Patents for B81B 7 - Micro-structural systems (8,983) |
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04/17/2007 | US7205173 Method of fabricating micro-electromechanical systems |
04/17/2007 | CA2410430C Miniature microdevice package and process for making thereof |
04/12/2007 | WO2007041302A2 Mems device and interconnects for same |
04/12/2007 | US20070082421 Miniature Silicon Condenser Microphone |
04/12/2007 | US20070082228 Thermoelastic device comprising an expansive element formed from a preselected material |
04/11/2007 | CN2888651Y Structure of high-overload resisting SOI pressure sensitive chip |
04/11/2007 | CN1944235A Electromagnetic-magnetoelectric type micro mechanical resonant beam structure |
04/10/2007 | US7203394 Micro mirror arrays and microstructures with solderable connection sites |
04/10/2007 | US7202553 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
04/05/2007 | WO2007038396A1 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
04/05/2007 | WO2007014095A3 End effector for nano manufacturing |
04/04/2007 | EP1560785B1 Microbead-filled microsystem and production method thereof |
04/04/2007 | CN1942987A 开关阵列 Switch Array |
04/04/2007 | CN1942393A Packaged acoustic and electromagnetic transducer chips |
04/04/2007 | CN1309095C Micro electromechanical system device |
04/04/2007 | CN1308221C MEMS array, manufacturing method thereof, and MEMS device manufacturing method based on the same |
04/03/2007 | US7198982 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
03/29/2007 | DE102005046058A1 Monolithic integrated circuit production method, involves making process variation of one partial structure with another unchanging partial structure, for adjustment of structural characteristics of sensor structure |
03/29/2007 | CA2623013A1 Apparatus for downhole fluids analysis utilizing micro electro mechanical systems (mems) or other sensors |
03/28/2007 | EP1766663A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
03/28/2007 | EP1765725A2 Nanowire device with (111) vertical sidewalls and method of fabrication |
03/28/2007 | EP1765724A1 Method and system for improving alignment precision of parts in mems |
03/28/2007 | CN1937094A Scanning thermal microscope probe |
03/28/2007 | CN1936591A Displacement detection device |
03/28/2007 | CN1936561A Glass-chip flowing minisize electrolyzer and manufacturing method |
03/28/2007 | CN1935627A Micro structure and its manufacturing method |
03/28/2007 | CN1307053C Inkjet printhead having electrical-isolation thermal bend actuator heating element |
03/28/2007 | CN1307001C High-performance system for parallel and selective dispensing of micro-droplets |
03/27/2007 | US7196449 Two-axis device and manufacturing method therefor |
03/27/2007 | US7196410 Wafer packaging and singulation method |
03/22/2007 | WO2007031615A1 Microfluidic flow device having at least one connecting channel linking two channels and corresponding method for using same |
03/22/2007 | DE102006041995A1 Sensor mit Optikteil zur Erfassung einer physikalischen Größe, Verfahren zu dessen Herstellung Sensor with optical member for detecting a physical quantity, process for its preparation |
03/22/2007 | DE102005040781A1 Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing |
03/21/2007 | EP1764617A1 Displacement detection device with overrange protection |
03/21/2007 | EP1049921B1 Micromachined gas-filled chambers and method of microfabrication |
03/21/2007 | CN1305752C Micro mechanical structure device of case packing and its mfg method |
03/20/2007 | US7191661 Capacitive pressure sensor |
03/15/2007 | WO2006062616A3 Galvanically isolated signal conditioning system |
03/15/2007 | US20070057994 Inkjet printhead having row of nozzle actuators interleaved with nozzles of adjacent row |
03/14/2007 | EP1761950A2 Methods and apparatus for attaching a die to a substrate |
03/14/2007 | EP1761456A1 Module integrating mems and passive components |
03/13/2007 | US7190092 Micro-electromechanical switch performance enhancement |
03/08/2007 | US20070053808 Microreactor composed of plates and comprising a catalyst |
03/07/2007 | EP1760746A2 MEMS device having standoff bumps and folded component |
03/07/2007 | EP1760039A2 Electrical contact for a mems device and method of making |
03/07/2007 | EP1760036A1 MEMS device having contact and standoff bumps and related methods |
03/07/2007 | EP1758814A2 Packaging for micro electro-mechanical systems and methods of fabricating thereof |
03/01/2007 | WO2007022978A1 Microelectromechanical device packaging with an anchored cap and its manufacture |
02/28/2007 | EP1757556A2 Packaging a semiconductor device |
02/28/2007 | CN1301896C Minisize circulating flow passage device made by lead frame |
02/27/2007 | US7183637 Microelectronic mechanical system and methods |
02/27/2007 | US7183622 Module integrating MEMS and passive components |
02/27/2007 | US7181836 Method for making an electrode structure |
02/22/2007 | WO2007022249A2 Packaged microphone with electrically coupled lid |
02/22/2007 | WO2007022179A2 Partially etched leadframe packages having different top and bottom topologies |
02/22/2007 | WO2007020132A1 Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement |
02/22/2007 | WO2006091904B1 Methods and apparatus for spatial light modulation |
02/22/2007 | US20070042565 Fluidic MEMS device |
02/22/2007 | US20070041682 Micro mirror unit and its manufacturing process, and optical switch with the micro mirror unit employed therein |
02/22/2007 | US20070040488 Electric part |
02/22/2007 | US20070040257 Chip packages with covers |
02/22/2007 | DE112005000625T5 System und Verfahren zum Direktverbinden von Substraten System and method for direct bonding of substrates |
02/21/2007 | EP1501756B1 Method of manufacturing an electronic device in a cavity with a cover |
02/21/2007 | CN1915796A Light reading out, not refrigerant infrared imaging array device, and fabricating metod |
02/20/2007 | US7180144 Corner compensation method for fabricating MEMS and structure thereof |
02/20/2007 | US7180064 Infrared sensor package |
02/20/2007 | US7179513 Durable optical element |
02/20/2007 | US7178397 Apparatus and method for driving MEMS structure and detecting motion of the driven MEMS structure using a single electrode |
02/15/2007 | US20070036510 Moisture-resistant nano-particle material and its applications |
02/15/2007 | DE102005037490A1 Optischer Sensor Optical sensor |
02/14/2007 | EP1753023A2 Method of manufacturing an electronic device in a cavity with a cover |
02/14/2007 | EP1751051A1 Modifying the electro-mechanical behavior of micromachined devices |
02/14/2007 | CN1914963A Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
02/14/2007 | CN1914659A Mechanical shutter with polymerised liquid crystal layer |
02/14/2007 | CN1914658A Mechanical structure including a layer of polymerised liquid crystal and method of manufacturing such |
02/14/2007 | CN1911781A Manufacturing method used for improving performance of non-refrigerating infrared focal plane array device |
02/14/2007 | CN1911779A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
02/13/2007 | US7177068 Apparatus, method and system for providing enhanced mechanical protection for thin beams |
02/13/2007 | US7176106 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
02/08/2007 | WO2007015650A1 A microfabricated device |
02/08/2007 | US20070029659 MEMS RF switch module including a vertical via |
02/08/2007 | DE102006033693A1 Hindernisdetektor mit Ultraschallsensor The obstacle detection with ultrasonic sensor |
02/07/2007 | CN1910111A Optical assembly with variable optical attenuator |
02/07/2007 | CN1910109A Film actuator based mems device and method |
02/06/2007 | US7173363 System and method for moving an object employing piezo actuators |
02/06/2007 | US7173332 Placement tool for wafer scale caps |
02/06/2007 | US7173314 Storage device having a probe and a storage cell with moveable parts |
02/06/2007 | US7172916 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
02/06/2007 | US7172911 Deflectable microstructure and method of manufacturing the same through bonding of wafers |
02/06/2007 | US7172735 Modular microreaction system |
02/01/2007 | WO2007014095A2 End effector for nano manufacturing |
02/01/2007 | WO2007012992A1 A package and manufacturing method for a microelectronic component |
02/01/2007 | US20070024159 Micro-resonator and communication apparatus |
01/31/2007 | EP1748030A2 Method and apparatus for statistical characterization of nano-particles |
01/31/2007 | EP1748029A2 Micro-mirror device package and method for fabricating the same |
01/31/2007 | EP1747169A1 Vent closing method and the use of an ultrasonic bonding machine for carrying out said method |
01/31/2007 | CN1906120A Semiconductor assembly with conductive rim and method of producing the same |
01/31/2007 | CN1906038A Inkjet printer system with removable cartridge |
01/31/2007 | CN1903701A Multi oxometallate and amination calixarene self assembled organic-inorganic composite film |
01/30/2007 | US7170155 MEMS RF switch module including a vertical via |