Patents for B81B 7 - Micro-structural systems (8,983)
07/2008
07/16/2008EP1234326B1 Integrated packaging of micromechanical sensors and associated control circuits
07/16/2008CN101221911A Packaging micro devices
07/16/2008CN100402850C Microfabricated elastomeric valve and pump systems
07/16/2008CN100402412C Methods and apparatus for high-shear mixing and reacting of materials
07/16/2008CN100402291C Ink jet print head chip
07/16/2008CN100402290C Print head chip with discrete air and nozzle chambers for an inkjet print head
07/15/2008USRE40436 Hermetic seal and method to create the same
07/15/2008CA2370927C Method and apparatus for the manipulation of particles by means of dielectrophoresis
07/10/2008DE10351608B4 Beschleunigungssensor Acceleration sensor
07/10/2008DE102007020755A1 Mikro-Scratch-Antrieb-Aktuator mit niedriger Betriebsspannung Micro scratch drive actuator with low operating voltage
07/09/2008CN101218503A Micromechanical sensor, sensor array and method
07/09/2008CN101216500A Circular and multi-ring shaped axial and radial magnetizing permanent magnetism antimagnetic sensitive mass micro-accelerometer
07/09/2008CN101216499A Circular and multi-ring shaped axial magnetizing permanent magnetism antimagnetic sensitive mass micro-accelerometer
07/09/2008CN101216498A Dual spindle differential capacitance type micromechanical accelerameter
07/09/2008CN101216358A Grid pressure sensing chip and preparation method, pressure distributed sensor
07/09/2008CN101216312A Circular and multi-ring shaped axial and radial magnetizing permanent magnetism antimagnetic rotor electrostatic rotating micro gyroscope
07/09/2008CN101216311A Circular and multi-ring shaped axial and radial magnetizing permanent magnetism antimagnetic rotor induced rotating micro gyroscope
07/09/2008CN101216310A Circular and multi-ring shaped axial and radial magnetizing permanent magnetism antimagnetic rotor charge relaxation rotating micro gyroscope
07/09/2008CN101216309A Circular and multi-ring shaped axial magnetizing permanent magnetism antimagnetic rotor electrostatic rotating micro gyroscope
07/09/2008CN101216308A Circular and multi-ring shaped axial magnetizing permanent magnetism antimagnetic rotor induced rotating micro gyroscope
07/09/2008CN101216307A Circular and multi-ring shaped axial magnetizing permanent magnetism antimagnetic rotor charge relaxation rotating micro gyroscope
07/09/2008CN100401192C Method for fabricating a structure for a microelectromechanical system (MEMS) device
07/09/2008CN100400411C Microactuator device and optical switching system using the same
07/08/2008US7396698 Methods and systems for providing MEMS devices with a top cap and upper sense plate
07/08/2008US7396478 Multiple internal seal ring micro-electro-mechanical system vacuum packaging method
07/03/2008WO2008079381A1 Structures and methods for crystal packaging
07/03/2008WO2008078182A2 Micro-electro-mechanical-system micromirrors for high fill factor arrays and method therefore
07/03/2008WO2008077821A2 Encapsulation module method for production and use thereof
07/03/2008WO2007126537A3 Oscillator system having a plurality of microelectromechanical resonators and method of designing controlling or operating same
07/03/2008US20080158519 Laminated Micromirror Package
07/02/2008EP1706267A4 Inkjet printer system with removable cartridge
07/02/2008EP1389307B1 Sensor arrangement, in particular micro-mechanical sensor arrangement
07/02/2008CN101209812A Capacitance type sensing structure
07/02/2008CN100399575C Micro machinery variable capacitor for realizing high capacity valve regulating range using curved polar plate
07/02/2008CN100399103C Micro-mirror device with dielectrophoretic micro- emulsions
07/01/2008US7393712 Fluidic MEMS device
06/2008
06/26/2008US20080151002 Multi-Coloured Printhead Nozzle Array With Rows Of Nozzle Assemblies
06/26/2008DE19812583B4 Verfahren zur Herstellung eines Bauelementes A method for producing a component
06/26/2008DE102007059977A1 System for generating micro-mechanical oscillations in micro-mechanical cantilever, has oscillator whose specific side is firmly attached to rigid support and opposite side that includes insulating layer to which cantilever is fixed
06/25/2008EP1836123B1 Method for generation of a given internal pressure in a cavity of a semiconductor component
06/25/2008CN101204603A Embedded MENS bioelectrode and preparation technology thereof
06/25/2008CN100397041C Piezoresistive micro mechanical gyro with micro beam straight pull and vertical compression structure and fabricating method thereof
06/19/2008WO2008071545A1 Protection box for a microelectromechanical system including a wiring relay
06/19/2008DE102006061386B3 Integrierte Anordnung, ihre Verwendung und Verfahren zu ihrer Herstellung Integrated arrangement, their use and processes for their preparation
06/19/2008DE102006059084A1 Micromechanical element for use in miniaturized sensors, particularly in safety systems of motor vehicles, includes substrate with micromechanical functional element, where shift sequence is arranged
06/19/2008DE102006058563B3 Mikrospiegel-Aktuator mit Kapselungsmöglichkeit sowie Verfahren zur Herstellung Micromirror actuator with Kapselungsmöglichkeit and methods of making
06/19/2008DE102004062874B4 Mikrofluidchip des Mehrfachkanaltyps und elektrokinetische Mikroleistungszelle, die einen derartigen Mikrofluidchip verwendet The microfluidic chip of the multi-channel type and electrokinetic micro power cell using such a micro fluid chip
06/18/2008EP1931461A1 Microfluidic flow device having at least one connecting channel linking two channels and corresponding method for using same
06/18/2008CN101202272A Sealing structure for MEMS devices and method of the same
06/18/2008CN101201272A Micro bridge for micrometering bolometer
06/17/2008US7388285 Hermetically sealed package for optical, electronic, opto-electronic and other devices
06/12/2008WO2008069551A1 Micro fluidic transportation device and method for manufacturing the same
06/12/2008WO2008021227A3 High profile contacts for microelectromechanical systems
06/12/2008US20080136000 Micromechanical Component Having Multiple Caverns, and Manufacturing Method
06/11/2008EP1928780A2 Mems device and interconnects for same
06/11/2008CN100393387C Component separating device, method of producing the device, and method of separating component by using the device
06/10/2008CA2326455C Wafer-pair having deposited layer sealed chambers
06/05/2008WO2008066087A1 Fine structure device, method for manufacturing the fine structure device and substrate for sealing
06/05/2008US20080130082 Mems processing
06/05/2008DE19804748B4 Anordnung und Verfahren der Isolierung gegen mechanische Spannung bei der Befestigung von Halbleiterchips Arrangement and method of the insulation against mechanical stress at the mounting of semiconductor chips
06/04/2008EP1927575A2 Semiconductor device carrying a micro electro mechanical system
06/04/2008CN100392467C Method and system for projecting images on objects
06/04/2008CN100391825C Non-close parked metal hollow ball shell ordered network structure material and its making method
06/03/2008US7381589 Silicon condenser microphone and manufacturing method
06/03/2008US7380905 Ink jet printhead nozzle array
05/2008
05/30/2008CA2613961A1 Microelectromechanical electric potential sensor
05/30/2008CA2612206A1 Micromirror device with a hybrid actuator
05/29/2008WO2008061832A2 Self-testing micromechanical pressure sensor
05/29/2008WO2008061319A1 Micromechanical resonant arrays and methods of making
05/29/2008DE19950538B4 Halbleiterdrucksensorvorrichtung mit Schutzelementen Semiconductor pressure sensor apparatus with protective elements
05/29/2008DE102006057568A1 Mikrooptisches Element mit einem Substrat und Verfahren zu seiner Herstellung Micro-optical element comprising a substrate and process for its preparation
05/28/2008EP1924523A1 Microelectromechanical device packaging with an anchored cap and its manufacture
05/28/2008CN101189180A Thin package for a micro component
05/28/2008CN101188203A Hermetic sealing of micro devices
05/27/2008US7378294 Wafer-level sealed microdevice having trench isolation and methods for making the same
05/22/2008WO2008060389A2 Sensor device package having thermally compliant die pad
05/21/2008DE102007038465A1 Kameramodul auf Waferebene Camera module at the wafer level
05/21/2008CN101183675A Hermetically sealed wafer level packaging for optical mems devices
05/20/2008US7375404 Fabrication and integration of polymeric bioMEMS
05/15/2008WO2008057911A2 Microelectronic flow sensor packaging method and system
05/15/2008WO2008057055A1 A micromechanical structure and a method of fabricating a micromechanical structure
05/15/2008WO2008055722A1 Micromechanical sensor with integrated chip capacitor
05/15/2008WO2007145778A3 Mems device and method of fabricating the same
05/15/2008DE102007051823A1 Sensor für eine physikalische Grösse und Verfahren zur Fertigung des Sensors A physical quantity sensor and method for manufacturing the sensor
05/15/2008DE10144207B4 Anordnung mit mindestens zwei unterschiedlichen elektronischen Halbleiterschaltungen und Verwendung der Anordnung zur schnellen Datenübertragung Arrangement with at least two different electronic semiconductor circuits and use of the arrangement for fast data transfer
05/14/2008CN101177234A Electronic device and method for manufacturing thereof
05/14/2008CN100388474C Thermally enhanced microcircuit package and method of forming same
05/14/2008CN100387509C Manufacturing method used for improving performance of non-refrigerating infrared focal plane array device
05/08/2008WO2008052363A1 Electrical microvalve and method of manufacturing thereof
05/08/2008WO2008052306A1 Three-dimensional microstructures and methods for making same
05/08/2008WO2007149621A3 Methods and systems for object identification and for authentication
05/08/2008US20080108169 Ultrathin module for semiconductor device and method of fabricating the same
05/08/2008US20080106275 Sensor and Method for Measuring a Variable Affecting a Capacitive Component
05/08/2008DE10227593B4 Strömungsschaltungs-Mikrobauelemente Flow circuit microdevices
05/08/2008DE102007050865A1 Functional component e.g. high frequency sensor, for use in micro electromechanical system, has reaction product layer produced on boundary layer when metal layer and substrate are connected together by anodic connection
05/08/2008DE102007002583A1 Optische Anordnung und Verfahren zum Steuern und Beeinflussen eines Lichtstrahls Optical assembly and method for controlling and influencing a light beam
05/08/2008DE102006052468A1 Mikromechanischer Sensor mit integriertem Chipkondensator Micromechanical sensor with integrated chip capacitor
05/08/2008CA2703801A1 Electrical microvalve and method of manufacturing thereof
05/07/2008EP1917509A1 Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement
05/07/2008CN101173958A Bidirectional micro-inertia sensor and production method thereof
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