B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2006
10/31/2006	US7128825 Method and composition for polishing a substrate
10/31/2006	US7128821 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis
10/31/2006	US7128803 Integration of sensor based metrology into semiconductor processing tools
10/26/2006	WO2006112519A1 Polishing composition
10/26/2006	WO2006112392A1 Shower plate and method for manufacturing the same
10/26/2006	WO2006112377A1 Polishing slurry and polishing material using same
10/26/2006	WO2006111790A1 Chemical-mechanical polishing method and apparatus
10/26/2006	US20060241006 Contains abrasive grains such as magnesium oxide (MnO, MnO2, Mn2O3, Mn3O4), with hydrogen peroxide as solvent, washing with hydrofluoric acid solution, spin drying
10/26/2006	US20060240749 Chemical Mechanical Polishing Apparatus and Methods Using a Polishing Surface with Non-Uniform Rigidity
10/26/2006	US20060240748 Method of manufacturing abrasive composition
10/26/2006	US20060237330 Algorithm for real-time process control of electro-polishing
10/26/2006	US20060236922 Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device
10/25/2006	EP1048409B1 Planetary gear system parallel planer
10/25/2006	CN2829980Y Protective ring drainage structure
10/25/2006	CN2829979Y Steel ball grinder
10/25/2006	CN1852788A Polishing pad with recessed window
10/25/2006	CN1852787A Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
10/25/2006	CN1852786A Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
10/25/2006	CN1282226C Cerium oxide abrasive and method of abrading substrates
10/24/2006	US7125477 Contacts for electrochemical processing
10/24/2006	US7125326 Apparatus and method for removing a CMP polishing pad from a platen
10/24/2006	US7125324 Insulated pad conditioner and method of using same
10/24/2006	US7125318 Polishing pad having a groove arrangement for reducing slurry consumption
10/24/2006	US7125313 Apparatus and method for abrading a workpiece
10/24/2006	US7124753 Brazed diamond tools and methods for making the same
10/19/2006	WO2006110224A2 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
10/19/2006	US20060234610 Apparatus for conditioning chemical-mechanical polishing pads
10/19/2006	US20060234609 Substrate holding apparatus
10/19/2006	US20060234508 Substrate processing apparatus and substrate processing method
10/19/2006	US20060231795 Securing a document by applying a phosphor powder containing particles that are spherical and have an average particle size of 0.31 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths
10/19/2006	US20060231414 Electropolishing by having a conductive rotating contact element extending from a polishing surface of a pad body which rotates while in contact with the substrate and is in a fluid channel formed in the pad through which an electrolyte is flowing to activate the conductive rotating contact element
10/19/2006	DE102006016312A1 Radial ausgerichtetes Polierkissen Radially oriented polishing pad
10/19/2006	DE102006013728A1 Verfahren zum Herstellen einer Polierslurry mit hoher Dispersionsstabilität A method of manufacturing a polishing slurry with high dispersion stability
10/18/2006	CN1849379A Abrasive partilcle for chemical mechanical polishing
10/18/2006	CN1849264A Cerium salt, process for producing the same, cerium oxide, and cerium-based abrasive material
10/18/2006	CN1849198A Polished state monitoring apparatus and polishing apparatus using the same
10/18/2006	CN1846940A Radial-biased polishing pad
10/17/2006	US7122475 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/17/2006	US7122280 Angular substrates
10/17/2006	US7121938 Polishing pad and method of fabricating semiconductor substrate using the pad
10/17/2006	US7121934 Carrier head for chemical mechanical polishing apparatus
10/17/2006	US7121933 Chemical mechanical polishing apparatus
10/17/2006	US7121926 Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
10/17/2006	US7121921 Methods for planarizing microelectronic workpieces
10/17/2006	US7121919 Chemical mechanical polishing system and process
10/12/2006	WO2006107116A1 Cerium oxide abrasives, process for production of the same, and use thereof
10/12/2006	WO2006105785A1 Device for precisely surface machining a workpiece
10/12/2006	US20060229008 Chemical mechanical polishing pads
10/12/2006	US20060229002 Radial-biased polishing pad
10/12/2006	US20060229001 Exposing substance, exposing method, and exposing device
10/12/2006	US20060229000 Polishing pad
10/12/2006	US20060228999 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
10/12/2006	US20060228995 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
10/12/2006	US20060228992 Process control in electrochemically assisted planarization
10/12/2006	US20060228991 Polishing method and apparatus
10/12/2006	US20060228439 Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad
10/12/2006	US20060227461 Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
10/12/2006	US20060226124 Substrate and a method for polishing a substrate
10/12/2006	DE102005017006A1 Machining device for at least one workpiece has at least one force measurement device between workpiece clamping table and machine stand
10/12/2006	DE102005016411A1 Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes The high-precision surface machining of a workpiece
10/11/2006	EP1710048A1 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device
10/11/2006	EP1710047A2 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing
10/11/2006	EP1710045A1 A substrate and a method for polishing a substrate
10/11/2006	EP1708848A2 Chemical mechanical planarization process control utilizing in-situ conditioning process
10/11/2006	EP1626838B1 Exposing substance, exposing method, and exposing device
10/11/2006	CN1845007A Substrate and a method for polishing a substrate
10/11/2006	CN1843698A Iron dust core grinding device, method and finished product thereof
10/10/2006	US7119908 Method and apparatus for measuring thickness of thin film and device manufacturing method using same
10/10/2006	US7118457 Method of forming a polishing pad for endpoint detection
10/10/2006	US7118456 Polishing head, retaining ring for use therewith and method fo polishing a substrate
10/10/2006	US7118455 Semiconductor workpiece processing methods
10/10/2006	US7118451 CMP apparatus and process sequence method
10/10/2006	US7118450 Polishing pad with window and method of fabricating a window in a polishing pad
10/10/2006	US7118447 Semiconductor workpiece processing methods
10/10/2006	US7118445 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor
10/10/2006	US7118291 End face polishing apparatus
10/05/2006	WO2006103858A1 Abrasive for semiconductor integrated circuit device, method of polishing therewith and process for producing semiconductor integrated circuit device
10/05/2006	US20060223425 Semiconductor processing methods of removing conductive material
10/05/2006	US20060223424 Polishing Pad
10/05/2006	US20060223421 Polishing apparatus
10/05/2006	US20060223418 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
10/05/2006	US20060219662 Fabrication process of semiconductor device and polishing method
10/05/2006	US20060219573 Apparatus with conductive pad for electroprocessing
10/05/2006	US20060218867 Polishing composition and polishing method using the same
10/04/2006	EP1707314A1 Polishing apparatus
10/04/2006	EP1706898A2 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
10/04/2006	EP1115643A4 Apparatus for sensing the presence of a wafer
10/04/2006	CN2822875Y Chemically mechanical diamond membrane polishing device
10/04/2006	CN1842897A Polishing composition and polishing method using same
10/04/2006	CN1840602A Method for preparing a polishing slurry having high dispersion stability
10/04/2006	CN1840290A Polishing apparatus
10/04/2006	CN1278395C Method for chemical mechanical polishing (CMP) with altering concentration of oxidizing agent in slurry
10/04/2006	CN1277654C Lapping apparatus and lapping method
10/03/2006	US7115026 Polishing apparatus
10/03/2006	US7115024 Profile control platen
10/03/2006	US7115022 Method and apparatus for polishing a substrate
10/03/2006	US7115021 Abrasive, method of polishing target member and process for producing semiconductor device
10/03/2006	US7115016 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
09/2006
09/28/2006	US20060217049 Perforation and grooving for polishing articles
09/28/2006	US20060217042 Method of manufacturing a thin-film magnetic head slider

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