Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
08/2012
08/22/2012CN202388640U Polycrystalline silicon ingot squarer and special sizing agent branching pipe thereof
08/22/2012CN202388639U Silicon ingot squarer
08/22/2012CN202388638U Device for cutting seed crystals by multiple wire electrodes
08/22/2012CN202388637U Working table of multi-line cutting machine
08/22/2012CN202388636U Cutting steel wire with micro-bends or micro-scratches for silicon slice
08/22/2012CN202388635U Hot fix rhinestone shaft connecting device
08/22/2012CN202388056U Saw blade
08/22/2012CN102648067A Sawing of blocks into wafers using diamond coated wires
08/22/2012CN102646584A Workpiece dividing device and method for dividing workpiece
08/22/2012CN102642256A Multi-workpiece gem fixing device for gem cutting equipment
08/22/2012CN102642255A Sawing device
08/22/2012CN102642254A Crystal face directional detection bonding table
08/22/2012CN102642253A Silicon slice edge cutting method and device of silicon slice edge cutting method
08/22/2012CN101879756B Silicon wafer stripping machine
08/22/2012CN101574836B Multiline cutting machine of numerical-control polysilicon silicon
08/21/2012US8247734 Laser beam machining method
08/16/2012WO2012108391A1 Glass plate cutting method and glass plate cutting device
08/16/2012WO2012108056A1 Monocrystalline member with stress layer formed in interior and monocrystalline substrate production method
08/16/2012WO2012108055A1 Monocrystalline substrate production method and monocrystalline member with modified layer formed therein
08/16/2012WO2012108054A1 Production method for monocrystalline substrate and production method for monocrystalline member with modified layer formed therein
08/16/2012WO2012108052A1 Monocrystalline substrate production method and monocrystalline member with modified layer formed therein
08/16/2012US20120205358 Method of cutting an object to be processed
08/16/2012US20120205357 Laser processing method and laser processing apparatus
08/15/2012EP2486602A1 Device and method for removing coatings from solar modules
08/15/2012CN202382641U Heat preservation device of heat exchanger
08/15/2012CN202381701U Device for sealing bearing boxes of silicon wafer cutting machine
08/15/2012CN202378189U Loading and unloading device of wire slicing machine
08/15/2012CN202378186U Multi-wire cutting equipment with prevention and alarm device
08/15/2012CN202378185U Pre-deformation diamond fret saw for high-speed cutting
08/15/2012CN102640266A Method for cutting silicon ingot using wire saw, and wire saw
08/15/2012CN102639762A Method for producing wafers
08/15/2012CN102632556A Guide roller for wire-saw system
08/15/2012CN102632555A Cutting method of crystal blank
08/15/2012CN101973084B Automatic winding device with swinging mechanism for multi-wire cutting machine
08/15/2012CN101973076B Precise technology for correcting cutting angles of quartz crystal wafers in large scale
08/08/2012EP2485251A2 Method of cutting semiconductor substrate
08/08/2012CN202373492U Operating button of wire cutting machine
08/08/2012CN202367874U System for collecting waste mortar
08/08/2012CN202367873U Integral spool
08/08/2012CN202367872U Wire guiding wheel for multi-wire sawing machine
08/08/2012CN102629142A Wire cutting pressure control system
08/08/2012CN102626961A Locating crystal support for cutting polycrystalline silicon ingot
08/08/2012CN102626960A Locking device of locating crystal support for cutting polycrystalline silicon ingot
08/08/2012CN102626959A Equal-line-loss computation method for multi-line cutting machine
08/08/2012CN102626958A Intelligent power supply system of wire cutting machine
08/08/2012CN102626957A Silicon wafer linear cutting equipment with uniform slurry spraying device
08/08/2012CN102626956A Silicon wafer cutting equipment with function of automatic tension adjustment
08/08/2012CN102626955A Double-guide roll linear silicon wafer cutting system
08/08/2012CN102626954A Silicon wafer cutting method and cut scrap recycling method
08/08/2012CN102626953A Servo control system of linear cutting machine
08/08/2012CN102626952A Job management system for linear silicon wafer cutting machines
08/08/2012CN102626951A Silicon wafer cutting equipment with conveniently-replaced guide rolls
08/08/2012CN102626950A Method for cutting large polycrystal ingot
08/08/2012CN102626949A Polycrystal slicing method for improving silicon rod slicing yield
08/08/2012CN101973072B Method for manufacturing silicon rod for slicing by processing polycrystalline silicon ingot
08/08/2012CN101913210B Polycrystalline silicon ingot ripping method
08/08/2012CN101728259B Method for cutting semi-conducting material composite rod into a plurality of wafers
08/08/2012CN101678563B Cutting method and wire saw device
08/02/2012US20120192848 Method of slicing silicon ingot using wire saw and wire saw
08/01/2012EP2481543A1 A method for scribing a brittle material substrate
08/01/2012CN202357301U Mortar cooling system of multi-line cutting machines
08/01/2012CN202357299U Microprocessor controlled multi-wire cutting machine with two grades of operating surfaces
08/01/2012CN202357298U Multicore cutting machine for crystal seed
08/01/2012CN202357297U Orienting device of large-sized sapphire crystal
08/01/2012CN102625744A Device for cleaning substrates on a carrier
08/01/2012CN102623601A Semiconductor element and cutting method thereof
08/01/2012CN102623309A Manufacturing method of end terminal of high voltage power semiconductor device and special cutting tool for the same
08/01/2012CN102616700A Oil and air hybrid driven lifting control device
08/01/2012CN102615731A Guide wheel device on numerical control multi-wire swinging cutting machine
08/01/2012CN102615730A Automatic wire arrangement and balance device of multi-wire cutting machine
08/01/2012CN102615729A Inverted cutting worktable on numerical control multi-wire swinging cutting machine
08/01/2012CN102615728A Cutting wire tension control device of crystalline silicon square cutting machine
08/01/2012CN102615727A Guide roller for wire-saw device
08/01/2012CN102615725A Multiwire cutting machine and wiring device thereof
08/01/2012CN102615724A Tension system on numerically controlled multi-wire swing cutting machine
08/01/2012CN102615723A Mortar cyclic utilization device of multi-wire cutting machine
08/01/2012CN102615722A Wire saw device for ingot cutting having wire disconnection sensing unit and sensing method of wire disconnection for the wire saw device
08/01/2012CN102615721A Orientation material table for processing crystal inclination angle
07/2012
07/26/2012WO2012099444A2 Wire saw apparatus
07/26/2012WO2012099361A2 Apparatus for fixing substrate block
07/26/2012US20120190175 Laser processing method and laser processing apparatus
07/26/2012US20120186572 Silicon wafer sawing fluid and process for use thereof
07/26/2012US20120186571 Aqueous Cutting Fluid for Use with a Diamond Wiresaw
07/25/2012EP2477777A1 Wire saw work piece support device, support spacer and method of sawing using same
07/25/2012CN202344700U Double-layer lifting device for multi-wire silicon wafer cutting machine
07/25/2012CN202344697U Wire arranging device for silicon wafer cutting
07/25/2012CN202344696U Line arranging mechanism of square cutting machine
07/25/2012CN202344037U Saw blade
07/25/2012CN102604031A Preparation method and application of polyester polyurethane elastomer
07/25/2012CN102601877A Device and method for processing silicon wafer
07/25/2012CN101941249B Polycrystalline working plate for disassembled or assembled wire squarer
07/25/2012CN101733847B Method of working cutter wheel for brittle material substrate
07/25/2012CN101626875B Apparatus and method for edge processing of a sheet of brittle material
07/24/2012US8227724 Laser processing method and laser processing apparatus
07/18/2012EP2476505A1 Laser processing method and laser processing device
07/18/2012CN202336944U 一种用于切割蓝宝石硅棒的切片机 A cut sapphire ingots slicer
07/18/2012CN102596523A Method for breaking brittle material substrate
07/18/2012CN102596522A Device and method for stacking or transporting a plurality of flat substrates
07/18/2012CN102596504A Guide roller
07/18/2012CN102593270A LED die and manufacturing method thereof
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