| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/11/2006 | WO2006049269A1 Polishing apparatus |
| 05/11/2006 | WO2006049197A1 METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES |
| 05/11/2006 | WO2005092010A3 Chemical mechanical polishing retaining ring |
| 05/11/2006 | WO2005090648A3 Electrolytic processing apparatus and electrolytic processing method |
| 05/11/2006 | US20060099890 Simultaneous planarization of pole piece and coil materials for write head applications |
| 05/11/2006 | US20060099887 Grinding jig set and grinding method |
| 05/11/2006 | US20060099886 Electronic die positioning device and method |
| 05/11/2006 | US20060096702 Apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing |
| 05/10/2006 | EP1655776A1 Polishing method |
| 05/10/2006 | EP1655103A1 Method of making an abrasive article |
| 05/10/2006 | CN2778470Y 研磨装置 Grinding device |
| 05/10/2006 | CN2778469Y Light resin ball grinder |
| 05/10/2006 | CN2778468Y Grinding disc |
| 05/10/2006 | CN1771587A Polishing pad and method for producing same |
| 05/10/2006 | CN1771586A Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry |
| 05/10/2006 | CN1771355A Method and apparatus for local polishing control |
| 05/10/2006 | CN1771110A Polishing pad apparatus and methods |
| 05/10/2006 | CN1770403A Tubular polishing pressure ring |
| 05/10/2006 | CN1769006A 抛光方法 Polishing method |
| 05/10/2006 | CN1255859C Chemical machinery grinding equipment |
| 05/10/2006 | CN1255854C Ammonium oxalate-containing polishing system and method |
| 05/09/2006 | US7042581 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| 05/09/2006 | US7041599 High through-put Cu CMP with significantly reduced erosion and dishing |
| 05/09/2006 | US7040971 Carrier head with a flexible membrane |
| 05/09/2006 | US7040967 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization |
| 05/09/2006 | US7040965 Methods for removing doped silicon material from microfeature workpieces |
| 05/09/2006 | US7040964 Polishing media stabilizer |
| 05/09/2006 | US7040963 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer |
| 05/09/2006 | US7040958 Torque-based end point detection methods for chemical mechanical polishing tool which uses ceria-based CMP slurry to polish to protective pad layer |
| 05/09/2006 | US7040957 Platen and manifold for polishing workpieces |
| 05/09/2006 | US7040956 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 05/09/2006 | US7040955 Chemical-mechanical planarization tool force calibration method and system |
| 05/09/2006 | US7040952 Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process |
| 05/04/2006 | US20060094345 Polishing pad, polishing apparatus having the same, and bonding apparatus |
| 05/04/2006 | US20060094242 Chemical mechanical polishing method, and washing/rinsing method associated therewith |
| 05/04/2006 | US20060090402 Polishing composition |
| 05/04/2006 | DE112004001051T5 Substratpoliervorrichtung und Substratpolierverfahren Substrate polishing apparatus and substrate polishing method |
| 05/04/2006 | DE102005049202A1 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same |
| 05/04/2006 | DE10130750B4 Verfahren und Vorrichtung zur abrasiven Bearbeitung von Oberflächen auf Halbleiter-Wafern Method and device for the abrasive machining of surfaces on semiconductor wafers |
| 05/03/2006 | EP1651388A2 Multi-layer polishing pad material for cmp |
| 05/03/2006 | EP1651387A1 Polishing pad having edge surface treatment |
| 05/03/2006 | EP1651386A1 In situ activation of a three-dimensional fixed abrasive article |
| 05/03/2006 | CN1768417A Polishing pad, process for producing the same and method of polishing therewith |
| 05/03/2006 | CN1766028A 抛光组合物 The polishing composition |
| 05/03/2006 | CN1765579A Equipment and method for removing CMP pad from platen |
| 05/03/2006 | CN1765578A Maintenance method of dedicated digit controlled machine tool plastic jacket |
| 05/03/2006 | CN1254518C Cerium-based polishing material slurry and method for manufacturing the same |
| 05/02/2006 | US7037839 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
| 05/02/2006 | US7037838 Method for polishing a substrate surface |
| 05/02/2006 | US7037451 Forming the abrasive silica*alumina particles in the aerosol stream, heating; use for chemical mechanical polishing integrated circuit; fine particles coupling with coatings by silanes, narrow particle size distribution, unagglomerated |
| 05/02/2006 | US7037352 Polishing particle and method for producing polishing particle |
| 05/02/2006 | US7037184 Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| 05/02/2006 | US7037179 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/02/2006 | US7037178 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing |
| 05/02/2006 | US7037177 Method and apparatus for conditioning a chemical-mechanical polishing pad |
| 05/02/2006 | US7037175 Method of sharpening cutting edges |
| 05/02/2006 | US7037174 Methods for reducing delamination during chemical mechanical polishing |
| 05/02/2006 | US7037172 Advanced wafer planarizing |
| 05/02/2006 | CA2403860C Tubing head seal assembly |
| 04/27/2006 | WO2006044466A1 Method of sharpening cutting edges |
| 04/27/2006 | WO2006020153A3 Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs |
| 04/27/2006 | WO2005024287A3 Working surface and system for production thereof |
| 04/27/2006 | US20060086056 Aqueous slurry composition for chemical mechanical planarization |
| 04/26/2006 | EP1650278A2 Composition for selectively polishing silicon nitride layer and polishing method employing it |
| 04/26/2006 | EP1649075A2 Cvd diamond-coated composite substrate and method for making same |
| 04/26/2006 | EP1648658A2 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 04/26/2006 | EP1490830B1 Abrasive articles and methods for the manufacture and use of same |
| 04/26/2006 | CN2774706Y Grinder |
| 04/26/2006 | CN1253740C Appts. for and method of maching of optical connector end |
| 04/25/2006 | US7033252 Wafer carrier with pressurized membrane and retaining ring actuator |
| 04/25/2006 | US7033251 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces |
| 04/25/2006 | US7033250 Method for chemical mechanical planarization |
| 04/25/2006 | US7033248 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 04/25/2006 | US7033246 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 04/25/2006 | US7033245 Lapping apparatus and lapping method |
| 04/20/2006 | WO2006042010A1 Method and apparatus for improved chemical mechanical planarization |
| 04/20/2006 | WO2006041889A2 Conductive pad design modification for better wafer-pad contact |
| 04/20/2006 | WO2006041727A1 A chemical mechanical polishing pad and method for selective metal and barrier polishing |
| 04/20/2006 | WO2006041248A1 Loading device for chemical mechanical polisher of semiconductor wafer |
| 04/20/2006 | WO2006040864A1 Abrasive pad |
| 04/20/2006 | US20060084369 Polishing apparatus |
| 04/20/2006 | US20060084367 Method of sharpening cutting edges |
| 04/20/2006 | US20060084365 Polishing pad |
| 04/20/2006 | US20060084270 Composition for selectively polishing silicon nitride layer and polishing method employing it |
| 04/20/2006 | US20060081460 Method and apparatus for electrochemical planarization of a workpiece |
| 04/20/2006 | US20060080896 edge polishing a semiconductor substrate using a mixture containing imidazole and the imidazole derivative contribute to an improvement of the polishing ability; silica abrasives, tetramethylammonium hydroxide, a water-soluble polymer, a chelating agent, and water, and containing no oxidizing agent |
| 04/19/2006 | EP1647359A1 Polishing pad |
| 04/19/2006 | EP1646478A1 Method for epiready surface treatment on sic thin films |
| 04/19/2006 | EP1345734B1 Crosslinked polyethylene polishing pad for chemical-mechnical polishing and polishing apparatus |
| 04/19/2006 | CN1760307A Polishing composition and polishing method using the same |
| 04/19/2006 | CN1760240A 抛光垫 Polishing pad |
| 04/18/2006 | US7030018 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
| 04/18/2006 | US7029747 nonporous uniform transparent polymer elastic support layer and a semitransparent polishing layer that has a higher hardness than the support layer; both made of compatible materials so that a structural border between the layers does not exist; open pores defined by the embedded liquid microelements |
| 04/18/2006 | US7029596 Computer integrated manufacturing control system for oxide chemical mechanical polishing |
| 04/18/2006 | US7029509 Performance; efficiency |
| 04/18/2006 | US7029508 Catalyst attached to solid and used to promote free radical formation in CMP formulations |
| 04/18/2006 | US7029386 Retaining ring assembly for use in chemical mechanical polishing |
| 04/18/2006 | US7029383 Polishing head of chemical mechanical polishing apparatus |
| 04/18/2006 | US7029382 Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 04/18/2006 | US7029381 Apparatus and method for chemical mechanical polishing of substrates |