| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 01/30/2007 | US7170141 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry |
| 01/30/2007 | US7169314 Microfabricated elastomeric valve and pump systems |
| 01/27/2007 | CA2616213A1 Bi-direction rapid action electrostatically actuated microvalve |
| 01/25/2007 | WO2007010981A1 Optical scan device, image display device, optical scanner resonance frequency modification method, and reflection mirror position correction method |
| 01/25/2007 | US20070020926 Electrical connections in substrates |
| 01/25/2007 | US20070019406 Optical device having micro lens array |
| 01/25/2007 | CA2580599A1 Gold thiolate and photochemically functionalized microcantilevers using molecular recognition agents |
| 01/24/2007 | EP1461816B1 Mems device having contact and standoff bumps and related methods |
| 01/24/2007 | CN1899951A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/24/2007 | CN1296715C Semiconductor device |
| 01/23/2007 | US7166911 Packaged microchip with premolded-type package |
| 01/23/2007 | US7166910 Miniature silicon condenser microphone |
| 01/18/2007 | WO2007007206A2 Mems actuators and switches |
| 01/18/2007 | WO2007007204A2 Apparatus and method for performing earth borehole operations |
| 01/18/2007 | WO2007006843A1 Micromechanical sensor, sensor array and method |
| 01/18/2007 | WO2007006154A1 Optimized bi-directional electrostatic actuators |
| 01/18/2007 | DE112005000276T5 Waferhäusungs- und Singulierungsverfahren Waferhäusungs- and Singulierungsverfahren |
| 01/18/2007 | DE102005033005A1 Optoelektronischer Chip The optoelectronic chip |
| 01/18/2007 | CA2600081A1 Mems actuators and switches |
| 01/17/2007 | EP1743868A2 Sealed semiconductor device with an inorganic bonding layer and method for manufacturing the semiconductor device |
| 01/17/2007 | CN1898862A Micro-resonator and communication apparatus |
| 01/17/2007 | CN1898150A Method for containing a device and a corresponding device |
| 01/17/2007 | CN1896785A Array collimation coupling assembly and its production for light switch |
| 01/17/2007 | CN1295541C Micro light modulator arrangement |
| 01/17/2007 | CN1295138C Thin film mini-bridge structure and its mfg. method |
| 01/16/2007 | US7164522 Spatial light modulator, spatial light modulator array, and exposure apparatus |
| 01/16/2007 | US7164199 Device packages with low stress assembly process |
| 01/16/2007 | US7163838 Method and apparatus for forming a DMD window frame with molded glass |
| 01/11/2007 | DE102005032115A1 Verfahren zum Fügen von Werkstücken und mikrostrukturiertes Bauteil A method of joining workpieces and micro-structured component |
| 01/11/2007 | DE102005027676A1 Verfahren zur Herstellung von anisotropen Wellenleiterstrukturen zur Übertragung von Lichtwellen A process for preparing anisotropic waveguide structures for the transmission of light waves |
| 01/11/2007 | DE102005027276B3 Production process for a stack of at least two base materials comprising printed circuit boards photostructures the boards applies solder stacks and melts with lacquer separating the boards |
| 01/10/2007 | EP1741668A2 Method for encasing a MEMS device and packaged device |
| 01/10/2007 | CN1894156A Method to test the hermeticity of a sealed cavity micromechanical device and the device to be so tested |
| 01/10/2007 | CN1894155A Method and system for self-aligning parts in mems |
| 01/10/2007 | CN1893137A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/10/2007 | CN1294075C Micro-machined ultrasonic transducer (MUT) array |
| 01/09/2007 | US7161233 Integrated micro electromechanical system encapsulation component and fabrication process of the component |
| 01/09/2007 | US7161094 Modifying the electro-mechanical behavior of devices |
| 01/09/2007 | US7160752 Fabrication of advanced silicon-based MEMS devices |
| 01/09/2007 | US7160476 Method of manufacturing an electronic device |
| 01/09/2007 | CA2458596C Inkjet printhead having thermal bend actuator heating element electrically isolated from nozzle chamber ink |
| 01/04/2007 | WO2006091904A9 Methods and apparatus for spatial light modulation |
| 01/04/2007 | WO2006084028A3 Interdiffusion bonded stacked die device |
| 01/04/2007 | US20070004096 Method for containing a device and a corresponding device |
| 01/04/2007 | US20070001247 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 01/03/2007 | EP1738214A1 A micro-electro-mechanical two dimensional mirror with articulated suspension structures for hight fill factor arrays |
| 01/03/2007 | EP1738172A1 Method for functionalizing biosensor chips |
| 01/03/2007 | EP1737786A1 Mems device with conductive path through substrate |
| 01/03/2007 | CN1889266A High-temperature resisting one-chip integrated micro-sensor structure and system integrating method |
| 01/03/2007 | CN1292977C Deep submicron three-dimensional rolling mould and its mfg. method |
| 01/02/2007 | US7157312 Surface mount package and method for forming multi-chip microsensor device |
| 12/28/2006 | DE202006010085U1 Vorrichtung zur Detektion elektromagnetischer Wellen A device for detection of electromagnetic waves |
| 12/28/2006 | DE102005028704A1 Semiconductor device used in electronic apparatus, has adhesion promoter layer with microporous morphology between semiconductor device components and plastic compositions, and having nanoscale ceramic grains applied by wet chemical process |
| 12/27/2006 | EP1358489B1 Production process for accelerometer protected by caps applied at the wafer scale |
| 12/27/2006 | CN1292447C MEMS device having a trilayered beam |
| 12/26/2006 | US7155125 Control apparatus and control method for optical switch using MEMS mirrors |
| 12/26/2006 | US7154173 Semiconductor device and manufacturing method of the same |
| 12/26/2006 | US7153718 Micromechanical component as well as a method for producing a micromechanical component |
| 12/26/2006 | US7153717 Encapsulation of MEMS devices using pillar-supported caps |
| 12/26/2006 | US7153443 Microelectromechanical structure and a method for making the same |
| 12/26/2006 | US7152962 Ink jet printhead having a moving nozzle with an externally arranged actuator |
| 12/21/2006 | WO2006134274A1 Microfluidic circulating device for determining parameters of a physical and/or chemical transformation, and use thereof |
| 12/21/2006 | WO2006133509A1 Imaging system |
| 12/21/2006 | DE102005048408A1 Dünnfilm-Halbleiterkörper A thin film semiconductor body |
| 12/21/2006 | DE102005026528A1 Halbleiterbauteil mit Medienkanal und Verfahren zur Herstellung desselben Of the same semiconductor device with media channel and methods for preparing |
| 12/21/2006 | CA2608164A1 Micro-electro-mechanical transducer having an insulation extension |
| 12/19/2006 | US7151426 Latching micro magnetic relay packages and methods of packaging |
| 12/19/2006 | US7151425 RF MEMS switch and fabrication method thereof |
| 12/19/2006 | US7150195 Sealed capacitive sensor for physical measurements |
| 12/19/2006 | US7150191 Pyramid socket suspension |
| 12/14/2006 | WO2006004751A3 Methods and apparatus for attaching a die to a substrate |
| 12/14/2006 | DE102005016751B3 Verfahren zur Herstellung gehäuster elektronischer Bauelemente Process for the preparation of packaged electronic components |
| 12/14/2006 | DE102004061731B4 Programmierbarer Mikrostempel Programmable micro Temple |
| 12/13/2006 | CN1289936C MEMS device and its making method and MEMS assembly |
| 12/07/2006 | WO2005050714A3 High temperature electronic devices |
| 12/07/2006 | US20060273449 Hermetically sealed package for optical, electronic, opto-electronic and other devices |
| 12/06/2006 | CN1874956A Fixed, insulated and electric connection of treated semiconductor wafers |
| 12/06/2006 | CN1287872C Air bag controlled micro medicine conveying executor |
| 12/05/2006 | US7144745 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced |
| 11/30/2006 | WO2006126015A1 Laser assisted system and method for bonding of surfaces ; microcavity for packaging mems devices |
| 11/30/2006 | US20060267558 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors |
| 11/30/2006 | US20060266730 Microelectromechanical structure and a method for making the same |
| 11/30/2006 | DE102005023685A1 Microelectromechanical system mirror device used in e.g. barcode reader, has beams connected to mirror having specific dimensions and springs connecting beams to bonding pads |
| 11/30/2006 | DE102005023591A1 Feldmesseinrichtung, Messbaugruppe für eine Feldmesseinrichtung und Herstellungsmethode für eine Mehrzahl von Messbaugruppen Field measuring device, the measuring assembly for a field measuring device and manufacturing method for a plurality of measurement modules |
| 11/29/2006 | EP1725495A1 Flip chip bonded micro-electro-mechanical system (mems) device |
| 11/29/2006 | CN1286710C Encapsulated machinery system band-pass filter for integrated circuits and method of fabrication thereof |
| 11/28/2006 | US7142087 Micromechanical latching switch |
| 11/23/2006 | WO2006091791A3 Methods and apparatus for actuating displays |
| 11/23/2006 | US20060261424 Integrated pressure and acceleration measurement device and a method of manufacture thereof |
| 11/23/2006 | DE20122618U1 Projection system with array of rectangular micro-mirror elements for providing images at angles depending on mirror tilt angle in light ray steering system |
| 11/22/2006 | EP1723406A1 Micro-structured sensor |
| 11/22/2006 | EP1723073A1 Vacuum sealed microdevice packaging with getters |
| 11/22/2006 | EP1723072A2 Mechanical sensor with pyramid socket suspension |
| 11/22/2006 | CN2840077Y Array collimation coupling assembly for light switch |
| 11/22/2006 | CN1866007A Ultra trace detection sensor with integrated piezoresistance SiO2 cantilever, making method and application thereof |
| 11/21/2006 | US7138694 Single crystal silicon sensor with additional layer and method of producing the same |
| 11/21/2006 | US7138693 Barrier layers for microelectromechanical systems |
| 11/21/2006 | US7138293 Wafer level packaging technique for microdevices |
| 11/21/2006 | US7137776 Film cooling for microcircuits |
| 11/16/2006 | WO2006119625A1 Rotary switch cross connect matrix system |