Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
11/2012
11/08/2012WO2012150517A1 Method for fixing a single-crystal workpiece to be treated on a processing device
11/08/2012US20120279947 Laser processing method and laser processing apparatus
11/07/2012EP2520401A1 Method for fixing a single-crystal workpiece to be treated on a processing device
11/07/2012CN202517608U Adhesive ingot
11/07/2012CN202517606U Steel wire for cutting
11/07/2012CN202517605U Electroforming diamond cutter for picking sapphire ingot
11/07/2012CN102770237A Base wire for coated saw wire
11/07/2012CN102765144A Silicon-block bonding tool
11/07/2012CN102765142A Steel wire for cutting silicon wafers and use method thereof
11/07/2012CN102765141A Metal cutting wire with spiral wave-shaped rotary bending parts
11/07/2012CN102765140A Holding structure for polycrystalline silicon ingot in squarer
11/07/2012CN102765139A Fly cutter plate for processing large-size optical elements by single-point diamond milling method
11/07/2012CN101180167B Device for the separation of substrates from a stack
11/01/2012WO2012147472A1 Compound semiconductor single crystal substrate and method for manufacturing same
11/01/2012WO2012146084A1 Diamond wire saw device
11/01/2012US20120272944 Wire saw work piece support device, support spacer and method of sawing using same
11/01/2012US20120272943 Diamond wire saw device
11/01/2012CA2810304A1 Diamond wire saw device
10/2012
10/31/2012DE112011100105T5 Abspaltung für ein halbleitersubstrat Cleavage of a semiconductor substrate
10/31/2012DE102011005948B4 Verfahren zum Abtrennen von Scheiben von einem Werkstück A method for cutting wafers from a workpiece
10/31/2012CN202507416U Wire cutting machine waste material recovery device
10/31/2012CN202507414U Novel device for degumming silicon chip subjected to diamond wire cutting
10/31/2012CN202507410U Coiling and uncoiling system for cutting silicon chips
10/31/2012CN202507409U Cast ingot bonding tray
10/31/2012CN202507408U Intelligent device for automatically adjusting speed of cutting silicon pieces with diamond wire
10/31/2012CN202507407U Slurry supply station
10/31/2012CN202507406U Diamond grain cutting type silicon chip cutting system
10/31/2012CN202507405U Cloth spray type spouting system
10/31/2012CN102762338A Method for designing resin-coated saw wire
10/31/2012CN102760699A Method of cutting wafer used for preparation of sensor chip into grains
10/31/2012CN102758243A Seed crystal of large-size single crystal and production process thereof
10/31/2012CN102756433A Method for rescuing broken wire during silicon wafer linear cutting
10/31/2012CN102756432A Programmable logic controller (PLC) wafer cutting method
10/31/2012CN102756431A Silicon chip cutting device
10/31/2012CN101670494B Laser processing method and laser processing apparatus
10/31/2012CN101080360B Sacrificial substrate for etching
10/26/2012WO2012144136A1 Method for resuming operation of wire saw and wire saw
10/25/2012US20120266631 Setting for gemstones, particularly diamonds
10/24/2012EP2514576A1 A method of producing ceramic substrates
10/24/2012CN102751401A Method for improving yield in light-emitting diode (LED) chip production process
10/24/2012CN102751400A Cutting method of semiconductor component containing metal back plating
10/24/2012CN102744799A Crystal bar bonding method
10/24/2012CN102744797A Single line crystalline silicon cutting machine
10/24/2012CN102744796A Silicon ingot slicing quality monitoring system and monitoring method
10/24/2012CN102744795A Wafer cutting method
10/24/2012CN102744794A Double-piece independent wire guide wheel
10/24/2012CN102744424A Single-point diamond compensation cutting processing method for thin plate optical parts
10/24/2012CN102056712B Method for cutting work
10/18/2012WO2012139498A1 Three roller multi-wire saw
10/17/2012CN202491320U Striking hammer structure for LED chip splitting apparatus
10/17/2012CN202491318U Multi-line type wiring mechanism with compound guide wheels for squaring machine
10/17/2012CN202491317U Single line cutting equipment
10/17/2012CN202491316U Wafer cutting tool
10/17/2012CN102738313A Chip cutting method for increasing LED chip light extraction
10/17/2012CN102729349A Stitch marker and marking device
10/17/2012CN102729348A Multi-wire cutting machine
10/17/2012CN102729347A Method for cutting workpiece with wire saw
10/17/2012CN102729346A Breaking device
10/17/2012CN102729345A Internal circumference processing method of fragile material substrate
10/17/2012CN102729344A Fretsaw structure with fixed abrasive particles
10/17/2012CN102729343A Scroll saw and manufacturing method thereof
10/17/2012CN102729342A Preparation method used in manufacturing of efficient polycrystalline silicon wafer
10/17/2012CN102729341A Breaking device and breaking method
10/17/2012CN102729340A Crystal particle splitting technology
10/17/2012CN102729339A Roll-cutting shearer and roll-cutting method
10/17/2012CN101722581B Method of scribing laminated substrate
10/16/2012US8288842 Method for dicing semiconductor wafers
10/11/2012US20120255535 Method for cutting workpiece with wire saw
10/10/2012EP2508317A1 Method for cutting workpiece with wire saw
10/10/2012CN202480267U Water circulation system for square cutting machine and surface-grinding machine
10/10/2012CN202480265U Microcomputer-controlled four-station multi-wire wafer cutting machine
10/10/2012CN202480264U Full-automatic quartz crystal foot processing device
10/10/2012CN202480261U Inner circle cutting machine
10/10/2012CN202479981U Slurry nozzle device for cutting crystal silicon briquettes
10/10/2012CN102717446A Four-roller sapphire slicing machine
10/10/2012CN102716629A High pressure air filter for polysilicon slicing machine
10/10/2012CN101850538B Support jig of wafer and method for grinding, transferring and cutting wafer
10/10/2012CN101622098B Cutting method and wire saw device
10/10/2012CN101596721B Substrate-cutting system
10/10/2012CN101462311B Method for processing diamond
10/09/2012US8283595 Laser processing method and laser processing apparatus
10/04/2012WO2012133532A1 Wire saw, and roller positioning method for wire saw
10/04/2012WO2012133530A1 Method for manufacturing ceramic element
10/04/2012WO2012132974A1 Apparatus for cutting brittle sheet and method for cutting brittle sheet
10/04/2012WO2012132973A1 Method for cleaving plate-like glass member and device for cleaving plate-like glass member
10/03/2012EP2505297A1 Method of processing a substrate having two superposed layers using laser focused inside the substrate for welding the layers
10/03/2012EP2504139A1 Method and device for treating abrasive slurries containing si/sic
10/03/2012CN202462674U Crystal support handle
10/03/2012CN202462672U Diamond wire evolution machine head
10/03/2012CN202462669U Sand leakage disc for multi-thread cutting machine
10/03/2012CN202462667U Auxiliary device for wire saw cutting
10/03/2012CN202462665U Guide wheel for slicing machine
10/03/2012CN202462664U Guide wheel for machining silicon wafers
10/03/2012CN202462663U Guide wheel for silicon wafer slicing machine
10/03/2012CN202462662U Slicing and texturing integrated device of crystalline silicon chip
10/03/2012CN202462661U Numerical control silicon ingot steel wire squaring machine
10/03/2012CN202462660U Diamond wire single-rod multi-wire cutting machine
10/03/2012CN202462659U Guide wheel for silicon wafer slicing machine
10/03/2012CN202462658U Lightweight guide wheel
10/03/2012CN202462657U Crystal bar conveying and washing splicing basket group and crystal bar conveying and washing splicing basket
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