| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/21/2006 | US7001257 Multi-chamber carrier head with a flexible membrane |
| 02/21/2006 | US7001256 Carrier head with a non-stick membrane |
| 02/21/2006 | US7001254 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 02/21/2006 | US7001253 an abrasive, a carrier, and either boric acid, or a conjugate base in a non-buffered aqueous solution; abrasive can be fixed on a pad or suspended in solution; high speed polishing, planarization efficiency, uniformity |
| 02/21/2006 | US7001252 Abrasive material |
| 02/21/2006 | US7001251 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 02/21/2006 | US7001246 Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
| 02/21/2006 | US7001245 Substrate carrier with a textured membrane |
| 02/21/2006 | US7001244 Polishing apparatus |
| 02/21/2006 | US7001242 Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| 02/16/2006 | WO2006017008A1 Abrasive material having an antiloading coating |
| 02/16/2006 | US20060035573 Polishing pad and method of making same |
| 02/16/2006 | US20060035571 Polishing apparatus |
| 02/16/2006 | US20060035564 Fine force actuator assembly for chemical mechanical polishing apparatuses |
| 02/16/2006 | US20060035563 Method, apparatus and system for use in processing wafers |
| 02/16/2006 | US20060032148 Method of manufacturing polishing slurry for use in precise polishing process |
| 02/16/2006 | US20060032147 Method of preparing slurry composition for chemical mechanical polishing |
| 02/16/2006 | DE19937784B4 Zweischeiben-Feinschleifmaschine Two slices of fine grinding |
| 02/15/2006 | EP1625915A1 Double-sided polishing apparatus for thin workpieces, e.g. wafers |
| 02/15/2006 | EP1625613A1 Substrate holding apparatus and polishing apparatus |
| 02/15/2006 | CN1735481A Method of using a soft subpad for chemical mechanical polishing |
| 02/15/2006 | CN1735480A Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 02/15/2006 | CN1735478A Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| 02/15/2006 | CN1735477A Method and apparatus for processing sliders for use in disk drives and the like |
| 02/15/2006 | CN1242460C Method for determinating endpoint and semiconductor wafer |
| 02/14/2006 | US6998166 Polishing pad with oriented pore structure |
| 02/14/2006 | US6998013 CMP apparatus polishing head with concentric pressure zones |
| 02/14/2006 | US6997793 Polishing pad, polishing apparatus having the same, and bonding apparatus |
| 02/14/2006 | US6997791 CMP polishing heads and methods of using the same |
| 02/14/2006 | US6997789 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 02/14/2006 | US6997788 Multi-tool, multi-slurry chemical mechanical polishing |
| 02/14/2006 | US6997784 Storage device slider with sacrificial lapping extension |
| 02/14/2006 | US6997782 Polishing apparatus and a method of polishing and cleaning and drying a wafer |
| 02/14/2006 | US6997781 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 02/14/2006 | US6997778 Polishing apparatus |
| 02/14/2006 | US6997776 Process for producing a semiconductor wafer |
| 02/09/2006 | WO2006014411A1 Method and system for processing wafers |
| 02/09/2006 | WO2006013996A1 Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium |
| 02/09/2006 | US20060030503 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 02/09/2006 | US20060030244 Substrate polishing apparatus |
| 02/09/2006 | US20060030243 Polishing composition |
| 02/09/2006 | US20060030241 Pad backer and cmp process using the same |
| 02/09/2006 | US20060030240 Method and apparatus for planarizing microelectronic workpieces |
| 02/09/2006 | US20060027528 Ion bombardment of electrical lapping guides to decrease noise during lapping process |
| 02/08/2006 | EP1622743A2 Whole-substrate spectral imaging system for cmp |
| 02/08/2006 | CN1732068A Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
| 02/08/2006 | CN1240802C Cerium based abrasive material and method for preparation thereof |
| 02/08/2006 | CN1240797C Polishing agent and method for producing planar layers |
| 02/07/2006 | US6995850 Monitoring apparatus for polishing pad and method thereof |
| 02/07/2006 | US6995091 Process for chemically mechanically polishing wafers |
| 02/07/2006 | US6995090 Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device |
| 02/07/2006 | US6994802 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices |
| 02/07/2006 | US6994612 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing |
| 02/07/2006 | US6994611 (CMP); polishing head for holding and applying first or second a wafer to the CMP pad surface; and a chemical dispenser for uniformly applying pad cleaning chemicals appropriate for either copper or oxide wafer surface across the CMP pad surface |
| 02/07/2006 | US6994607 Polishing pad with window |
| 02/07/2006 | US6993934 Dental glass powders |
| 02/07/2006 | CA2497731C Magnetorheological polishing devices and methods |
| 02/02/2006 | US20060025061 Polishing pad having grooves configured to promote mixing wakes during polishing |
| 02/02/2006 | US20060025056 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| 02/02/2006 | US20060025052 Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| 02/02/2006 | US20060022368 Method of fabricating polyurethane foam with micro pores and polishing pad therefrom |
| 02/01/2006 | EP1622193A1 Polishing pad and method for producing same |
| 02/01/2006 | EP1621595A1 Method of manufacturing polishing slurry for use in precise polishing process |
| 02/01/2006 | EP1242557B8 Method of polishing or planarizing a substrate |
| 02/01/2006 | CN2754814Y Rolling arm structure of grinder |
| 02/01/2006 | CN1729082A 流动控制系统 Flow control system |
| 02/01/2006 | CN1728343A Baffle and wafer grinding appts. |
| 02/01/2006 | CN1240111C Device for eliminating stress by machining |
| 02/01/2006 | CN1239962C Photosensitive object regenerative method and device, photosensitive object, image forming device |
| 02/01/2006 | CN1239665C Polishing compound and method for preparation thereof, and polishing method |
| 02/01/2006 | CN1239243C Process and apparatus for blending and distributing a slurry solution |
| 01/31/2006 | US6992009 Method of manufacturing a semiconductor device |
| 01/31/2006 | US6991740 Method for reducing removal forces for CMP pads |
| 01/31/2006 | US6991528 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The |
| 01/31/2006 | US6991526 Control of removal profile in electrochemically assisted CMP |
| 01/31/2006 | US6991520 Abrasive machine and method of abrading work piece |
| 01/31/2006 | US6991517 Linear polishing sheet with window |
| 01/31/2006 | US6991516 Chemical mechanical polishing with multi-stage monitoring of metal clearing |
| 01/31/2006 | US6991515 Ultra fine particle film forming method and apparatus |
| 01/31/2006 | US6991513 Magnetic head grinding device and method |
| 01/31/2006 | US6991512 Apparatus for edge polishing uniformity control |
| 01/26/2006 | WO2006009634A1 Continuous contour polishing of a multi-material surface |
| 01/26/2006 | WO2006009304A1 Polishing apparatus and substrate processing method |
| 01/26/2006 | WO2006009222A1 Plate glass crack detection method and detector, and plate glass polishing method and device |
| 01/26/2006 | WO2006009160A1 Cmp polishing agent and method for polishing substrate |
| 01/26/2006 | US20060019588 Polishing pad, polishing apparatus having the same, and bonding apparatus |
| 01/26/2006 | US20060019584 Method and apparatus for conditioning a polishing pad |
| 01/26/2006 | US20060019583 Method and apparatus for conditioning a polishing pad |
| 01/26/2006 | US20060016128 Abrasive material having an antiloading coating |
| 01/25/2006 | EP1618991A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 01/25/2006 | EP1294534B2 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 01/25/2006 | CN1726534A Method and apparatus for grounding a magnetic recording head |
| 01/25/2006 | CN1726240A Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof |
| 01/25/2006 | CN1726116A Polishing state monitoring apparatus and polishing apparatus and method |
| 01/25/2006 | CN1238838C Processing method of polishing head |
| 01/25/2006 | CN1238560C Solution used for platinum chemical mechanical polishing |
| 01/25/2006 | CN1238455C Slurry for chemical mechanical polishing |
| 01/25/2006 | CN1238161C Abrasive article having window system for polishing wafers, and using methods |
| 01/24/2006 | US6989117 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| 01/24/2006 | US6988942 Conductive polishing article for electrochemical mechanical polishing |