Patents for B81B 7 - Micro-structural systems (8,983)
04/2008
04/30/2008EP1915214A2 Flow reactor method and apparatus
04/30/2008DE19829609B4 Verfahren zur Herstellung eines Mikrosystems A process for producing a microsystem
04/30/2008DE102007030986A1 Electrical component i.e. micromechanical sensor, has contact units provided as solder beads and/or copper supports and arranged at side of one of chips, and cover partially surrounding chip at side and/or partially surrounding other chip
04/30/2008DE102006049258A1 Micromechanical element for use as infrared image sensor, has thermocouple with two thermal side pieces that are provided columnar and perpendicular to main extending plane of substrate, where substrate is provided as plastic substrate
04/30/2008CN101170002A RF micro-inductance with suspending structure and its making method
04/30/2008CN101168434A MEMS device
04/30/2008CN100385657C Electronic device and method of manufacturing the same
04/29/2008CA2482025C Symmetrically actuated ink ejection components for an ink jet printhead chip
04/24/2008WO2007127107A3 Microfabricated devices and method for fabricating microfabricated devices
04/24/2008US20080096313 Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
04/24/2008US20080093689 Flip-chip assembly of protected micromechanical devices
04/24/2008US20080093605 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry
04/24/2008DE19734530B4 Halbleiterbeschleunigungssensor Semiconductor acceleration sensor
04/24/2008DE102006052630A1 Mikromechanisches Bauelement mit monolithisch integrierter Schaltung und Verfahren zur Herstellung eines Bauelements Micromechanical component with a monolithic integrated circuit and method for producing a component
04/23/2008EP1913641A1 A package and manufacturing method for a microelectronic component
04/23/2008EP1407278B1 Acceleration sensor
04/23/2008CN101167187A Wafer-level sealed microdevice having trench isolation and methods for making the same
04/23/2008CN101166690A MEMS actuators and switches
04/23/2008CN101164863A Mems device and fabrication method thereof
04/22/2008CA2414708C Seal in micro electro-mechanical ink ejection nozzle
04/17/2008WO2008043122A1 Mems bubble generator for large stable vapor bubbles
04/17/2008WO2008012713A3 Frame and method of manufacturing assembly
04/17/2008US20080087545 Microchemical method and apparatus for synthesis and coating of colloidal nanoparticles
04/17/2008DE102006042764B3 Base or cover wafer for producing cavity for multiplicate component, has getter test array arranged such that getter test array comes to lie in cavity, where array exhibits small getter material surface than gas absorption array surface
04/17/2008CA2662725A1 Mems bubble generator for large stable vapor bubbles
04/16/2008CN101163638A Device and use thereof
04/15/2008US7359103 Transmission type spatial light modulator and transmission type spatial light modulation array device
04/15/2008US7358966 Selective update of micro-electromechanical device
04/15/2008US7357485 Inkjet printhead having row of nozzle actuators interleaved with nozzles of adjacent row
04/15/2008US7357017 Wafer level capped sensor
04/10/2008DE102006047203A1 Microphone arrangement for use in e.g. portable radio communication device, has pile arrangement with semiconductor body comprising microphone structure, and another semiconductor body comprising main surface
04/09/2008EP1907160A1 Laser assisted system and method for bonding of surfaces ; microcavity for packaging mems devices
04/09/2008CN101159171A Semiconductor probe having wedge shape resistive tip and method of fabricating the same
04/09/2008CN101158582A Difference measurement method for MEMS gyroscopes
04/09/2008CN101158447A Devices and methods for programmable microscale manipulation of fluids
04/09/2008CN100380800C Electrostatic driver
04/09/2008CN100380129C Acceleration sensor
04/03/2008DE102007046031A1 Ultraschallsensor Ultrasonic sensor
04/03/2008DE102006046224A1 Electro-mechanical component i.e. piezoelectric resistive micro electromechanical system pressure sensor, for detecting measuring data in e.g. compressor, has piezo-resistive channel applied on surface of diaphragm layer
04/02/2008EP1905733A2 Packaged electronic component
04/02/2008CN101156242A Method for the production of enclosed electronic components, and enclosed electronic component
04/02/2008CN101154505A Structure of rotating micro-mechanical variable capacitor against influence of ambient vibration
04/02/2008CN101153821A Measurement apparatus and measurement method
04/02/2008CN101153820A Measurement apparatus and measurement method
04/02/2008CN101152955A Method of making microstructure device, and microstructure device made by the same
04/02/2008CN101152954A Packaging structure for electric component of microcomputer
04/02/2008CN100378889C Acceleration switch
04/01/2008US7352040 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
03/2008
03/27/2008WO2008034233A1 Integrated mems packaging
03/27/2008US20080074728 Micro-electro mechanical device, micro-electro mechanical device array, light modulation device, micro-electro mechanical light modulation device, micro-electro mechanical light modulation device array and image forming apparatus using the same
03/27/2008US20080074720 Imaging apparatus having print engine that includes MEMS device
03/27/2008US20080073766 System for manufacturing microelectronic, microoptoelectronic or micromechanical devices
03/27/2008DE102007038169A1 Verfahren zum Verpacken auf Waferebene unter Verwendung von Waferdurchgangslöchern mit geringem Aspektverhältnis A method of packaging at the wafer level using wafer through holes with a low aspect ratio
03/27/2008CA2663392A1 Integrated mems packaging
03/26/2008EP1903000A2 Implantable biocompatible component including an integrated active element such as a sensor for measuring a physiological parameter, electromechanical microsystem or electronic circuit
03/26/2008CN101151207A Methods and apparatus for spatial light modulation
03/26/2008CN101151206A Methods and apparatus for actuating displays
03/26/2008CN101150117A Semiconductor encapsulation structure and its making process
03/26/2008CN101150008A Polymer substrate double plane electromagnetic coil production method
03/26/2008CN101148242A Electronic detection device and detector comprising such a device
03/26/2008CN100377333C Semiconductor structure with one or more through-holes
03/25/2008US7348203 Hermetic packaging
03/20/2008WO2008032785A1 Shield case and mems microphone having the same
03/20/2008WO2007120885A3 Mems devices and processes for packaging such devices
03/20/2008US20080067655 Device Comprising an Encapsulated Microsystem and Production Method Thereof
03/20/2008DE102006040115A1 Verfahren und Anordnung zur hermetisch dichten vertikalen elektrischen Durchkontaktierung von Deckscheiben der Mikrosystemtechnik Method and apparatus for hermetically sealed vertical electric throughplating shields of microsystem technology
03/19/2008EP1900680A2 Cap wafer having electrodes
03/19/2008EP1675803B1 Methods and systems for providing mems devices with a top cap and upper sense plate
03/18/2008US7345807 Laminated package
03/18/2008CA2598596A1 Electronic detection device and the detector equipped with the device
03/18/2008CA2458689C Inkjet collimator
03/13/2008US20080061031 Nano-gripper and method of producing same
03/13/2008US20080060700 Method and apparatus for generating large pressures on a microfluidic chip
03/13/2008DE102006045900A1 Sensor module manufacturing method, arranging sensor with sensing area on support and sensing area represents support and matrial is applied to sensor and support is removed from sensing area
03/13/2008DE102006040658A1 Micromechanical sensor arrangement, has substrate with thickness of less than hundred pico meters and connected with another substrate in elongation firm manner by hard connecting layer in particular sealing glass or metal solder layers
03/12/2008CN101140185A Non-refrigerate infrared focal plane array seeker and preparation method thereof
03/12/2008CN101138663A Preparation method of biological microelectrode array based on flexible substrate
03/11/2008US7342703 Micro-mechanical beam protective support structures wherein at least two adjacent support structures touch each other upon reaching a predetermined bending action
03/11/2008US7342349 Piezoelectric actuator array and manufacturing method
03/06/2008WO2008025725A1 Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (mems) produced therewith
03/06/2008WO2007010361A8 A mems package using flexible substrates, and method thereof
03/06/2008US20080055699 Structure of a micro electro mechanical system and the manufacturing method thereof
03/06/2008US20080055689 Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirror
03/06/2008US20080053254 Microstructured Sensor
03/05/2008EP1895669A2 RFIC with On-chip acoustic transducer circuit
03/05/2008CN101135704A Microelectron mechanical microwave signal phase detector and method for preparing the same
03/05/2008CN101135563A Double quality blocks attune output type silicon MEMS gyroscopes
03/05/2008CN101135560A Crewel vibrating silicon micro-gyroscopes
03/05/2008CN101135559A Double quality oscillatory type silicon micro-gyroscopes
03/04/2008US7338839 Method for producing an electrical component
03/04/2008US7338102 Manipulator
02/2008
02/27/2008EP1890803A1 Microfluidic circulating device for determining parameters of a physical and/or chemical transformation, and use thereof
02/27/2008CN101131407A Microelectron-mechanical reconfigurable broad band microwave power detector and method of manufacturing the same
02/27/2008CN101131354A Micro-cantilever beam sensor with triangular structure and manufacturing method thereof
02/27/2008CN101130426A Micro-electromechanical systems device and manufacturing method thereof
02/27/2008CN100371763C Projection display and packaged micromirror array for the projection display
02/27/2008CN100371065C Microreactor
02/26/2008US7335971 Method for protecting encapsulated sensor structures using stack packaging
02/26/2008US7334491 Sensor arrangement, in particular a micro-mechanical sensor arrangement
02/21/2008WO2008019786A1 Method for bonding work pieces made of stainless steel, nickel or nickel alloys using a bonding layer consisting of ni ckel- phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method
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