03/2006 | EP1652215A2 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 05/03/2006 | CN1767091A RF solenoid micro-inductor based on micro electro-mechanical system |
| 05/03/2006 | CN1767090A Hollow structure RF solenoid micro-inductor |
| 05/02/2006 | US7037844 Method for manufacturing a housing for a chip having a micromechanical structure |
| 05/02/2006 | US7037805 Methods and apparatus for attaching a die to a substrate |
| 05/02/2006 | US7037745 Method of making electrical connections to hermetically sealed MEMS devices |
| 04/27/2006 | WO2006044219A2 Wafer level microelectronic packaging with double isolation |
| 04/27/2006 | WO2006044040A1 Assembly |
| 04/27/2006 | DE10321257B4 Optische oder optoelektronische Anordnung mit mindestens einem auf einem Metallträger angeordneten optoelektronischen Bauelement Optical or optoelectronic arrangement with at least one arranged on a metal carrier optoelectronic component |
| 04/26/2006 | CN1764595A Micro-electro-mechanical systems (MEMS) device and system and method of producing the same |
| 04/26/2006 | CN1762787A Array type piezoelectricity-driven multi-cavity micro-mixer |
| 04/25/2006 | US7034440 Generator for use with a micro system having dual diaphragms |
| 04/25/2006 | US7034393 Semiconductor assembly with conductive rim and method of producing the same |
| 04/20/2006 | WO2006040403A1 Sensor and method for measuring a variable affecting a capacitive component |
| 04/20/2006 | US20060082379 Parallel, individually addressable probes for nanolithography |
| 04/20/2006 | DE102004062874A1 Elektrokinetische Mikroleistungszelle, die einen Mikrofluidchip des Mehrfachkanaltyps verwendet Electrokinetic micro power cell, which uses a micro fluid chip of the multi-channel type |
| 04/20/2006 | DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module |
| 04/20/2006 | DE102004049730A1 Mikrokapillarreaktor und Verfahren zum kontrollierten Vermengen von nicht homogen mischbaren Fluiden unter Verwendung dieses Mikrokapillarreaktors Microcapillary reactor and method for controlled mixing of non-homogeneously miscible fluids using this microcapillary reactor |
| 04/19/2006 | CN1761042A Method and equipment for fabricating structure of compound crystal |
| 04/19/2006 | CN1760112A Super hydrophobic surface possessing dual microtexture and preparation method |
| 04/19/2006 | CN1251960C Method for mfg. microelectromechanical structure and its integrated circuit |
| 04/18/2006 | US7031040 Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirror |
| 04/18/2006 | US7030536 Micromachined ultrasonic transducer cells having compliant support structure |
| 04/18/2006 | US7030432 Method of fabricating an integrated circuit that seals a MEMS device within a cavity |
| 04/18/2006 | US7030416 Micro electro mechanical system apparatus |
| 04/18/2006 | US7029829 Low temperature method for forming a microcavity on a substrate and article having same |
| 04/18/2006 | US7028954 Microfabricated translational stages for control of aerodynamic loading |
| 04/14/2006 | CA2485153A1 Bi-directional actuator utilizing both attractive and repulsive electrostatic forces |
| 04/13/2006 | US20060076633 Methods and apparatus for particle reduction in MEMS devices |
| 04/12/2006 | EP1645847A1 Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device |
| 04/11/2006 | US7026223 Hermetic electric component package |
| 04/11/2006 | US7026189 Wafer packaging and singulation method |
| 04/11/2006 | US7026184 Method of fabricating microstructures and devices made therefrom |
| 04/11/2006 | US7026176 Mold making method for wafer scale caps |
| 04/11/2006 | US7025619 Sockets for microassembly |
| 04/06/2006 | WO2006036642A2 Method of making a reflective display device using thin film transistor production techniques |
| 04/06/2006 | WO2006036250A1 Packaged microchip with premolded-type package |
| 04/06/2006 | WO2005070817A3 Methods and systems for providing mems devices with a top cap and upper sense plate |
| 04/05/2006 | EP1642365A1 Miniature 3-dimensional package for mems sensors |
| 04/05/2006 | EP1641710A2 Micromechanical apparatus and method of forming a micromechanical device layer |
| 04/05/2006 | EP1410436A4 Parallel, individually addressable probes for nanolithography |
| 04/05/2006 | CN1755346A 原子力显微镜 AFM |
| 04/04/2006 | US7023603 Micro-mirror device including dielectrophoretic microemulsion |
| 04/04/2006 | US7023124 Micro-actuator array, micro-actuator device, optical switch, array, and optical switch system |
| 04/04/2006 | US7023083 Multi-layer device and method for producing the same |
| 04/04/2006 | US7022546 Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| 03/30/2006 | WO2006032895A1 Gyroscopes and accelerometers |
| 03/30/2006 | DE10035564B4 Mikromechanisches Gehäuse Micromechanical housing |
| 03/29/2006 | EP1640950A2 MEMS display device and data writing method adapted therefor |
| 03/29/2006 | EP1640775A1 Interferometric modulator display having patterned spacers for backplates and method of making the same |
| 03/29/2006 | EP1640774A1 Method and system for packaging a mems device |
| 03/29/2006 | EP1640664A2 Control valve assembly for controlling gas flow in gas combustion systems |
| 03/29/2006 | EP1640336A2 Method and device for a display having transparent components integrated therein |
| 03/29/2006 | EP1640335A2 Packaging device for electromechanical integrated microsystems und its method of fabrication |
| 03/29/2006 | EP1640334A2 An integrated lid formed on mems device |
| 03/29/2006 | EP1640333A1 Hermetically sealed microdevice with getter shield |
| 03/29/2006 | EP1640331A2 System and method for display device with reinforcing substance |
| 03/29/2006 | EP1640330A2 Method and device for packaging a substrate |
| 03/29/2006 | EP1640329A2 System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
| 03/29/2006 | EP1640328A2 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
| 03/29/2006 | EP1640327A2 Method and system for packaging mems devices with incorporated getter |
| 03/29/2006 | EP1640326A2 Method and system for providing mems device package with secondary seal |
| 03/29/2006 | EP1640325A2 Method and system for sealing a substrate |
| 03/29/2006 | EP1640324A2 System and method for display device with integrated desiccant |
| 03/29/2006 | EP1640323A2 System and method for display device with activated desiccant |
| 03/29/2006 | EP1640322A2 System and method for protecting micro-structure of display array using spacers in gap within display device |
| 03/29/2006 | EP1640321A2 Method and device for protecting interferometric modulators from electrostatic discharge |
| 03/29/2006 | EP1640320A2 Method and system for packaging a micromechanical display |
| 03/29/2006 | EP1070677B1 Microcap wafer-level package |
| 03/29/2006 | CN2767978Y Minitype temperature sensor with nanometer scale |
| 03/29/2006 | CN1753718A Component separating device, method of producing the device, and method of separating component by using the device |
| 03/29/2006 | CN1751983A Non close parked metal hollow ball shell ordered network structure material and its making method |
| 03/29/2006 | CN1248312C Multi-layer integrated circuit for join of substrates with wide gaps |