Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
10/2012
10/03/2012CN202462656U Guide wheel for silicon wafer cutting machine
10/03/2012CN102712077A Method for separating grinding oil from grinding slurry, a separating station for separating grinding oil from grinding slurry, and a processing plant for separating grinding oil from grinding slurry
10/03/2012CN102709152A Thermal cutting device applicable for semiconductor process
10/03/2012CN102700015A Isovolumetric cutting speed calculation method for multi-line cutting machine
10/03/2012CN102700014A Diamond micro-powder plated titanium, nickel-phosphorous and nickel composite diamond wire saw as well as preparation method thereof
10/03/2012CN102700013A Silicon ingot cutting method
10/03/2012CN102700012A Method for reducing silicon chip damaged layers during multi-wire cutting
10/03/2012CN102700011A Multi-station trepan boring machine
10/03/2012CN102285010B Solar-grade silicon chip cut by using diamond wires and cutting method
10/03/2012CN101842326B Cutting line on glass sheet providing apparatus
10/03/2012CN101821071B Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus
10/03/2012CN101517710B Cutting method and epitaxial wafer manufacturing method
10/03/2012CN101402226B Cutting device
09/2012
09/27/2012WO2012126883A1 Cutting fluid cleaning arrangement for a wire saw, wire saw arrangements and use of the wire saw arrangement
09/27/2012US20120240915 Method for slicing wafers from a workpiece
09/27/2012US20120240914 Method for slicing wafers from a workpiece
09/27/2012DE102011014828A1 Fluid, useful to produce wafers, electronic components and photovoltaic cells, comprises a base glycol, additives, a glycol etherified with an alkyl group and water
09/27/2012DE102011005948A1 Verfahren zum Abtrennen von Scheiben von einem Werkstück A method for cutting wafers from a workpiece
09/26/2012EP2501521A1 Method for separating grinding oil from grinding slurry; separating station for carrying out said method and plant according to said method
09/26/2012CN202448247U Wire arranging structure for diamond cutting wires
09/26/2012CN202448246U Guide wheel of line cutting machine
09/26/2012CN102693941A Wafer cutting process
09/26/2012CN102693940A Wafer splitting method for avoiding generation of bicrystal
09/26/2012CN102689372A Gantry-type linear sawing machine for KDP (potassium dihydrogen phosphate) crystal fixed abrasives
09/26/2012CN102689371A Mortar-flow-anomaly-alarming ingot breaking machine and mounting and alarming method thereof
09/26/2012CN102689370A Cutting apparatus for silicon rod or other crystal materials, and method thereof
09/26/2012CN102689369A Method for slicing wafers from a workpiece
09/26/2012CN102689368A Method for slicing wafers from a workpiece
09/26/2012CN102689367A New process for cutting silicon chip
09/26/2012CN102689366A *-character searching method of wafer fragment edge
09/26/2012CN101402228B Cutting device
09/19/2012CN202439143U Tool for turning workpiece
09/19/2012CN202439142U Mortar supply device used for cutting of mono-crystalline silicon
09/19/2012CN202439141U Crystal-bar bonding station for cutting optical crystal-sheet with fixed angle
09/19/2012CN202439140U Wire cutting machine for cutting silicon wafer and slurry flow-splitting device thereof
09/19/2012CN202439139U Multi-line cutting device
09/19/2012CN202439138U Cutting jig for silicon on sapphire bar
09/19/2012CN202439137U Double-rod multi-wire cutting machine for diamond wire
09/19/2012CN202439136U Electroplated composite diamond wire saw
09/19/2012CN202439135U Wire saw suitable for cutting hard and brittle materials
09/19/2012CN202439134U Fretsaw
09/19/2012CN202439133U Diamond fret saw for cutting hard brittle material
09/19/2012CN202439132U Auxiliary device for fixing multi-wire cutting single crystal silicon
09/19/2012CN102672836A Third wheel for monocrystalline silicon seed multi-wire cutter
09/19/2012CN102672832A Method for eliminating defects of head part and tail part of battery silicon block
09/19/2012CN102672831A Spindle system of multi-wire saw
09/19/2012CN102672830A Multi-line cutting machine workbench system
09/19/2012CN102672829A Control system for precision multi-thread cutting machine
09/19/2012CN101973077B Cutting knife for processing silicon sheet
09/19/2012CN101945732B Cylindrical grinding apparatus and method for grinding
09/19/2012CN101861230B Method for cutting workpieces by wire saw and wire saw
09/13/2012WO2012121049A1 Jig for measurement, wire saw, and workpiece mounting method
09/13/2012US20120228276 Method of manufacturing a semiconductor device formed using a substrate cutting method
09/12/2012CN202428574U Wire inlet and outlet device for wire-squaring machine
09/12/2012CN202428571U Linear squaring machine main shaft with decontaminating and cooling structure and linear squaring machine
09/12/2012CN202428570U Multi-wire cutting machine with wire arc detectors
09/12/2012CN102665999A 激光加工方法 The laser processing method
09/12/2012CN102658606A Manufacturing method of resin diamond wire
09/12/2012CN101817209B Real-time deviation correcting method for precise cutting process of diamond wire saw
09/05/2012EP2495073A1 Guide roller
09/05/2012EP2493823A1 Tilting device for cropping a sheet of laminated glass
09/05/2012CN202412506U Fixing device for cutting silicon rod of multi-line cutting machine
09/05/2012CN202412505U Silicon block bonding device
09/05/2012CN202412504U Winding displacement sensing device for cutting silicon wafers
09/05/2012CN202412503U Device for conveying crystal ingots
09/05/2012CN202412501U Wire jumper prevention mechanism for slicer
09/05/2012CN202412500U Diamond wire cutter with double wire storage rollers
09/05/2012CN202412499U Diamond wire slicer
09/05/2012CN202412498U Electroplating type fret saw
09/05/2012CN202412497U Diamond fretsaw
09/05/2012CN202412496U Guide-wheel-number groove device for cutting silicon blocks
09/05/2012CN202412495U Cutting line for consolidating mixed grinding materials of diamond and cubic boron nitride
09/05/2012CN202412494U Multi-wire silicon bar cutting device
09/05/2012CN202412493U Silicon block slicing device
09/05/2012CN202412492U Cutting device for silicon blocks
09/05/2012CN202412491U Wire saw cutting machine and filtering net device thereof
09/05/2012CN202412490U Silicon ingot cutting saw machine
09/05/2012CN202412489U Slicing machine for cutting sapphire silicon rods
09/05/2012CN202412488U Stainless steel band saw blade with alternately arranged large and small emery saw teeth
09/05/2012CN102655120A Laser processing method for wafer and laser processing device
09/05/2012CN102082206B Special scribing and cutting worktable for solar cell chip
09/05/2012CN101679101B Hand operated breaker
09/05/2012CN101664967B Improved monocrystal silicon-rod cutting machine
09/05/2012CN101402227B Cutting blade detection mechanism
09/05/2012CN101402225B Cutting blade detection mechanism of cutting device
09/05/2012CN101391460B Device and method for cutting breakable substrate material
08/2012
08/30/2012WO2012115462A2 Apparatus for slicing ingot
08/30/2012WO2012115099A1 Water-soluble working fluid for fixed abrasive grain wire saw
08/30/2012WO2012062296A3 Device for structuring thin-film solar cell modules in a highly accurate manner
08/30/2012DE10133448B4 Ausrichtungsverfahren und -vorrichtung zum Ausrichten eines Schneidmessers in einer Dicing-Maschine Alignment method and apparatus for aligning a cutting blade in a dicing machine
08/29/2012CN202399421U Mortar nozzle device of silicon wafer cutting machine
08/29/2012CN202399419U Wire take-up device for multi-wire silicon wafer cutting machine
08/29/2012CN202399418U Disconnection protection device used for slicing equipment
08/29/2012CN202399415U Guiding device of silicon wafer cutting machine
08/29/2012CN202399414U Flexible feeding mechanism of sapphire bar drawing machine
08/29/2012CN202399410U Sectioning type diamond wire
08/23/2012WO2012110102A1 Wire saw device, method of building a wire web in a wire saw device and method for operating a wire saw device
08/23/2012DE112009002528T5 Rohblockschneidvorrichtung und Rohblockschneidverfahren Rohblockschneidvorrichtung and Rohblockschneidverfahren
08/22/2012EP1893385B1 Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
08/22/2012CN202388641U Fretsaw cutting machine
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