| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 01/24/2006 | US6988936 Surface preparation for receiving processing treatments |
| 01/24/2006 | US6988934 Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system |
| 01/24/2006 | US6988932 Apparatus of sealing wafer backside for full-face processing |
| 01/24/2006 | CA2441383C Polishing pad and system |
| 01/24/2006 | CA2382724C Nanometer-sized silica-coated alpha-alumina abrasives in chemical mechanical planarization |
| 01/19/2006 | WO2006006721A1 Texturing processing composition |
| 01/19/2006 | US20060014479 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool |
| 01/19/2006 | US20060014477 Polishing pad with flow modifying groove network |
| 01/19/2006 | US20060014476 Method of fabricating a window in a polishing pad |
| 01/19/2006 | US20060011585 Method for controlling ph during planarization and cleaning of microelectronic substrates |
| 01/19/2006 | US20060010781 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
| 01/18/2006 | EP1617465A1 Cmp polishing method and method for manufacturing semiconductor device |
| 01/18/2006 | EP1616927A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
| 01/18/2006 | EP1616662A1 Both side grinding method and both side grinder of thin disc-like work |
| 01/18/2006 | EP1615749A1 Polishing pad with a window |
| 01/18/2006 | EP1294534B1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 01/18/2006 | EP1261530A4 Package with multiple chambers and valves |
| 01/18/2006 | CN2751972Y Polishing product for processing base material |
| 01/18/2006 | CN2751969Y Mould centre end lapping machine |
| 01/18/2006 | CN1723546A Carrier head for chemical-mechanical polishing apparatus |
| 01/18/2006 | CN1721494A Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
| 01/18/2006 | CN1721493A Multiple process polishing solution for chemical mechanical planarization |
| 01/18/2006 | CN1721135A Method of grinding, finish grinding precision bearing steel ball by using grinding oil and major cycle resin grinding wheel |
| 01/18/2006 | CN1237582C Abrasive cloth, polishing device and method for manufacturing semiconductor device |
| 01/18/2006 | CN1236895C Chemical machinery flattening system, chemical machinery polishing system and adjustable plate |
| 01/18/2006 | CN1236894C Abrading substances holding material and manufacturing method thereof |
| 01/18/2006 | CN1236893C Grinding method and device |
| 01/17/2006 | US6986705 Polishing pad and method of making same |
| 01/17/2006 | US6986701 Polishing pad with built-in optical sensor |
| 01/17/2006 | US6986700 Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 01/17/2006 | US6986699 Method and apparatus for determining polishing endpoint with multiple light sources |
| 01/17/2006 | US6986284 System and method for characterizing a textured surface |
| 01/12/2006 | WO2005110675A3 Polishing pad |
| 01/12/2006 | US20060009136 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 01/12/2006 | US20060009132 Chemical mechanical polishing apparatus with non-conductive elements |
| 01/12/2006 | US20060009131 Data processing for monitoring chemical mechanical polishing |
| 01/12/2006 | US20060009130 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 01/12/2006 | US20060009129 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 01/12/2006 | US20060009128 Eddy current sensing of metal removal for chemical mechanical polishing |
| 01/12/2006 | US20060009127 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| 01/12/2006 | US20060009125 Both side grinding method and both side grinder of thin disc-like work |
| 01/12/2006 | US20060008650 Protecting thin semiconductor wafers during back-grinding in high-volume production |
| 01/12/2006 | US20060006142 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
| 01/11/2006 | EP1614505A1 Polishing device and method |
| 01/11/2006 | EP1613794A2 Algorithm for real-time process control of electro-polishing |
| 01/11/2006 | EP0959719A4 A brush assembly apparatus |
| 01/11/2006 | CN1718371A Polishing pad conditioner and methods of manufacture and recycling |
| 01/11/2006 | CN1235986C Compound for metal plate coating |
| 01/10/2006 | US6984582 Method of making semiconductor device by polishing with intermediate clean polishing |
| 01/10/2006 | US6984167 containing silica powder produced by melting raw material silica powder in flame; perfectly spherical; also contains alumina powder; average grain diameter of silica powder is 2 7 mu m; for silicon wafers |
| 01/10/2006 | US6984166 Zone polishing using variable slurry solid content |
| 01/10/2006 | US6984164 Polishing apparatus |
| 01/10/2006 | US6984163 Polishing pad with high optical transmission window |
| 01/10/2006 | US6984162 Apparatus methods for controlling wafer temperature in chemical mechanical polishing |
| 01/10/2006 | CA2387293C Improved engineered abrasives |
| 01/05/2006 | WO2006001340A1 Both-side polishing carrier and production method therefor |
| 01/05/2006 | US20060003678 System and method for reducing surface defects in integrated circuits |
| 01/05/2006 | US20060003675 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 01/05/2006 | US20060003673 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 01/05/2006 | US20060003672 Polishing apparatus |
| 01/05/2006 | US20060003670 Electrically enhanced surface planarization |
| 01/05/2006 | US20060003092 Method of and slurry for texturing glass substrate of magnetic hard disk |
| 01/05/2006 | US20060002283 Method for producing glass substrate for information recording medium, polishing apparatus and glass substrate for information recording medium |
| 01/04/2006 | EP1611996A1 Polishing machine |
| 01/04/2006 | EP1610929A1 Chip customized polish pads for chemical mechanical planarization (cmp) |
| 01/04/2006 | CN1717785A Polishing pad and method for manufacturing semiconductor device |
| 01/04/2006 | CN1234798C Composition for grinding and manufacturing method of storage hard disk using said composition |
| 01/03/2006 | US6982042 Ion bombardment of electrical lapping guides to decrease noise during lapping process |
| 01/03/2006 | US6982009 Method and device for cleaning abrasive plates on an abrasive machine |
| 12/29/2005 | WO2005124843A1 Silicon wafer manufacturing method and silicon wafer |
| 12/29/2005 | WO2005123857A1 Polishing method for glass substrate, and glass substrate |
| 12/29/2005 | WO2005123342A1 Process for producing improved membranes |
| 12/29/2005 | WO2005123337A1 Real time polishing process monitoring |
| 12/29/2005 | WO2005123336A2 Electrochemical-mechanical polishing system |
| 12/29/2005 | WO2005123335A1 Polishing apparatus and polishing method |
| 12/29/2005 | WO2005123333A2 Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor |
| 12/29/2005 | WO2005049274B1 Retaining ring with shaped surface |
| 12/29/2005 | US20050287940 Inlaid polishing pad and method of producing the same |
| 12/29/2005 | US20050287932 Article for polishin substrate surface |
| 12/29/2005 | US20050287930 Uninterrupted abrasive fluid supply |
| 12/29/2005 | US20050287929 Integrated endpoint detection system with optical and eddy current monitoring |
| 12/29/2005 | US20050287927 Method to monitor pad wear in CMP processing |
| 12/29/2005 | US20050286056 Method and apparatus for optical film measurements in a controlled environment |
| 12/29/2005 | US20050284770 A multilayer pad having a ring-shaped upper polish layer and replaceable conductive layer; attaching to exterior power source; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; tools for making semiconductors |
| 12/28/2005 | EP1610367A2 Cerium oxide abrasiveand method of polishing substrates |
| 12/28/2005 | EP1610365A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry |
| 12/28/2005 | CN2748222Y Hydraulic steel ball abrasive machine |
| 12/28/2005 | CN1714432A Slurry composition for secondary polishing of silicon wafer |
| 12/28/2005 | CN1713967A Chemical-solution supplying apparatus |
| 12/28/2005 | CN1713966A Platen assembly having a topographically altered platen surface |
| 12/28/2005 | CN1713941A Transmitter for wireless control |
| 12/28/2005 | CN1713356A Polishing pad having a pressure relief channel |
| 12/28/2005 | CN1712187A Polishing seat with concave structure for improving mixed tail trace |
| 12/28/2005 | CN1233508C Grooved polishing pads and methods of use |
| 12/28/2005 | CN1233506C Thin film for vacuum sucking wafer, wafer sucking device and vacuum sucking grinder |
| 12/27/2005 | US6980300 Method and apparatus for generating a polishing process endpoint signal using scatterometry |
| 12/27/2005 | US6979701 Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam |
| 12/27/2005 | US6979650 Fabrication method of semiconductor integrated circuit device |
| 12/27/2005 | US6979256 Retaining ring with wear pad for use in chemical mechanical planarization |
| 12/27/2005 | US6979252 Low defectivity product slurry for CMP and associated production method |