| Patents for B81B 7 - Micro-structural systems (8,983) |
|---|
| 02/21/2008 | WO2007143623A3 Methods and systems for micro machines |
| 02/21/2008 | US20080041817 Structure of a micro electro mechanical system and the manufacturing method thereof |
| 02/21/2008 | US20080041607 Microcomponent Comprising a Hermetically-Sealed Microcavity and Method for Production of Such a Microcomponent |
| 02/20/2008 | EP1890180A1 Lens unit |
| 02/20/2008 | EP1889681A1 Process of joining workpieces made of stainless, Nickel or Nickel alloys using a joining layer made from a Nickel-Phosphor alloy ; Process of manufacturing a micro workpiece using such a process ; micro workpiece with a joining layer achieved through such a process |
| 02/20/2008 | CN101127514A A plane capacitance resonator and its making method |
| 02/19/2008 | US7332406 Air gap interconnect structure and method |
| 02/14/2008 | WO2007103224A3 Structure and method of making lidded chips |
| 02/14/2008 | US20080038577 Component Arrangement Provided With a Carrier Substrate |
| 02/14/2008 | US20080038518 Air gap formation |
| 02/13/2008 | EP1886333A1 Rotary switch cross connect matrix system |
| 02/13/2008 | CN101123231A Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method |
| 02/13/2008 | CN101121497A Carbon nano-tube composite material and preparation method thereof |
| 02/12/2008 | CA2467174C Differential stress reduction in thin films |
| 02/07/2008 | US20080029878 Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers |
| 02/06/2008 | EP1565932B1 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 02/06/2008 | CN101118313A Low temperature fabrication of conductive micro structures |
| 02/06/2008 | CN101118250A Silicon MEMS piezoresistance type acceleration sensor |
| 02/06/2008 | CN100367527C Capacitor type semiconductor pressure sensor |
| 02/05/2008 | US7327037 High density nanostructured interconnection |
| 02/05/2008 | US7326448 Film of reaction product of surface treated silica particles and an acrylated urethane oligomer (2,2,4-trimethylhexamethylene diisocyanate-polycaprolactone diol-hydroxyethyl methacrylate); increasing the brightness of a backlit flat panel display |
| 01/31/2008 | WO2008012846A1 Planar microelectromechanical device having a stopper structure for out-of-plane movements |
| 01/31/2008 | DE102005018867B4 Piezoelektrischer Mikro-Power Wandler Piezoelectric Micro-power converter |
| 01/31/2008 | DE102005017452B4 Mikroverdampfer Microevaporator |
| 01/30/2008 | CN101115675A Multisensor assembly |
| 01/30/2008 | CN100365808C Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head |
| 01/29/2008 | US7324350 MEMS RF switch module including a vertical via |
| 01/29/2008 | US7323766 Sensor module |
| 01/29/2008 | US7322622 Nano-gripper and method of producing same |
| 01/24/2008 | US20080018975 MEMS Device with a Closed Cellular Core Sandwiched Structure |
| 01/24/2008 | US20080017974 Apparatus for housing a micromechanical structure |
| 01/24/2008 | DE102004002908B4 Verfahren zum Herstellen eines Halbleiterbauelements oder einer mikromechanischen Struktur A method of manufacturing a semiconductor device or a micromechanical structure |
| 01/23/2008 | CN101110428A Multi-layer insulator silicon material used for MEMS and method thereof |
| 01/23/2008 | CN101109635A Micro-mechanical gyroscope based on tunneling effect |
| 01/23/2008 | CN101108720A Micro electro mechanical device and manufacturing method thereof |
| 01/23/2008 | CN100363775C Light interference display panel and its mfg. method |
| 01/22/2008 | US7321714 Moisture-resistant nano-particle material and its applications |
| 01/22/2008 | CA2450412C Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 01/17/2008 | WO2008006976A1 Integrated circuit distributed over at least two non-parallel planes and its method of production |
| 01/17/2008 | WO2008006651A1 Method for producing a sensor element and sensor element |
| 01/17/2008 | WO2008006140A1 Mems bubble generator |
| 01/17/2008 | US20080014124 Sample processing devices, systems and methods |
| 01/17/2008 | US20080013145 Microelectromechanical device with optical function separated from mechanical and electrical function |
| 01/17/2008 | US20080013144 Microelectromechanical device with optical function separated from mechanical and electrical function |
| 01/17/2008 | US20080011814 Method and System for Self-Aligning Parts in Mems |
| 01/17/2008 | CA2655322A1 Mems bubble generator |
| 01/16/2008 | EP1878692A1 Semiconductor package substrate, in particular for MEMS devices |
| 01/10/2008 | US20080009091 Wafer Level Capped Sensor |
| 01/09/2008 | EP1876453A1 Integrated chip temperature control |
| 01/09/2008 | EP1875224A1 Method for preparing monolithic separation and reaction media in a separation or reaction channel |
| 01/09/2008 | CN101102962A Galvanically isolated signal conditioning system |
| 01/09/2008 | CN100361272C Multilayer device and its producing method |
| 01/09/2008 | CN100360269C Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
| 01/03/2008 | WO2007087247A3 Wafer level chip packaging |
| 01/03/2008 | US20080001306 High density nanostructured interconnection |
| 01/03/2008 | US20080000948 Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method |
| 01/02/2008 | EP1871605A1 Mems fluid sensor |
| 01/02/2008 | CN101098825A Mems packaging with improved reaction to temperature changes |
| 01/02/2008 | CN100359653C Method for connecting substrates and composite element |
| 01/02/2008 | CN100359354C Micro-full analytical system chip height positioning method |
| 01/01/2008 | US7314816 Masking layer in substrate cavity |
| 12/27/2007 | WO2007149475A2 Method for packaging an optical mems device |
| 12/27/2007 | WO2007117447A3 Mems device package with thermally compliant insert |
| 12/27/2007 | WO2007087249A3 Wafer level packaging to lidded chips |
| 12/27/2007 | WO2007053527A3 Projection display system including a high fill ratio silicon spatial light modulator |
| 12/27/2007 | US20070298542 Multiple internal seal ring micro-electro-mechanical system vacuum packaging method |
| 12/27/2007 | DE102007027127A1 Composite sensor for detecting tire`s e.g. air pressure, has membrane and pressure sensor substrate that contact silicon substrate, and reference pressure chamber arranged between substrate and membrane |
| 12/27/2007 | DE102006028435A1 Sensor und Verfahren zu seiner Herstellung Sensor and method for its preparation |
| 12/27/2007 | DE102006002423A1 Scanvorrichtung Scanning device |
| 12/26/2007 | CN101095239A High temperature memory device |
| 12/26/2007 | CN101093817A Structure for packaging semiconductor, fabricating method |
| 12/26/2007 | CN101093204A Sensor for self-testing self-oscillation of resonant-type tiny cantilever beam |
| 12/25/2007 | US7312912 Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirror |
| 12/25/2007 | US7312677 Micro-switching element fabrication method and micro-switching element |
| 12/20/2007 | DE102006027619A1 Light-optical controlling device for temperature-sensitive structures, particularly hydraulic gel structures, has ray of light projected by element controllable in light transmission one temperature-sensitive structure |
| 12/20/2007 | DE102006026878A1 Pre-mold housing for receiving chip structure, has base plate connected with micro-mechanical sensor chip and housing part that is fastened to support structure, which supports entire housing, where plate is not in contact with housing part |
| 12/19/2007 | EP1866235A2 Mems actuators and switches |
| 12/19/2007 | CN100356566C Semiconductor device with micro electromechanical system |
| 12/18/2007 | US7309517 Durable optical element |
| 12/18/2007 | US7309476 Diamondoid-based components in nanoscale construction |
| 12/18/2007 | US7308747 Method of positioning a platform relative to a fixed frame and a small scale positioning device |
| 12/13/2007 | WO2007115028A3 Microstructured tool and method of making same using laser ablation |
| 12/13/2007 | WO2005005554A3 Moisture-resistant nano-particle material and its applications |
| 12/13/2007 | DE112005003370T5 MEMS-Verkapselung mit verbesserter Reaktion auf Temperaturänderungen MEMS encapsulation with improved response to temperature changes |
| 12/13/2007 | DE102006025553A1 Verfahren zum Herstellen einer elektronischen Baueinheit, zugehörige Baueinheit und Baugruppe mit mindestens einer solchen Baueinheit A method of manufacturing an electronic assembly, and related assembly module having at least one such assembly |
| 12/13/2007 | DE102004058880B4 Integrierter Mikrosensor und Verfahren zur Herstellung Integrated micro sensor and process for producing |
| 12/11/2007 | US7307775 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 12/11/2007 | US7307425 Receiver electronics proximate antenna |
| 12/06/2007 | US20070281357 Fluidic methods for devices for parallel chemical reactions |
| 12/06/2007 | DE102006024381B3 MEMS Vakuumsensor nach dem Reibungsprinzip MEMS vacuum sensor based on the principle of friction |
| 12/05/2007 | EP1863046A1 Switch array |
| 12/05/2007 | EP1861334A1 Wafer level hermetically sealed mems device |
| 12/05/2007 | EP1861333A2 Compression and cold weld sealing methods and devices |
| 12/05/2007 | EP1561243B1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates |
| 12/05/2007 | CN101082589A System and method of testing humidity in a sealed mems device |
| 12/04/2007 | US7304358 MOS transistor with a deformable gate |
| 11/29/2007 | WO2007136706A1 Desiccant in a mems device |
| 11/29/2007 | WO2007135128A1 Micro component provided with a cavity bounded by a cap with improved mechanical strength |
| 11/29/2007 | DE102006024307A1 Vorrichtung zur Herstellung von Formteilen mit mikrostrukturierter Oberfläche Device for producing moldings having a microstructured surface |
| 11/28/2007 | EP1860418A1 A method for fabricating a pressure sensor using SOI wafers |