Patents
Patents for B81B 3 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (12,727)
10/2004
10/19/2004US6806624 Microelectromechanical generator using bubbles
10/19/2004US6806545 MEMS device having flexures with non-linear restoring force
10/19/2004US6806205 Stiction-free microstructure releasing method for fabricating MEMS device
10/19/2004US6805454 MEMS structure with mechanical overdeflection limiter
10/19/2004US6805390 Nanotweezers and nanomanipulator
10/19/2004US6805008 Accelerometer with folded beams
10/19/2004US6804959 Unilateral thermal buckle-beam actuator
10/14/2004WO2004088330A1 Bending beam accelerometer with differential capacitive pickoff
10/14/2004WO2004087561A2 Novel sacrificial layers for use in fabrications of microelectromechanical devices
10/14/2004US20040202554 Micro pump
10/14/2004US20040201321 High frequency latching relay with bending switch bar
10/14/2004US20040201318 Latching relay with switch bar
10/14/2004US20040200724 Microfluidic device
10/14/2004US20040200280 Isolated resonator gyroscope
10/14/2004DE10314996A1 Micromechanical structure has discharge arrangement that reduces potential difference between elements if potential difference positive and exceeds first value and/or negative and than second value
10/14/2004DE10314989A1 Micromechanical structure manufacturing method for integrated micromechanical system, using function layer deposited on sacrificial layer having edge layer with different characteristics
10/13/2004EP1466333A1 Microstructures
10/13/2004EP1465832A2 Micro-electromechanical device
10/13/2004CN1536422A Variable light attenuator for miniature electromechanical system (MEMS)
10/12/2004US6804039 Multilayer hinge structures for micro-mirror arrays in projection displays
10/12/2004US6804038 Bipolar operation of light-modulating array
10/12/2004US6803755 Microelectromechanical system (MEMS) with improved beam suspension
10/12/2004US6803637 Micromechanical component with different doping types so that one type is anodized into porous silicon
10/12/2004US6803559 Optically controlled MEM switches
10/12/2004US6803534 Membrane for micro-electro-mechanical switch, and methods of making and using it
10/12/2004US6802549 Nanotweezers and nanomanipulator
10/07/2004WO2003092048B1 Micro electro-mechanical system method
10/07/2004US20040198231 Ceramic microelectromechanical structure
10/07/2004US20040198016 Methods of forming void regions, dielectric regions and capacitor constructions
10/07/2004US20040197960 Micro-scale interconnect device with internal heat spreader and method for fabricating same
10/07/2004US20040197953 Method for protecting encapsulated sensor structures using stack packaging
10/07/2004US20040197951 Membrane IC fabrication
10/07/2004US20040197526 Process for fabricating monolithic membrane substrate structures with well-controlled air gaps
10/07/2004US20040196722 Methods and apparatus for selectively updating memory cell arrays
10/07/2004US20040196608 Method and apparatus for protecting wiring and integrated circuit device
10/07/2004US20040196546 Manipulator having arm mechanism for hand
10/07/2004US20040196522 Mems variable optical attenuator
10/07/2004US20040195638 Micromechanical component as well as a method for producing a micromechanical component
10/07/2004US20040195539 Valve assembly for microfluidic devices, and method for opening and closing same
10/07/2004US20040195096 Method for the fabrication of suspended porous silicon microstructures and application in gas sensors
10/07/2004US20040194534 Hybrid microcantilever sensors
10/06/2004EP1465327A2 Vibration-powered and in a substrate integrated generator
10/06/2004EP1464615A2 Method for protecting encapsulated sensor structures using stack packaging
10/06/2004EP1463899A2 Proportional micromechanical valve
10/06/2004EP1171378B1 A method of manufacturing a thermal bend actuator
10/05/2004US6800912 Integrated electromechanical switch and tunable capacitor and method of making the same
10/05/2004US6800503 MEMS encapsulated structure and method of making same
10/05/2004US6800210 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
09/2004
09/30/2004WO2004083802A2 A cantilever array chemical sensor
09/30/2004WO2004083111A1 A method for manfacturing a membrane in a (111) surface of a (100) silicium wafer
09/30/2004WO2004083110A2 Sensor element with self-supporting bar structures made of group iii nitride based semiconductors
09/30/2004WO2004075247A3 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors
09/30/2004WO2003065976A3 Microfluidics apparatus and methods of use therefor
09/30/2004US20040192045 Apparatus and methods for maskless pattern generation
09/30/2004US20040191978 Methods of making electromechanical three-trace junction devices
09/30/2004US20040191946 Novel sacrificial layers for use in fabrications of microelectromechanical devices
09/30/2004US20040189143 Electrostatic driving device and manufacturing method of the same
09/30/2004US20040188786 Reduced substrate micro-electro-mechanical systems (MEMS) device and system for producing the same
09/30/2004US20040188785 Trilayered beam MEMS device and related methods
09/30/2004US20040188783 Micromechanical device and method of manufacture thereof
09/30/2004US20040188782 Semiconductor device having multiple substrates
09/30/2004US20040188648 Integrated surface-machined micro flow controller method and apparatus
09/30/2004US20040187592 Physical quantity sensor having protrusion and method for manufacturing the same
09/30/2004US20040187578 Bending beam accelerometer with differential capacitive pickoff
09/30/2004DE102004013583A1 Sensor für eine physikalische Grösse mit einem Balken Sensor for a physical quantity with a bar
09/29/2004EP1461828A1 Method of fabricating micro-electromechanical switches on cmos compatible substrates
09/29/2004EP1461816A2 Mems device having contact and standoff bumps and related methods
09/29/2004EP1461287A2 Hybrid mems fabrication method and new optical mems device
09/29/2004EP1461286A1 Differential stress reduction in thin films
09/29/2004EP1169650B1 Different sacrificial layer thickness under fixed and movable electrodes (capacitive acceleration sensor)
09/29/2004CN1532565A Regulateable composite micro lens device with mcro motor structure controller
09/28/2004US6798941 Variable transmission multi-channel optical switch
09/28/2004US6798321 Micro electromechanical switches
09/28/2004US6798315 Lateral motion MEMS Switch
09/28/2004US6798312 Microelectromechanical system (MEMS) analog electrical isolator
09/28/2004US6798114 Systems and methods for overcoming stiction
09/28/2004US6798113 Flexure with integral electrostatic actuator
09/28/2004US6797631 High sensitive micro-cantilever sensor and fabricating method thereof
09/28/2004US6797589 Insulating micro-structure and method of manufacturing same
09/28/2004US6797187 Surface-micromachined microfluidic devices
09/23/2004WO2004081741A2 Integrated microfluidic control employing programmable tactile actuators
09/23/2004WO2004081263A1 Electroplating pcb components
09/23/2004WO2004080886A1 Mems devices on a nanometer scale
09/23/2004US20040185592 Biosensor matrix and method for making same
09/23/2004US20040184720 MXN cantilever beam optical waveguide switch
09/23/2004US20040184709 MEMS waveguide shuttle optical latching switch
09/23/2004US20040184155 Adjustable compound microlens apparatus with MEMS controller
09/23/2004US20040184135 High stroke pixel for a deformable mirror
09/23/2004US20040184134 Optical modulator, display device and manufacturing method for same
09/23/2004US20040183617 Microelectromechanical system (mems) analog electrical isolator
09/23/2004US20040183603 Micro-electromechanical structure resonator frequency adjustment using radient energy trimming and laser/focused ion beam assisted deposition
09/23/2004US20040183395 Micro-actuator, micro-actuator device, optical switch and optical switch array
09/23/2004US20040183214 Depositing a sacrificial layer over mechanical structure; depositing a first encapsulation layer over the sacrificial layer; forming vent through the encapsulation layer to expose portion of the sacrificial layer; removing sacrificial layer to form chamber; introducing gas into the chamber; depositing
09/23/2004US20040183149 Micromechanical device
09/23/2004US20040182158 Physical quantity sensor having beam
09/23/2004US20040182156 Capacitive-type semiconductor sensor having shared conductive pads for multiple sensor chips
09/23/2004US20040182155 Micromachined capacitive lateral accelerometer device and monolithic, three-axis accelerometer having same
09/23/2004DE10310161A1 Monolithic integrated circuit for ID tags and chips has a sensor and an electrical energy supply generated by the vibration of an inductor and permanent magnet combination
09/23/2004DE102004011718A1 Halbleiterdrucksensor Semiconductor pressure sensor
09/22/2004EP1460463A1 Mems waveguide shuttle optical latching switch
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