| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 11/28/2007 | EP1860417A2 A pressure sensor having a chamber and a method for fabricating the same |
| 11/28/2007 | EP1860061A2 Integrated die level isolation for a mems device |
| 11/28/2007 | EP1860060A1 Method and apparatus for mixing microdroplets |
| 11/28/2007 | EP1859482A1 Thin film getter protection |
| 11/28/2007 | EP1858796A2 Methods and apparatus for actuating displays |
| 11/28/2007 | EP1738172B1 Method for functionalizing biosensor chips |
| 11/28/2007 | EP1150318B1 Micromachine switch and its production method |
| 11/28/2007 | CN200981818Y 玻璃基底光学读出红外传感器 Glass substrate optical pickup infrared sensor |
| 11/28/2007 | CN101080359A Compression and cold weld sealing methods and devices |
| 11/28/2007 | CN101077766A Electromechanical element and electronic circuit device, and method for manufacturing the same |
| 11/28/2007 | CN100351995C Method for producing and testing a corrosion-resistant channel in a silicon device |
| 11/27/2007 | US7301223 High temperature electronic devices |
| 11/27/2007 | US7300823 Apparatus for housing a micromechanical structure and method for producing the same |
| 11/22/2007 | WO2007131823A1 Chip housing with reduced coupled-in vibration |
| 11/22/2007 | WO2007038179A3 Microscopic electro-mechanical systems, radio frequency devices utilizing nanocoils and spiral pitch control techniques for fabricating the same |
| 11/22/2007 | DE102006022379A1 Micromechanical pressure transducer for capacitive microelectromechanical system microphone, has substrate-sided cavity forming back volume for movable membrane, and resting at application-specific integrated circuit chip |
| 11/21/2007 | EP1855986A2 Methods and apparatus for spatial light modulation |
| 11/21/2007 | CN100350292C Two-dimensional micro-electromechanical optical switch using shuffle Benes interstage join rule and method thereof |
| 11/20/2007 | US7297573 Methods and apparatus for particle reduction in MEMS devices |
| 11/15/2007 | WO2007128096A1 System and method for measuring magnetic field strength using a mechanical resonator |
| 11/15/2007 | WO2007128045A1 Microfluidic systems using surface acoustic energy and method of use thereof |
| 11/15/2007 | DE102007021616A1 Ultraschallsensor Ultrasonic sensor |
| 11/15/2007 | DE102006020716A1 Microfluidic-processor for use in e.g. biomedical industry, has integrated polymer network-based units that are interconnected in logical base configuration and controllable over interfaces by superior system |
| 11/14/2007 | EP1854760A2 Semiconductor device and method of manufacturing the same |
| 11/13/2007 | US7294894 Micromechanical cap structure and a corresponding production method |
| 11/08/2007 | US20070258120 Micro-electro mechanical system scanner having structure for correcting declined scan line |
| 11/08/2007 | DE19808193B4 Leadframevorrichtung und entsprechendes Herstellungsverfahren Leadframe device and corresponding manufacturing method |
| 11/07/2007 | CN101066750A Micro electromechanical packaging structure for wind direction sensor |
| 11/06/2007 | US7292344 Integrated spectroscopy system |
| 11/06/2007 | US7291921 Structure of a micro electro mechanical system and the manufacturing method thereof |
| 11/01/2007 | WO2007122330A1 Piezoelectric micro-system for the active vibratory insulation of vibration sensitive components |
| 11/01/2007 | WO2007021813A3 Microfluidic system and methods |
| 11/01/2007 | US20070254454 Process for bonding and electrically connecting microsystems integrated in several distinct substrates |
| 10/31/2007 | EP1295389B1 Nano-electromechanical filter |
| 10/31/2007 | CN101064197A Micro-socle girder resonator with low temperature cross sensitivity |
| 10/30/2007 | US7288940 Galvanically isolated signal conditioning system |
| 10/25/2007 | WO2007118755A1 Micromechanical component with wafer through-plating and corresponding production method |
| 10/25/2007 | US20070247714 Security Device |
| 10/25/2007 | US20070247693 Method and system for packaging a mems device |
| 10/25/2007 | DE10241344B4 Waferebenengehäuse mit Siliziumdichtung Wafer-level housing with silicon seal |
| 10/25/2007 | DE102006018027A1 Mikromechanisches Bauelement mit Waferdurchkontaktierung sowie entsprechendes Herstellungsverfahren Micromechanical component with through-wafer via and corresponding production method |
| 10/24/2007 | EP1847509A2 Mechanical isolation for MEMS devices |
| 10/23/2007 | US7286278 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 10/23/2007 | US7285897 Curved micromachined ultrasonic transducer arrays and related methods of manufacture |
| 10/23/2007 | US7285844 Multiple internal seal right micro-electro-mechanical system vacuum package |
| 10/23/2007 | US7285834 Process for producing microelectromechanical components and a housed microelectromechanical component |
| 10/23/2007 | US7284976 Moulding assembly for forming at least one protective cap |
| 10/18/2007 | WO2007117447A2 Mems device package with thermally compliant insert |
| 10/18/2007 | WO2007117198A1 Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such |
| 10/18/2007 | US20070243654 Microelectromechanical device with integrated conductive shield |
| 10/18/2007 | US20070243413 Thermoelastic Device With Preselected Resistivity, Inertness And Deposition Characteristics |
| 10/18/2007 | DE102006016260A1 Mikromechanische Gehäusung mit mindestens zwei Kavitäten mit unterschiedlichem Innendruck und/oder unterschiedlicher Gaszusammensetzung sowie Verfahren zu deren Herstellung Micromechanical Gehäusung with at least two cavities having different internal pressures and / or different gas composition, as well as processes for their preparation |
| 10/18/2007 | DE102006001493B4 MEMS-Sensor und Verfahren zur Herstellung MEMS sensor and methods for preparing |
| 10/18/2007 | DE10056716B4 Mikrostrukturbauelement Microstructure component |
| 10/17/2007 | EP1845061A2 Method for making via holes filled with conductive material in MEMS devices and device with such vias |
| 10/17/2007 | EP1843971A1 Method for encapsulating a device in a microcavtiy |
| 10/17/2007 | CN101054157A Electronic apparatus element and manufacturing method thereof, and resonator and manufacturing method thereof |
| 10/17/2007 | CN100343949C Micro-switching element fabrication method and micro-switching element |
| 10/16/2007 | US7282393 Microelectromechanical device packages with integral heaters |
| 10/16/2007 | US7282388 Method of manufacturing wafer level package type FBAR device |
| 10/16/2007 | US7282383 Micromachine production method |
| 10/11/2007 | WO2007113325A1 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof |
| 10/10/2007 | EP1841688A1 Packaging of micro devices |
| 10/10/2007 | EP1379884B1 Sensor |
| 10/10/2007 | CN101052865A System and method of testing humidity in a sealed mems device |
| 10/06/2007 | CA2584145A1 Piano mems with hidden hinge |
| 10/05/2007 | CA2584084A1 Multi-port monolithic rf mems switches and switch matrices |
| 10/04/2007 | DE102006007800B3 Strukturierungsverfahren und Bauteil mit einer strukturierten Oberfläche Patterning method and device with a structured surface |
| 10/04/2007 | DE10140322B4 Mikrostrukturierter dreidimensionaler Sensor oder Aktor, sowie Verfahren zu seiner Herstellung Microstructured three-dimensional sensor or actuator, as well as methods for its preparation |
| 10/03/2007 | CN101047149A Manufacturing method for non-refrigeration infrared focal plane array based on silicon substrate without sacrifice layer |
| 10/03/2007 | CN101046487A Microelectromechanical microwave powersensor with two balanced thermopiles and its prepn process |
| 10/02/2007 | US7276789 Microelectromechanical systems using thermocompression bonding |
| 10/02/2007 | US7275434 Micromechanical component |
| 10/02/2007 | US7275424 Wafer level capped sensor |
| 09/27/2007 | US20070222056 Encapsulated Electrical Component and Production Method |
| 09/27/2007 | US20070220882 6-Axis electromagnetically-actuated meso-scale nanopositioner |
| 09/26/2007 | EP1837303A1 Integrated pedestal mount for mems structure |
| 09/26/2007 | EP1836123A1 Method for generation of a given internal pressure in a cavity of a semiconductor component |
| 09/26/2007 | CN101044088A Method for assembling semiconductor chips, and corresponding semiconductor chip assembly |
| 09/26/2007 | CN101043030A Semiconductor integrated circuit with electrostatic actuator driving circuit, mems, and method for driving electrostatic actuator |
| 09/26/2007 | CN101041292A Methods for producing piezoelectric actuator, ink-jet head, and ink-jet printer |
| 09/25/2007 | US7274096 Light transmissive cover, device provided with same and methods for manufacturing them |
| 09/25/2007 | US7273764 Sensor with at least one micromechanical structure, and method for producing it |
| 09/19/2007 | EP1834924A2 Packaging of a microelectronic component, in particular a MEMS, in an airtight cavity |
| 09/19/2007 | CN101037186A MEMS automatic leading interlinking equipment based on zoom microscope location |
| 09/18/2007 | US7272511 Functionalizing carbon nanotubes so that they are suitable for making contacts with DNA strands;contacting nanoelectrodes to first ends of the DNA strands, and nanotubes to the other end of the DNA strands through benzyne rings |
| 09/18/2007 | US7271028 High density electronic interconnection |
| 09/18/2007 | US7270905 Microsystem process networks |
| 09/18/2007 | US7270475 Thermoelastic device comprising an expansive element formed from a preselected material |
| 09/13/2007 | WO2007103224A2 Structure and method of making lidded chips |
| 09/13/2007 | WO2007101916A1 Device and method for measuring electrical power |
| 09/13/2007 | US20070209437 Magnetic MEMS device |
| 09/13/2007 | DE102006010484A1 Bewegungssensor Motion sensor |
| 09/12/2007 | EP1454333B1 Mems device having a trilayered beam and related methods |
| 09/12/2007 | CN100337093C Physical quantity sensor having sensor chip and circuit chip |
| 09/11/2007 | US7268435 Capacitive semiconductor sensor |
| 09/11/2007 | CA2311466C Integrated circuit biochip microsystem |
| 09/06/2007 | US20070204681 Carbon thin line probe |
| 09/06/2007 | DE102006008584A1 Fertigungsprozess für integrierte Piezo-Bauelemente Manufacturing process for integrated piezo-elements |
| 09/06/2007 | DE102006004209B3 Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements Micromechanical component and process for producing a micromechanical component |