| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 09/27/2005 | US6949004 Method for reducing pole and alumina recession on magnetic recording heads |
| 09/22/2005 | WO2005088690A1 Polishing pad and semiconductor device manufacturing method |
| 09/22/2005 | US20050208884 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 09/22/2005 | US20050208883 Polishing composition |
| 09/22/2005 | US20050208882 Ceria slurry for polishing semiconductor thin layer |
| 09/22/2005 | US20050208881 Chemical mechanical polishing retaining ring with integral polymer backing |
| 09/22/2005 | US20050208880 Substrate holding apparatus |
| 09/22/2005 | US20050208879 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 09/22/2005 | US20050208876 CMP process control method |
| 09/22/2005 | US20050208761 Polishing composition and polishing method |
| 09/22/2005 | US20050206005 Composition and a method for defect reduction |
| 09/22/2005 | US20050205837 Polishing composition and polishing method |
| 09/22/2005 | US20050205836 Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
| 09/22/2005 | US20050205523 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 09/22/2005 | US20050205520 Method for end point detection for chemical mechanical polishing of integrated circuit devices |
| 09/22/2005 | US20050205433 Planarizing surface of a wafer with an electrolytic effect in a low oxygen atmosphere |
| 09/22/2005 | US20050205432 Method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining |
| 09/22/2005 | US20050205207 Polishing apparatus and method for manufacturing semiconductor device |
| 09/22/2005 | US20050204639 Polishing composition and polishing method |
| 09/22/2005 | US20050204638 Polishing composition and polishing method |
| 09/22/2005 | US20050204637 Polishing composition and polishing method |
| 09/22/2005 | DE102004010379A1 Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile A process for the production of wafers with low defect surfaces, the use of such wafers and electronic parts thus obtained |
| 09/21/2005 | EP1577357A1 Polishing composition and polishing method |
| 09/21/2005 | CN1672246A Semiconductor polishing compound, process for its production and polishing method |
| 09/21/2005 | CN1671511A Abrasive articles with a liner with protrusions and methods of making and using the same |
| 09/21/2005 | CN1671509A Microporous polishing pads |
| 09/21/2005 | CN1670925A CMP process control method |
| 09/21/2005 | CN1670923A Chemico-mechanical polishing end-point detection method for integrated circuit device |
| 09/21/2005 | CN1670117A 抛光组合物及抛光方法 Polishing composition and polishing method |
| 09/21/2005 | CN1670116A Polishing composition and polishing method |
| 09/21/2005 | CN1670115A Polishing composition and polishing method |
| 09/21/2005 | CN1670114A Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
| 09/21/2005 | CN1669739A Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| 09/21/2005 | CN1219629C Method and appts. for end point triggering with integrated steering |
| 09/20/2005 | US6947862 Method for simulating slurry flow for a grooved polishing pad |
| 09/20/2005 | US6946009 Cerium-based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 09/20/2005 | US6945860 Apparatus for and method of machining of optical connector end |
| 09/20/2005 | US6945857 Polishing pad conditioner and methods of manufacture and recycling |
| 09/20/2005 | US6945856 Subaperture chemical mechanical planarization with polishing pad conditioning |
| 09/20/2005 | US6945855 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
| 09/20/2005 | US6945854 Semiconductor device fabrication method and apparatus |
| 09/20/2005 | US6945851 CMP formulations |
| 09/20/2005 | US6945849 Polishing method and polishing device |
| 09/20/2005 | US6945847 Method of lapping medium-opposing surface in thin-film magnetic head |
| 09/20/2005 | US6945846 Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| 09/20/2005 | US6945845 Chemical mechanical polishing apparatus with non-conductive elements |
| 09/20/2005 | CA2319107C Optical polishing formulation |
| 09/15/2005 | WO2005086213A1 Polishing agent and polishing method |
| 09/15/2005 | US20050202760 Undulated pad conditioner and method of using same |
| 09/15/2005 | US20050202758 Carrier for holding an object to be polished |
| 09/15/2005 | US20050202676 Insulated pad conditioner and method of using same |
| 09/15/2005 | US20050199588 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 09/15/2005 | US20050198913 cerium oxide as a core, coated with a coating layer of an inorganic silicon compound except hydroxide and an inorganic aluminum compound except hydroxide; for polishing glass |
| 09/14/2005 | EP1574289A2 Carrier for holding an object to be polished |
| 09/14/2005 | EP1337601A4 Slurry for chemical-mechanical polishing copper damascene structures |
| 09/14/2005 | EP1327258A4 Chemical-mechanical polishing slurry and method |
| 09/14/2005 | CN2726109Y Calibration wafer and calibration apparatus |
| 09/14/2005 | CN2724922Y 预热装置 Preheating device |
| 09/13/2005 | US6943113 Metal chemical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 09/13/2005 | US6942549 Two-sided chemical mechanical polishing pad for semiconductor processing |
| 09/13/2005 | US6942548 Polishing method using an abrading plate |
| 09/13/2005 | US6942546 Endpoint detection for non-transparent polishing member |
| 09/13/2005 | US6942544 Method of achieving very high crown-to-camber ratios on magnetic sliders |
| 09/13/2005 | US6942543 equipped with a film-thickness monitor for monitoring a film thickness of a thin film on a substrate to be polished; high accuracy and reliability |
| 09/13/2005 | US6942541 Polishing apparatus |
| 09/09/2005 | WO2005082574A1 Methods and apparatuses for electrochemical-mechanical polishing |
| 09/08/2005 | US20050197050 Multi-layer polishing pad material for CMP |
| 09/08/2005 | US20050197046 Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device |
| 09/08/2005 | US20050197045 Fine force control of actuators for chemical mechanical polishing apparatuses |
| 09/08/2005 | US20050196963 Methods and apparatuses for electrochemical-mechanical polishing |
| 09/08/2005 | US20050194563 Selective for removal of copper in relation to tantalum and dielectric materials whilst minimizing local dishing and erosion effects |
| 09/08/2005 | US20050194562 Varying weight ratio of thermoplastic polymer to polyvinylpyrrolidone controls removal rate; complexing agent, corrosion inhibitor, oxidizing agent, silica abrasive; prevent dishing of the low-k dielectric layer; does not recognize tuning of the slurry |
| 09/08/2005 | US20050194357 useful for polishing tantalum barrier material and copper from semiconductor wafer, comprising by weight percent 0.1 to 30 oxidizer, 0.01 to 3 inorganic salt or acid, 0.01 to 4 inhibitor, 0.1 to 30 abrasive, 0 to 15 complexing agent, balance water |
| 09/08/2005 | DE10228441B4 Verfahren und Vorrichtung zum automatischen Beladen einer Doppelseiten-Poliermaschine mit Halbleiterscheiben Method and apparatus for automatically loading a double-side polishing machine with semiconductor wafers |
| 09/08/2005 | DE10082744B4 Antriebseinrichtung für einen Schleif-, Läpp- oder Polier-Werkzeugkörper Drive means for grinding, lapping or polishing tool body |
| 09/07/2005 | EP1570951A2 Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units |
| 09/07/2005 | EP1570512A1 Slurry composition for secondary polishing of silicon wafer |
| 09/07/2005 | EP1354017A4 Ready-to-use stable chemical-mechanical polishing slurries |
| 09/07/2005 | CN1666321A Method and apparatus for applying differential removal rates to a surface of a substrate |
| 09/07/2005 | CN1665642A Method and apparatus for heating polishing pad |
| 09/07/2005 | CN1665641A Novel finishing pad design for multidirectional use |
| 09/07/2005 | CN1665639A Partial-membrane carrier head |
| 09/07/2005 | CN1664993A Wafer grinding device and method |
| 09/07/2005 | CN1664992A Polishing pad for electrochemical mechanical polishing |
| 09/07/2005 | CN1217981C Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam |
| 09/07/2005 | CN1217769C Polishing pad and method of use thereof |
| 09/07/2005 | CN1217767C Activated slurry CMP system and methods for implementing the same |
| 09/07/2005 | CN1217766C Grinding method and grinding apparatus |
| 09/06/2005 | US6939741 IC chip manufacturing method |
| 09/06/2005 | US6939212 Porous material air bearing platen for chemical mechanical planarization |
| 09/06/2005 | US6939210 Slurry delivery arm |
| 09/06/2005 | US6939209 Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits |
| 09/06/2005 | US6939207 Method and apparatus for controlling CMP pad surface finish |
| 09/06/2005 | US6939206 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 09/06/2005 | US6939204 feeding an amount of slurry and preventing a work piece from sticking on an upper abrasive plate |
| 09/06/2005 | US6939203 Fluid bearing slide assembly for workpiece polishing |
| 09/06/2005 | US6939202 Substrate retainer wear detection method and apparatus |
| 09/06/2005 | US6939198 Polishing system with in-line and in-situ metrology |
| 09/01/2005 | WO2005081301A1 Polishing apparatus and substrate processing apparatus |
| 09/01/2005 | WO2005081300A1 Polishing pad and method for manufacture of semiconductor device using the same |