Patents
Patents for B81B 3 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (12,727)
01/2003
01/15/2003EP1275020A1 Optical switch with mobile components and method for making same
01/15/2003EP1274648A1 Micromechanical component and method for producing the same
01/15/2003EP1274647A1 Micromechanical component and corresponding production method
01/15/2003EP1196788A4 Merged-mask micro-machining process
01/15/2003CN1390774A Micro ion pumps used for low-pressure miniature devices
01/15/2003CN1098749C Making process of soft magnetic rubber executor for micro robot
01/14/2003US6507138 Very compact, high-stability electrostatic actuator featuring contact-free self-limiting displacement
01/14/2003US6506621 Method for producing a diaphragm sensor array and diaphragm sensor array
01/14/2003US6506620 Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
01/14/2003US6505512 Micromachined devices and connections over a substrate
01/14/2003US6505511 Micromachined gyros
01/09/2003WO2003002450A2 Sacrificial layer technique to make gaps in mems applications
01/09/2003WO2003002247A1 Sacrificial layers in the manufacturing and application of_chemical reactors
01/09/2003WO2002019011A3 Micromechanical optical switch and method of manufacture
01/09/2003WO2002012115A3 Methods for reducing the curvature in boron-doped silicon micromachined structures
01/09/2003US20030008519 Method and apparatus for fabricating structures using chemically selective endpoint detection
01/09/2003US20030008506 Anti-stiction method and apparatus for drying wafer using centrifugal force
01/09/2003US20030007262 Micromirror unit with torsion connector having nonconstant width
01/09/2003US20030007237 Methods and apparatus for providing a multi-stop micromirror
01/09/2003US20030006868 Microrelay
01/09/2003US20030006777 Inherently stable electrostatic actuator technique which allows for ful gap deflection of the actuator
01/09/2003US20030006468 Sacrificial layer technique to make gaps in mems applications
01/09/2003US20030006125 Micro electromechanical switches
01/08/2003EP1273203A1 Method of manufacturing a membrane sensor
01/08/2003EP1273094A2 Multi-layer, self-aligned vertical comb-drive electrostatic actuators and fabrication methods
01/08/2003EP1272888A2 Magnetically actuated microelectromechanical systems actuator
01/08/2003EP1233927A4 Apparatus and method for forming a membrane with nanometer scale pores
01/08/2003CN1389392A Flex coupling block for moving sensor
01/07/2003US6504795 Arrangement of micromechanical ultrasound transducers
01/07/2003US6504643 Structure for an optical switch on a substrate
01/07/2003US6504641 Driver and method of operating a micro-electromechanical system device
01/07/2003US6503775 Production method of a micromachine
01/03/2003WO2003000422A1 Microfabricated two-pin liquid sample dispensing system
01/03/2003WO2002059939A3 Method for fabricating a semiconductor device
01/03/2003CA2451201A1 Microfabricated two-pin liquid sample dispensing system
01/02/2003US20030002133 Bi-directional, single material thermal actuator
01/02/2003US20030001221 Micromechanical component as well as a method for producing a micromechanical component
01/02/2003US20030000306 Angular rate sensor
01/02/2003EP1271155A1 Micromechanical component comprising a diamond layer, and production process
01/02/2003EP1270506A1 Micro-actuator and method of manufacturing the actuator
01/02/2003EP1270505A2 Anti-stiction method and apparatus for drying wafer using centrifugal force
01/02/2003EP1270504A1 Semiconductor device joint to a wafer
01/02/2003EP1269506A1 Microactuator arrangement
01/01/2003CN1097676C Piezoelectric micropump
12/2002
12/31/2002US6501725 Method of recording/reproducing an information signal
12/31/2002US6501588 Method for an optical switch on a silicon substrate
12/31/2002US6501107 Addressable fuse array for circuits and mechanical devices
12/31/2002US6500348 Deep reactive ion etching process and microelectromechanical devices formed thereby
12/31/2002US6499297 Micromachined parylene membrane valve and pump
12/27/2002WO2002103808A1 Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the same
12/27/2002WO2002103294A1 Sensor using electro active curved helix or double helix
12/27/2002WO2002103289A1 Coupled micromachined structure
12/27/2002WO2002103210A1 Nanopump devices and methods
12/26/2002US20020197862 Semiconductor component in a wafer assembly
12/26/2002US20020197762 Micromechanical and microoptomechanical structures with single crystal silicon exposure step
12/26/2002US20020197761 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
12/26/2002US20020197167 Microfluidic flow control device
12/26/2002US20020197009 MEMS see-saw array for dynamic gain equalization of DWDM systems
12/26/2002US20020197002 Self assembled micro anti-stiction structure
12/26/2002US20020196817 Tunable laser
12/26/2002US20020196523 Galvano-micromirror and its manufacture process
12/26/2002US20020196522 Compliant mechanism and method of forming same
12/26/2002US20020196521 Methods of making mechanisms in which relative locations of elements are maintained during manufacturing
12/26/2002US20020195681 Selection of materials and dimensions for a micro-electromechanical switch for use in the RF regime
12/26/2002US20020195674 Direct acting vertical thermal actuator
12/26/2002US20020195673 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
12/26/2002US20020195423 Method for vapor phase etching of silicon
12/26/2002US20020194942 High-performance fully-compliant micro-mechanisms for force/displacement amplification
12/26/2002US20020194906 Fluid property sensors
12/25/2002CN1387696A Time base comprising integrated micromechanical ring resonator
12/25/2002CN1387251A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002CN1387250A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002CN1097168C Micro pump comprising inlet control member for its self-priming
12/24/2002US6497141 Parametric resonance in microelectromechanical structures
12/19/2002WO2002100771A2 Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
12/19/2002WO2002082047A3 High throughput screening of crystallization of materials
12/19/2002US20020192852 Micromechanical and microoptomechanical structures with backside metalization
12/19/2002US20020191944 Microlamp
12/19/2002US20020191897 Micro electromechanical switches
12/19/2002US20020191272 System of angular displacement control for micro-mirrors
12/19/2002US20020191267 Electrostatic zipper actuator optical beam switching system and method of operation
12/19/2002US20020189353 Coupled micromachined structure
12/19/2002US20020189350 Micromachined vertical vibrating gyroscope
12/19/2002DE10142952A1 Production of micromechanical structure used as sensor or actuator comprises preparing micromechanical structure with micromechnical structural elements, and selectively etching
12/18/2002EP1267385A1 Micro ion pump for a low-pressure microdevice microenclosure
12/18/2002EP1266229A1 Micromechanical component
12/18/2002EP1266142A2 Thermally actuated microvalve assembly
12/18/2002CN1385357A Microelectric mechanical system with monoarmature
12/18/2002CA2388399A1 Actuator mechanism for precision alignment of optical components
12/17/2002US6496351 MEMS device members having portions that contact a substrate and associated methods of operating
12/17/2002US6495893 Micro-mechanical actuator including auxiliary lever to enlarge travel range of actuated object
12/17/2002US6495389 Method for manufacturing semiconductor pressure sensor having reference pressure chamber
12/17/2002US6495387 Electronic devices including micromechanical switches
12/17/2002US6494433 Thermally activated polymer device
12/17/2002US6494096 Semiconductor physical quantity sensor
12/12/2002WO2002099504A2 Resonance scanner
12/12/2002WO2002098788A2 Applications of a strain-compensated heavily doped etch stop for silicon structure formation
12/12/2002WO2002044033A3 Mems device with integral packaging
12/12/2002US20020187648 Material removal method for forming a structure
12/12/2002US20020187312 Matrix-free desorption ionization mass spectrometry using tailored morphology layer devices