Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2005
10/12/2005CN1680510A Ceria slurry for polishing semiconductor thin layer
10/12/2005CN1680509A Polishing composition
10/12/2005CN1680076A Processing method and apparatus for media surface of hard disk in dynamic electronic measurement
10/11/2005USRE38826 Apparatus for and method for polishing workpiece
10/11/2005US6953750 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization
10/11/2005US6953515 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
10/11/2005US6953489 Capsulated abrasive composition and polishing pad using the same
10/11/2005US6953391 Methods for reducing slurry usage in a linear chemical mechanical planarization system
10/11/2005US6953388 Polishing pad, and method and apparatus for polishing
10/11/2005US6953385 System, method, and apparatus for non-traditional kinematics/tooling for efficient charging of lapping plates
10/11/2005US6953382 Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
10/06/2005WO2005093805A1 Composition for polishing semiconductor
10/06/2005WO2005093804A1 Composition for polishing semiconductor
10/06/2005WO2005093803A1 Composition for polishing semiconductor
10/06/2005WO2005093802A1 Composition for polishing semiconductor
10/06/2005WO2005092564A1 Vacuum chuck and suction board
10/06/2005WO2005092010A2 Chemical mechanical polishing retaining ring
10/06/2005US20050222336 Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process
10/06/2005US20050222288 Charging prepolymer, a foaming agent and an active hydrogen-containing compound in specified amounts into a tank and foaming/mixing them for a specified time by a mixer, then pouring the mixture liquid into a metal mold; producing a fine-bubble polyurethane foam, evenly formed, without hollow balloons
10/06/2005US20050221741 Polymeric polishing pad having continuously regenerated work surface
10/06/2005US20050221736 Wafer polishing control system for chemical mechanical planarization machines
10/06/2005US20050221734 Carrier head with a non-stick membrane
10/06/2005US20050221733 Polishing apparatus
10/06/2005US20050221731 Polishing pad conditioning system
10/06/2005US20050221730 Polishing pad conditioning and polishing liquid dispersal system
10/06/2005US20050221726 Abrasive with an average particle size of 1 to 30 nm and water and having a packing ratio of from 79 to 90% by weight; suitable for precision parts including such as magnetic recording media, photomask substrates, optical disks, lenses, mirrors, and prisms, and semiconductor substrates
10/06/2005US20050221725 Method of sucking water and water sucking device
10/06/2005US20050221724 Polishing apparatus and method of polishing a subject
10/06/2005US20050221723 Multi-layer polishing pad for low-pressure polishing
10/06/2005US20050221722 Wafer grinding using an adhesive gel material
10/06/2005US20050221615 Method of processing a substrate
10/06/2005US20050221608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
10/06/2005US20050218548 Polishing pad and method of making same
10/06/2005US20050218008 Method of manufacturing semiconductor device
10/06/2005US20050217106 Apparatus and method for precise lapping of recessed and protruding elements in a workpiece
10/06/2005DE102005012608A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
10/06/2005DE102004013467A1 Method for lapping semiconductor wafers, involves reducing rotational lapping speeds gradually to zero
10/06/2005DE10060697B4 Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens The double-side polishing method with reduced scratches rate and apparatus for carrying out the method
10/05/2005EP1582294A2 Method of sucking water and water sucking device
10/05/2005EP1582293A2 Polishing apparatus
10/05/2005CN2730819Y Guiding adjuster for conveying band of drum type abrasive cloth wheel machine
10/05/2005CN2730554Y Polishing-part for polishing substrate
10/05/2005CN2730553Y Polishing-part for electrochemical mechanical polishing
10/05/2005CN2730551Y Adjustable ceramic ball lapping and processing device
10/05/2005CN1679157A Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer
10/05/2005CN1678708A Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
10/05/2005CN1676566A Abrasives and compositions for chemical mechanical planarization of tungsten and titanium
10/05/2005CN1676563A Compositions and methods for chemical mechanical planarization of tungsten and titanium
10/04/2005US6951597 Dynamic polishing fluid delivery system for a rotational polishing apparatus
10/04/2005US6951512 Chemical mechanical polishing apparatus and method of chemical mechanical polishing
10/04/2005US6951511 Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system
10/04/2005US6951509 Undulated pad conditioner and method of using same
10/04/2005US6951507 Substrate polishing apparatus
10/04/2005US6951506 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
10/04/2005US6951503 System and method for in-situ measuring and monitoring CMP polishing pad thickness
10/04/2005US6951502 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
09/2005
09/29/2005WO2005090648A2 Electrolytic processing apparatus and electrolytic processing method
09/29/2005WO2005090511A1 Polishing composition and polishing method
09/29/2005WO2005090001A1 Liquid supplying apparatus, polishing apparatus and semiconductor device manufacturing method
09/29/2005WO2004033574A8 Cmp method utilizing amphiphilic non-ionic surfactants
09/29/2005US20050215188 CMP pad conditioner having working surface inclined in radially outer portion
09/29/2005US20050215183 Chemical-mechanical planarization composition having PVNO and associated method for use
09/29/2005US20050215182 Wafer carrier with pressurized membrane and retaining ring actuator
09/29/2005US20050215181 Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
09/29/2005US20050215180 Semiconductor device fabrication method
09/29/2005US20050215179 Low surface energy CMP pad
09/29/2005US20050215178 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
09/29/2005US20050215177 CMC porous pad with component-filled pores
09/29/2005US20050215060 Polishing composition and polishing method
09/29/2005US20050214191 Improving metal removal while suppressing dielectric layer removal; dispersing concentrated fumed silica into acidified water and diluting
09/29/2005US20050211952 Compositions and methods for chemical mechanical planarization of tungsten and titanium
09/29/2005US20050211377 Multiple zone carrier head with flexible membrane
09/29/2005US20050211376 a layer comprising hydrophobic and hydrophilic polymer segments, and end-point detection apertures, used for chemical mechanical polishing substrates
09/29/2005DE102004011994A1 Semiconductor wafer manufacturing method for fabricating electronic components, involves polishing front and rear sides of wafer in two phases, where wafer material is removed up to five micrometer during one phase in short time
09/28/2005EP1580802A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
09/28/2005EP1580248A1 Polishing composition and polishing method
09/28/2005EP1580247A1 Polishing composition and polishing method
09/28/2005EP1580243A1 Polishing composition and polishing method
09/28/2005EP1579956A2 Polishing apparatus and polishing method
09/28/2005EP1579482A2 Method and apparatus for planarizing a semiconductor wafer
09/28/2005CN1675331A CMP abrasive and substrate polishing method
09/28/2005CN1675063A Controlled penetration subpad
09/28/2005CN1675027A Subpad having robust, sealed edges
09/28/2005CN1674234A Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device
09/28/2005CN1674224A Method of processing a substrate
09/28/2005CN1673306A Polishing composition
09/28/2005CN1672876A Polishing apparatus and method of polishing a subject
09/28/2005CN1672875A Chemico-mechanical diamond film polisher and polishing method
09/28/2005CN1672874A Chip grinding stage
09/28/2005CN1672873A False making process and grinding pad regulating method for chemomechanical grinding process
09/28/2005CN1220973C Equipment and method for lapping magnetic head
09/28/2005CN1220798C Pad designs and structures for universal material working equipment
09/28/2005CN1220742C Use of CsOH in dielectric CMP slurry
09/28/2005CN1220572C Clamp for machining
09/27/2005US6950289 Embedded lapping guide for a magnetic head cluster
09/27/2005US6949466 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
09/27/2005US6949020 Methods for making reinforced wafer polishing pads and apparatuses implementing the same
09/27/2005US6949016 Gimballed conditioning apparatus
09/27/2005US6949012 Polishing pad conditioning method and apparatus
09/27/2005US6949011 Method and apparatus for cleaning a web-based chemical mechanical planarization system
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