Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
04/2006
04/18/2006US7029380 Double-side polishing method and apparatus
04/18/2006US7029379 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
04/18/2006US7029373 Chemical mechanical polishing compositions for metal and associated materials and method of using same
04/18/2006US7029369 End-point detection apparatus
04/18/2006US7029368 Apparatus for controlling wafer temperature in chemical mechanical polishing
04/18/2006US7029365 Pad assembly for electrochemical mechanical processing
04/13/2006WO2006039436A2 Pad design for electrochemical mechanical polishing
04/13/2006WO2006038259A1 Method for manufacturing semiconductor device
04/13/2006US20060079156 Method for processing a substrate using multiple fluid distributions on a polishing surface
04/13/2006US20060079092 Polishing method
04/13/2006US20060076040 Semiconductive substrate cleaning systems
04/13/2006US20060075688 Polishing composition and method of polishing with the same
04/13/2006US20060075686 Polishing body
04/13/2006DE102005042096A1 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same
04/13/2006DE10160174B4 Chemisch/mechanische Polieraufschlämmung und chemisch/mechanischer Polierprozeß und Seichtgraben-Isolationsprozeß unter Verwendung des Polierprozesses Chemical / mechanical polishing slurry and chemical / mechanical polishing process and shallow trench isolation process using the polishing process
04/12/2006CN2770872Y Grinding disk
04/12/2006CN1757666A Composition for polishing pad
04/12/2006CN1757483A Chemical mechanical polishing pad and chemical mechanical polishing process
04/12/2006CN1250372C Polishing pad with built-in optical sensor
04/11/2006US7025854 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
04/11/2006US7025668 Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
04/11/2006US7025664 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
04/11/2006US7025663 Chemical mechanical polishing apparatus having conditioning cleaning device
04/11/2006US7025662 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool
04/11/2006US7025660 Assembly and method for generating a hydrodynamic air bearing
04/11/2006US7025659 Simultaneous planarization of pole piece and coil materials for write head applications
04/11/2006US7025658 Platen and head rotation rates for monitoring chemical mechanical polishing
04/06/2006WO2006036412A1 Endpoint adjustment in electroprocessing
04/06/2006WO2006035779A1 Cmp polishing compound and method for polishing substrate
04/06/2006WO2006035771A1 Cmp polishing agent and method for polishing substrate
04/06/2006WO2006035337A1 Flexible rinsing step in a cmp process
04/06/2006US20060073768 Conductive pad design modification for better wafer-pad contact
04/06/2006US20060073767 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
04/06/2006US20060070872 Pad design for electrochemical mechanical polishing
04/06/2006DE10197037B4 Anordnung und Verfahren zum Anbringen eines Trägerfilms an einem Polierkopf Arrangement and method for attaching a carrier film to a polishing head
04/05/2006EP1642949A1 Polishing composition and method of polishing with the same
04/05/2006EP1642679A1 Polishing apparatus
04/05/2006EP1641597A1 Substrate polishing apparatus
04/05/2006EP1641596A1 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads
04/05/2006CN2768967Y Optical disc lapping machine structure
04/05/2006CN1756623A Polishing pad with a window
04/05/2006CN1755901A Chemical mechanical polishing technique
04/05/2006CN1754935A Polishing composition and process for producing wiring structure using it
04/05/2006CN1754657A Method of forming a polishing pad having reduced striations
04/05/2006CN1249193C Composition for use in polishing magnetic disk substrate and method for preparing same
04/05/2006CN1249185C Silane containing polishing composition for CMP
04/05/2006CN1248827C High accuracy barrel finishing machine with full automatic adjustable pressure and dual stepless speed changing
04/04/2006US7024063 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
04/04/2006US7022608 Method and composition for the removal of residual materials during substrate planarization
04/04/2006US7022261 Forming an aqueous solution containing soluble precursors of a sulfur-containing phosphor; generating an aerosol of droplets from above solution, heating droplets to form a particulate intermediate compound capable of being post-treated to form said sulfur-containing phosphor powder
04/04/2006US7022001 Polishing apparatus
04/04/2006US7022000 Wafer processing machine
04/04/2006US7021999 Rinse apparatus and method for wafer polisher
04/04/2006US7021996 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
04/04/2006US7021995 CMP pad conditioner having working surface inclined in radially outer portion
04/04/2006US7021993 Method of polishing a substrate with a polishing system containing conducting polymer
04/04/2006US7021991 Polishing apparatus
03/2006
03/30/2006US20060068685 In-line contiguous resistive lapping guide for magnetic sensors
03/30/2006US20060068684 Polishing method and polishing system
03/30/2006US20060068681 Wafer polishing method and apparatus
03/29/2006EP1640424A1 Polishing composition and process for producing wiring structure using it
03/29/2006EP1640113A1 Conductive polishing article for electrochemical mechanical polishing
03/29/2006EP1639630A1 Polishing apparatus and polishing method
03/29/2006EP1638734A1 Apparatus and method for controlling the film thickness on a polishing pad
03/29/2006EP1638733A1 Polishing pad for electrochemical-mechanical polishing
03/29/2006EP1395394B1 Polishing apparatus and polishing pad
03/29/2006EP1353792B1 Catalytic reactive pad for metal cmp
03/29/2006EP0809798B1 Method for polishing a wafer and method for manufacturing an integrated circuit
03/29/2006CN1753961A Cmp composition comprising a sulfonic acid and a method for polishing noble metals
03/29/2006CN1752777A Optical fiber end surface grinding device
03/29/2006CN1751855A Cmp pad having a streamlined windowpane
03/28/2006US7020306 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device
03/28/2006US7018581 Method of forming a polishing pad with reduced stress window
03/28/2006US7018560 comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH; includes an organic-containing ammonium salt
03/28/2006US7018282 Customized polishing pad for selective process performance during chemical mechanical polishing
03/28/2006US7018276 Air platen for leading edge and trailing edge control
03/28/2006US7018275 Closed-loop control of wafer polishing in a chemical mechanical polishing system
03/28/2006US7018274 Polishing pad having slurry utilization enhancing grooves
03/28/2006US7018271 Method for monitoring a substrate during chemical mechanical polishing
03/28/2006US7018269 Pad conditioner control using feedback from a measured polishing pad roughness level
03/28/2006US7018268 Protection of work piece during surface processing
03/28/2006US7017246 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
03/23/2006WO2006030854A1 Complex profile body polishing method and polishing apparatus
03/23/2006WO2006030091A1 Polishing tool comprising a drive plate and a removable pad for finishing an ophthalmic lens
03/23/2006US20060063472 Method for polishing substrate
03/23/2006US20060063471 CMP pad having a streamlined windowpane
03/23/2006US20060063469 Advanced chemical mechanical polishing system with smart endpoint detection
03/23/2006US20060060974 Polishing composition and process for producing wiring structure using it
03/23/2006US20060060569 Chemical mechanical polishing pad and chemical mechanical polishing process
03/23/2006US20060060568 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions
03/22/2006EP1637744A1 Proportional pressure regulator having positive and negative pressure delivery capability
03/22/2006EP1637281A1 Chemical mechanical polishing pad and chemical mechanical polishing process
03/22/2006EP1635991A1 Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
03/22/2006EP1465957B1 Cmp systems and methods utilizing amine-containing polymers
03/22/2006EP1337380B1 Abrasive article having a window system for polishing wafers, and methods
03/22/2006EP1176631B1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
03/22/2006CN1750236A Inlaid polishing pad and method of producing the same
03/22/2006CN1246125C End point detection system for chemical and mechanical polishing
03/21/2006US7016795 Signal improvement in eddy current sensing
03/21/2006US7014669 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same