Patents for B81B 7 - Micro-structural systems (8,983)
09/2008
09/10/2008CN101261965A Encapsulation structure with micro hole and its making method
09/10/2008CN101261964A Functional device package
09/10/2008CN101261963A Miniature electronic part and its encapsulation part and making method
09/10/2008CN100417523C Ink-jet printing head with isolated nozzle controller
09/09/2008US7422929 Wafer-level packaging of optoelectronic devices
09/04/2008WO2008072029A3 Systems and methods for rapidly changing the solution environment around sensors
09/04/2008US20080210320 Microfabricated elastomeric valve and pump systems
09/03/2008EP1487738B1 Silicon carbide microelectromechanical devices with electronic circuitry
09/03/2008CN101256105A Monocrystaline silicon transverse miniature MEMS pirani meter and preparation method thereof
09/03/2008CN101254892A Semiconductor device and manufacturing method thereof
09/03/2008CN100416834C Electromechanical non-volatile random memory
09/03/2008CN100416735C Microelectromechanical devices
09/03/2008CN100415634C Electronic device with covering layer in cavity, and manufacture method thereof
09/02/2008US7420724 Scanner apparatus having electromagnetic radiation devices coupled to MEMS actuators
09/02/2008CA2370773C Actuator control in a micro electro-mechanical liquid ejection device
08/2008
08/28/2008WO2008101347A1 Mems actuators and switches
08/28/2008DE102007008518A1 Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips
08/28/2008CA2678680A1 Mems actuators and switches
08/27/2008EP1962344A1 Electronic device packages and methods of formation
08/27/2008EP1961696A1 Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method
08/27/2008CN101253399A Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement
08/27/2008CN101252122A Hermetically sealed optoelectronic mems wafer level package
08/27/2008CN101251426A Piezoresistance structure of MOS capacitance substrate on nano beam as well as detecting method
08/27/2008CN101249936A Packaging conformation for micro electromechanical systems and method for manufacturing same
08/27/2008CN100413777C Micro electro-mechanical device with leakage-prevention vent
08/26/2008US7417778 Light deflector, light deflection array, image forming apparatus, and image projection display apparatus
08/26/2008US7416910 Pyramid socket suspension
08/21/2008WO2008078182A3 Micro-electro-mechanical-system micromirrors for high fill factor arrays and method therefore
08/21/2008US20080199974 Method for Functionalizing Biosensor Chips
08/21/2008US20080197749 Mems micromotor and timepiece equipped with this micromotor
08/21/2008DE102008000128A1 Halbleitersensor und sein Herstellungsverfahren Semiconductor sensor and its manufacturing method
08/21/2008DE10024697B4 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
08/20/2008CN101248002A Microelectromechanical device packaging with an anchored cap and its manufacture
08/20/2008CN101244801A Micro-drive structure for implementing coplane and off-plane movement
08/20/2008CN101244800A Power overlay structure and method for making the same
08/20/2008CN100412607C Microelectromechanical system and method for fabricating the same
08/20/2008CN100412604C Micromirror array for projection TV
08/20/2008CN100412603C Projection TV with improved micromirror array
08/20/2008CN100412602C Micromirror with micromirror element arrays
08/14/2008WO2008095238A1 Electrode reactivation in a microfluidic device
08/14/2008US20080190171 Shelled thermal structures for fluid sensing
08/14/2008DE19680763B4 Microelectromechanical device useful for data storage applications - has cantilevered beam free to move above substrate and carrying insulated conductors is able to position tip on beam in contact with one conductor and move parallel to and perpendicular to substrate plane
08/13/2008EP1955978A2 Hermetically sealed package for a MEMS device
08/13/2008EP1954369A1 Fluid separation microsystem
08/13/2008EP1417455B1 Microgyroscope with electronic alignment and tuning
08/13/2008EP1216602B1 Mems digital-to-acoustic transducer with error cancellation
08/13/2008CN101239698A Z-axis microelectromechanical device with improved stopper structure
08/12/2008US7410901 Submicron device fabrication
08/12/2008US7410816 Method for forming a chamber in an electronic device and device formed thereby
08/07/2008US20080186605 Optical Module for Observing Event or Object
08/07/2008US20080185043 Microfluidic Device
08/07/2008DE19911916B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit Schutzlage A process for producing a semiconductor device with protective layer
08/06/2008EP1953816A1 Sensor device and method for manufacturing same
08/06/2008EP1953814A1 Wafer level package structure and method for manufacturing same
08/06/2008EP1953583A2 Micro mirror arrays and microstructures with solderable connection sites
08/06/2008EP1951611A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
08/06/2008EP1951609A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
08/06/2008CN101234746A Apparatus and method for housing micromechanical systems
08/06/2008CN100409064C Resonance assembly, double-shaft assembly and method for manufacturing double-shaft assembly and micro-system assembly
08/06/2008CN100408470C Microchip with thermal stress relief means
08/06/2008CN100408336C Thermoelastic expanding element
08/06/2008CN100408157C Reaction method using microreactor
08/05/2008US7408283 Micromachined ultrasonic transducer cells having compliant support structure
08/05/2008US7407827 Semiconductor mechanical sensor
08/05/2008US7407614 Method for forming at least one protective cap
08/05/2008CA2524020C Pulse modulator and pulse modulation method
07/2008
07/31/2008WO2008091221A2 Micropackaging method and devices
07/31/2008WO2008089969A2 Electronic device comprising differential sensor mems devices and drilled substrates
07/31/2008US20080180821 Apparatus, method and system for providing enhanced mechanical protection of thin beams
07/31/2008DE102007002725A1 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente Housing for mobile applications used in micro-mechanical and micro-optical components
07/30/2008CN101233619A A package and manufacturing method for a microelectronic component
07/30/2008CN101229911A Optical-mechanical double-layer structural uncooled infrared imaging focal plane array detector
07/30/2008CN101229910A Uncooled infrared imaging focal plane array detector
07/30/2008CN100406374C Laser cell microoperation control method and device for metal particle
07/30/2008CN100406373C Packaging structure of microscope element
07/29/2008US7404332 Micromechanical component and method
07/29/2008CA2414722C Seal for a micro electro-mechanical liquid chamber
07/24/2008WO2008087022A1 Housing for micro-mechanical and micro-optical components used in mobile applications
07/24/2008US20080174204 Electromechanical element, electric circuit device and production method of those
07/24/2008DE102007002832A1 Method for manufacturing device with arrangement of micro-needles, involves preparing silicon semiconductor substrate, whose surface is applied and structured with masking layer
07/24/2008DE102004028927B4 Beschleunigungssensor Acceleration sensor
07/24/2008CA2675501A1 Housing for micromechanical and micro-optic components used in mobile applications
07/23/2008EP1945561A2 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
07/23/2008CN101226856A Micro-switching device and method of manufacturing the same
07/23/2008CN101226850A Silicon micro mechanical pressure switch, preparation method and uses thereof
07/23/2008CN101226081A Enhanced type infrared absorption plate for optical read-out heat type infrared image sensor and preparation method thereof
07/22/2008US7402913 High density nanostructured interconnection
07/22/2008US7402897 Vertical system integration
07/22/2008US7402878 Packaging method for microstructure and semiconductor devices
07/22/2008US7402849 Parallel, individually addressable probes for nanolithography
07/22/2008US7402449 Integrated micro electro-mechanical system and manufacturing method thereof
07/22/2008CA2358115C Electrostatic/pneumatic actuators for active surfaces
07/17/2008WO2008086537A2 Aluminum based bonding of semiconductor wafers
07/17/2008WO2008086530A2 Mems sensor with cap electrode
07/17/2008WO2008085252A2 Mems device and electrical interconnects for same
07/17/2008WO2007143623A8 Methods and systems for micro machines
07/17/2008DE102007001518A1 Vorrichtung und Verfahren zum Häusen mikromechanischer Systeme Apparatus and method for housing micromechanical systems
07/17/2008DE102006003718B4 Mikro-elektro-mechanisches Bauelement und Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente Micro-electro-mechanical component and manufacturing process for integrated micro-electro-mechanical components
07/16/2008EP1944266A1 MEMS Packaging with reduced mechanical strain
07/16/2008EP1943186A2 Microscopic electro-mechanical systems, radio frequency devices utilizing nanocoils and spiral pitch control techniques for fabricating the same
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