Patents for B81B 7 - Micro-structural systems (8,983)
09/2007
09/05/2007EP1829819A2 Passive thermal isolation structure
09/05/2007EP1828048A1 Multisensor assembly
09/05/2007CN101030548A Micro-mechanical wafer chip test detecting card and its production
09/05/2007CN101030033A Production of MEMS suspending structure by laminated photoetching glue victim layer
09/05/2007CN100335905C Microstructure with movable mass
09/05/2007CN100335278C Buckle resistant thermal bend actuators
09/04/2007US7265429 System and method of fabricating micro cavities
09/04/2007US7263885 Physical quantity sensor having sensor chip and circuit chip
09/04/2007US7263883 Gyro-sensor comprising a plurality of component units, and fabricating method thereof
08/2007
08/30/2007WO2007098277A2 6-axis electromagnetically-actuated meso-scale nanopositioner
08/30/2007US20070202627 Silicon Condenser Microphone and Manufacturing Method
08/30/2007US20070201715 Silicon Condenser Microphone and Manufacturing Method
08/30/2007DE102007007178A1 Kapazitive mikrobearbeitete Ultraschalltransducer und Verfahren zur Herstellung derselben Capacitive micromachined ultrasonic transducers and method of producing same
08/29/2007CN101024481A Micro electro mechanical system, semiconductor device, and manufacturing method thereof
08/28/2007US7263674 System and method for three-dimensional visualization and postprocessing of a system model
08/28/2007US7262522 Microelectromechanical isolating power converter
08/28/2007US7262509 Microelectronic assembly having a perimeter around a MEMS device
08/23/2007WO2007010361A3 A mems package using flexible substrates, and method thereof
08/23/2007US20070196923 Detecting leaks in micro-optoelectromechanical devices (MOEMS) or microelectromechanical (MEMS) devices; indicator may be copper, which changes optical properties upon oxidation
08/23/2007DE102006007729A1 Micro-electro-mechanical system substrate manufacturing method, involves depositing semiconductor function layer over surface of semiconductor substrate to form membrane region over cavern and connection forming region beside cavern
08/22/2007EP1821570A1 Miniature silicon condenser microphone and method for producing same
08/22/2007EP1819633A2 Galvanically isolated signal conditioning system
08/22/2007CN101023021A Method of making a reflective display device using thin film transistor production techniques
08/21/2007US7259436 Micromechanical component and corresponding production method
08/16/2007DE102006005419A1 Semiconductor component for electronic device, includes walls with photolithographically patterned polymer, and cavity covering having polymer layer, where molecular chains of the polymers are crosslinked to form stable cavity housing
08/16/2007DE102006004218B3 Elektromechanische Speicher-Einrichtung und Verfahren zum Herstellen einer elektromechanischen Speicher-Einrichtung Electromechanical memory device and method for manufacturing an electromechanical memory device
08/15/2007EP1817546A1 Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems
08/15/2007EP1301346B1 Buckle resistant thermal bend actuators
08/15/2007CN2935473Y Reinforced micro-electromechanical packaging structure
08/15/2007CN1332179C Differential capacitive type MEMS sensor apparatus with capacitance compensator having MEMS structure
08/15/2007CN1331727C Micromachine production method
08/14/2007US7256127 Air gap formation
08/09/2007DE102007003810A1 Ultraschallwellen-Erzeugungsvorrichtung Ultrasonic wave generating device
08/09/2007DE102006003718A1 Fertigungsprozess für integrierte mikroelektro-mechanische Bauelemente Manufacturing process for integrated micro-electro-mechanical components
08/08/2007EP1207378B1 Semiconductor pressure sensor and pressure sensing device
08/08/2007EP1200262B1 Seal in micro electro-mechanical ink ejection nozzle
08/08/2007CN101013197A Device on a transparent substrate and method for alignment forming and micro mechanical-electric device
08/02/2007WO2007087247A2 Wafer level chip packaging
08/02/2007US20070177246 Micromechanical Getter Anchor
08/02/2007DE202007006274U1 Integriertes Multi-Sensor-Modul Integrated multi-sensor module
08/02/2007DE10238843B4 Halbleiterbauelement Semiconductor device
08/02/2007DE102005056941B3 Vibrationswandler Vibration transducer
08/01/2007EP1813571A2 Sealed structure and method of fabricating the sealed structure
08/01/2007EP1714265B1 Mechanical structure including a layer of polymerised liquid crystal and method of manufacturing such
08/01/2007EP1463610B1 Sampling and gripper device
08/01/2007CN1329284C Fabrication of a reflective spatial light modulator
08/01/2007CN101010140A Micro-fluidic system
07/2007
07/26/2007WO2007084070A1 Miniaturized high conductivity thermal/electrical switch
07/26/2007WO2007034276B1 Apparatus for downhole fluids analysis utilizing micro electro mechanical systems (mems) or other sensors
07/26/2007DE19906067B4 Halbleitersensor für physikalische Größen und Verfahren zu dessen Herstellung A semiconductor sensor of physical quantities and methods for its preparation
07/26/2007DE102006059091A1 Mikrooptisches reflektierendes Bauelement Microoptical reflective component
07/26/2007DE102006001321B3 Switching device, has two signal lines and ground lines which are controlled by plated-through hole through laminar extending substrate, where signal lines surrounded by ground lines
07/26/2007CA2637414A1 Miniaturized high conductivity thermal/electrical switch
07/25/2007CN1328058C Pagewidth printing assembly
07/25/2007CN1328052C Ink jet nozzle assembly including displaceable ink pusher
07/25/2007CN1328051C Pusher actuation in a printhead chip for an inkjet printhead
07/25/2007CN101006748A Silicon condenser microphone and manufacturing method
07/25/2007CN101005097A Semiconductor pressure resistance type sensor and its operation method
07/24/2007US7248128 Reference oscillator frequency stabilization
07/24/2007US7247246 Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
07/19/2007DE102006061886A1 Ultraschallsensor Ultrasonic sensor
07/19/2007DE102006001493A1 MEMS-Sensor und Verfahren zur Herstellung MEMS sensor and methods for preparing
07/18/2007EP1301345B1 Method of manufacture of an ink jet printhead having a moving nozzle with an externally arranged actuator
07/18/2007EP1292450B1 Ink jet printhead nozzle array
07/18/2007CN2924545Y Capacitive microwave power sensor
07/18/2007CN101000968A Stack silicon-base miniature fuel celles and manufacturing method
07/18/2007CN101000800A XY stage module, storage system employing the same and method for fabricating the xy stage module
07/12/2007WO2007076820A2 Ultrasonic transducer comprising a self-supporting matching layer, and method for the production thereof
07/12/2007US20070158775 Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch
07/11/2007EP1806782A2 Method for manufacturing semiconductor device
07/11/2007EP1806613A1 Two-axis micro optical scanner
07/11/2007EP1806316A2 Mems device seal using liquid crystal polymer
07/11/2007EP1806315A2 Discrete stress isolator
07/11/2007EP1805101A1 Method for assembling semiconductor chips, and corresponding semiconductor chip assembly
07/11/2007EP1115649B1 Micromechanical component with sealed membrane openings
07/11/2007CN1997588A Nanowire device with (111) vertical sidewalls and method of fabrication
07/11/2007CN1994861A All-optical micromachine non-frigorific infrared thermal imaging chip structure and its production method
07/11/2007CN1326225C Micro-mechanical chip testing card and producing method thereof
07/11/2007CN1325264C Ink jet printhead chip and method of producing the same, ink jet printhead
07/11/2007CN1325228C Manipulator
07/10/2007US7242509 MEMS Fabry Perot filter for integrated spectroscopy system
07/10/2007US7242089 Miniature silicon condenser microphone
07/10/2007CA2414735C Seal in micro electro-mechanical ink ejection nozzle
07/05/2007WO2007074821A1 Spring, mirror element, mirror array and optical switch
07/05/2007WO2007074018A1 Micromechanical component having a cap with a closure
07/05/2007WO2007074017A1 Micromechanical component having a cap
07/05/2007US20070151099 Direct integration of inorganic nanowires with micron-sized electrodes
07/05/2007DE19830476B4 Halbleitervorrichtung insbesondere Sensor Semiconductor device, in particular sensor
07/05/2007DE102006061763A1 Micro mirror for use in micro-mirror device, has reflection mirror and torsion bars protruding from reflection mirror where carrier frame holds reflection mirror such that reflection mirror rotates over torsion bars around axis of rotation
07/05/2007DE102006061762A1 Micro mirrors for e.g. used as scanner for bar code reader, has retaining unit in which mirror is retained in such way that it tilts about mirror pivotal axis and mirror has two fixed electrode groups with multiple electrodes
07/05/2007DE102006061182A1 Ultraschall-Sensor Ultrasonic sensor
07/05/2007DE102005061343A1 Ultrasonic transducer for use in e.g. medical catheter systems, comprises piezo-active transducer layer which is embodied as non-self-supporting layer
07/04/2007EP1804110A1 Mirror package and method of manufacturing the mirror package
07/03/2007US7238546 Hermetically sealed micro-device package with window
07/03/2007US7238429 Ultra-hard low friction coating based on A1MgB14 for reduced wear of MEMS and other tribological components and system
07/03/2007CA2426483C Mems-based integrated magnetic particle identification system
06/2007
06/28/2007US20070145542 Nano-wire electrode structure
06/28/2007US20070144906 Method of actuating and an actuator
06/28/2007DE102006002177B3 Infrarot-Mikrosensor Infrared micro sensor
06/27/2007CN1988246A Laminated filter based on MEMS technology
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