Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2005
11/30/2005EP1600260A1 Chemical mechanical polishing pad
11/30/2005EP1600258A1 Method and apparatus for polishing substrate
11/30/2005EP1599555A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
11/30/2005EP1599314A1 Materials and methods for chemical-mechanical planarization
11/30/2005CN2743083Y Edge contact type crystal chip carrier
11/30/2005CN1702840A Polishing pad for electrochemical mechanical polishing
11/30/2005CN1701919A Chemical mechanical polishing pad
11/30/2005CN1229204C Belt polishing device with double retainer ring
11/29/2005US6969687 Method of planarizing a semiconductor die
11/29/2005US6969309 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
11/29/2005US6969308 Method and apparatus for chemical and mechanical polishing
11/29/2005US6969307 Polishing pad conditioning and polishing liquid dispersal system
11/29/2005US6969306 Apparatus for planarizing microelectronic workpieces
11/29/2005US6969305 Polishing apparatus
11/29/2005US6969304 Method of polishing semiconductor wafer
11/29/2005US6969302 Semiconductor wafer grinding method
11/29/2005US6969297 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
11/29/2005US6968772 Slide-type cylinder coupling for CMP load cup
11/24/2005WO2005110679A1 Composition for polishing
11/24/2005WO2005110675A2 Polishing pad
11/24/2005US20050260942 Chemical mechanical polishing pad
11/24/2005US20050260938 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
11/24/2005US20050260936 Dynamic atomizer on conditioner assemblies using high velocity water
11/24/2005US20050260933 Polishing apparatus and method
11/24/2005US20050260931 Carrier heads, planarizing machines and methods for mechanical or chemcial-mechanical planarization of microelectronic-device substrate assemblies
11/24/2005US20050260930 Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
11/24/2005US20050260929 Chemical mechanical polishing pad and chemical mechanical polishing method
11/24/2005US20050260928 Integral polishing pad and manufacturing method thereof
11/24/2005US20050260927 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
11/24/2005US20050260925 Polishing apparatus
11/24/2005US20050260924 Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
11/24/2005US20050260922 Torque-based end point detection methods for chemical mechanical polishing tool which uses ceria-based CMP slurry to polish to protective pad layer
11/24/2005US20050260855 Method and apparatus for planarizing a semiconductor wafer
11/24/2005US20050258139 Polishing method to reduce dishing of tungsten on a dielectric
11/23/2005CN1701136A Low-force electrochemical mechanical processing method and apparatus
11/23/2005CN1701110A Cerium based polishing material and raw materials therefor
11/23/2005CN1701108A Cerium-based polishing material
11/23/2005CN1700970A Control of removal profile in electrochemically assisted CMP
11/23/2005CN1700423A Micromachining methods and systems
11/23/2005CN1699444A Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers
11/23/2005CN1699019A Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method
11/23/2005CN1699018A Method of surface polishing and element
11/23/2005CN1699017A Abrasive cloth, polishing device and method for manufacturing semiconductor device
11/23/2005CN1699016A Conditioning method for polishing pad in chemical mechanical polishing system
11/22/2005US6967715 Method and apparatus for optical film measurements in a controlled environment
11/22/2005US6967166 Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
11/22/2005US6966826 Grinding wheel
11/22/2005US6966822 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
11/22/2005US6966821 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
11/22/2005US6966816 Integrated endpoint detection system with optical and eddy current monitoring
11/17/2005WO2005109481A1 Polishing composition and substrate polishing method
11/17/2005WO2005109480A1 Polishing slurry
11/17/2005US20050255803 Precision abrasive finishing apparatus
11/17/2005US20050255794 Polishing pad
11/17/2005US20050255792 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
11/16/2005EP1595643A2 Apparatus for grinding a disc-shaped element
11/16/2005EP1595281A1 Polishing method
11/16/2005EP1594656A1 Polishing article for electro-chemical mechanical polishing
11/16/2005EP1594653A2 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
11/16/2005CN1698185A Substrate holding device and polishing device
11/16/2005CN1697869A Abrasive material
11/16/2005CN1697153A Multiple zone carrier head with flexible membrane
11/16/2005CN1697139A Single-layer polishing pad and method of producing the same
11/16/2005CN1696235A Barrier polishing solution
11/15/2005USRE38878 Polishing apparatus
11/15/2005US6965809 Method for characterizing and simulating a chemical mechanical polishing process
11/15/2005US6964604 Fiber embedded polishing pad
11/15/2005US6964602 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/15/2005US6964601 Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers
11/15/2005US6964600 High selectivity colloidal silica slurry
11/15/2005US6964598 Polishing apparatus and method for forming an integrated circuit
11/15/2005US6964597 Retaining ring with trigger for chemical mechanical polishing apparatus
11/10/2005WO2005106855A1 Additive-free fiber for metal texture of hard disk drives
11/10/2005WO2005105356A2 Electrochemical mechanical planarization process and apparatus
11/10/2005US20050250431 Single-layer polishing pad and method of producing the same
11/10/2005US20050250426 Method and an element for surface polishing
11/10/2005US20050250425 Chemical mechanical polishing equipment and conditioning thereof
11/10/2005US20050250424 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
11/10/2005US20050250334 Polishing method for semiconductor substrate, and polishing jig used therein
11/10/2005US20050248883 Additive-free fiber for metal texture of hard disk drives
11/10/2005US20050248882 Magnetic hard disk substrate
11/10/2005US20050248230 Motor
11/10/2005DE102005016554A1 Polierlösung für Barrieren Polishing solution for barriers
11/09/2005EP1593460A1 Surface polishing element and method
11/09/2005EP1593148A1 Substrate holding apparatus and polishing apparatus
11/09/2005EP1485440A4 Free radical-forming activator attached to solid and used to enhance cmp formulations
11/09/2005CN2738946Y Pumice-rubber grinding plate
11/09/2005CN1694788A Brazed diamond tools and methods for making the same
11/09/2005CN1694784A Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device
11/09/2005CN1694783A Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
11/09/2005CN1694782A Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device
11/09/2005CN1693406A Polishing composition and polishing method
11/08/2005US6963407 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program
11/08/2005US6962524 Conductive polishing article for electrochemical mechanical polishing
11/08/2005US6962520 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
11/03/2005WO2005104199A1 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
11/03/2005WO2005102604A1 Abrasive cloth and method for preparing nano-fiber structure
11/03/2005WO2005049274A3 Retaining ring with shaped surface
11/03/2005WO2004109758A3 Back pressure control system for cmp and wafer polishing
11/03/2005US20050245181 Vibration damping during chemical mechanical polishing
1 ... 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 ... 209