| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/01/2005 | US20050191948 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
| 09/01/2005 | US20050191947 Retaining ring with shaped surface |
| 09/01/2005 | US20050191946 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field |
| 09/01/2005 | US20050191945 Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| 09/01/2005 | US20050191942 CMP apparatus and process sequence method |
| 09/01/2005 | US20050191859 Method of evaluating film thickness, method of detecting polishing terminal, and device-manufacturing apparatus |
| 09/01/2005 | US20050191858 Substrate processing method and apparatus |
| 09/01/2005 | US20050191823 Polishing composition and polishing method |
| 09/01/2005 | US20050189517 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices |
| 09/01/2005 | US20050189322 Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 09/01/2005 | US20050189235 Multi-phase polishing pad |
| 09/01/2005 | US20050189065 Method of forming a layered polishing pad |
| 09/01/2005 | DE10392995T5 Verfahren und Vorrichtung zum Polieren Substrats A method and apparatus for polishing substrate |
| 09/01/2005 | DE10305711B4 Gimpelhalter und chemisch-mechanische Polieranlage mit einem solchen Gimpelhalter Gimpel holder and chemical mechanical polishing system with such Gimpel holder |
| 08/31/2005 | EP1568746A1 Polishing composition and polishing method |
| 08/31/2005 | EP1568074A1 Carrier head for chemical mechanical polishing apparatus |
| 08/31/2005 | EP1567606A1 A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| 08/31/2005 | EP1567306A1 Transparent microporous materials for cmp |
| 08/31/2005 | EP1550152A4 Method and apparatus for applying differential removal rates to a surface of a substrate |
| 08/31/2005 | CN2721317Y High-accuracy gravity planar grinding polisher with double rotary oscillation |
| 08/31/2005 | CN1663028A Polishing body, polishing device, semiconductor device, and method of manufacturing semiconductor device |
| 08/31/2005 | CN1661780A CMP apparatus and polishing method |
| 08/31/2005 | CN1660951A 抛光组合物和抛光方法 Polishing composition and polishing method |
| 08/31/2005 | CN1660923A Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 08/31/2005 | CN1660543A Method of forming a layered polishing pad |
| 08/31/2005 | CN1216953C Polishing composition for metal CMP and method of polishing susbstroote |
| 08/30/2005 | US6937915 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 08/30/2005 | US6936543 CMP method utilizing amphiphilic nonionic surfactants |
| 08/30/2005 | US6936541 Method for planarizing metal interconnects |
| 08/30/2005 | US6936480 Method of controlling the chemical mechanical polishing of stacked layers having a surface topology |
| 08/30/2005 | US6936304 Comprises luminophores/phosphors; vapor phase deposition |
| 08/30/2005 | US6935938 Multiple-conditioning member device for chemical mechanical planarization conditioning |
| 08/30/2005 | US6935935 Measuring apparatus |
| 08/30/2005 | US6935932 Polishing apparatus and method |
| 08/30/2005 | US6935931 thermoplastic polyurethane foam with an average pore size of about 50 mu m or less, and multi-modal pore size distribution; useful for chemical mechanical polishing |
| 08/30/2005 | US6935930 Polishing apparatus and method, and wafer evacuation program |
| 08/30/2005 | US6935929 Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 08/30/2005 | US6935926 System and method for reducing surface defects in integrated circuits |
| 08/30/2005 | US6935922 Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
| 08/30/2005 | US6935013 Apparatus and method for precise lapping of recessed and protruding elements in a workpiece |
| 08/25/2005 | WO2005077999A1 Polyurethane polishing pad |
| 08/25/2005 | WO2005077602A1 Base pad polishing pad and multi-layer pad comprising the same |
| 08/25/2005 | US20050186892 Profile control platen |
| 08/25/2005 | US20050186891 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization |
| 08/25/2005 | US20050186887 Processing method and apparatus |
| 08/25/2005 | US20050186691 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus |
| 08/25/2005 | US20050185180 Semiconductor processor control systems |
| 08/25/2005 | US20050184465 Seal assembly manufacturing methods and seal assemblies manufactured thereby |
| 08/24/2005 | EP1566421A2 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate. |
| 08/24/2005 | EP1274807B1 Polishing agent and method for producing planar layers |
| 08/24/2005 | CN2719493Y Automatic wheel-replacing device for grinding machine |
| 08/24/2005 | CN1659688A Polishing fluid and method of polishing |
| 08/24/2005 | CN1659252A Metal oxide powder for high precision polishing and method of preparation thereof |
| 08/24/2005 | CN1659249A Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 08/24/2005 | CN1216112C Polishing composition and polishing method for its use |
| 08/23/2005 | US6934040 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| 08/23/2005 | US6932896 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits |
| 08/23/2005 | US6932687 Planarizing pads for planarization of microelectronic substrates |
| 08/23/2005 | US6932684 Reciprocal blade lapping machine |
| 08/23/2005 | US6932679 Apparatus and method for loading a wafer in polishing system |
| 08/23/2005 | US6932677 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method |
| 08/23/2005 | US6932676 Blasting apparatus and process for accelerating blast media |
| 08/23/2005 | US6932672 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 08/23/2005 | US6932671 Method for controlling a chemical mechanical polishing (CMP) operation |
| 08/18/2005 | US20050181712 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 08/18/2005 | US20050181709 Rinse apparatus and method for wafer polisher |
| 08/18/2005 | US20050181708 Removal of embedded particles during chemical mechanical polishing |
| 08/18/2005 | US20050181706 Method and control system for improving cmp process by detecting and reacting to harmonic oscillation |
| 08/18/2005 | US20050181609 Polishing fluid and polishing method |
| 08/18/2005 | US20050178743 A multilayer pad having a plurality of independent electrical biasable zones, attaching to exterior power source from one layer; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; electrical apparatus for making semiconductors |
| 08/18/2005 | DE10393369T5 Poliervorrichtung, Polierkopf und Polierverfahren Polishing machine, polishing head and polishing method |
| 08/18/2005 | DE102005002167A1 Gerilltes Polierkissen und Verfahren Grooved polishing pad and method |
| 08/18/2005 | DE102005000645A1 Treatment of substrate for manufacture of semiconductor device comprises chemically mechanically polishing substrate in intermediate polishing step then in final polishing step |
| 08/18/2005 | DE102004058708A1 Polierkopf und Poliervorrichtung Polishing head and polishing machine |
| 08/18/2005 | DE102004004556A1 Verfahren zur Herstellung der Halbleiterscheibe A process for producing the semiconductor wafer |
| 08/17/2005 | EP1563952A1 Surface treatment method for vacuum member |
| 08/17/2005 | EP1141154B1 Polishing composition and method |
| 08/17/2005 | CN2717615Y Grinding apparatus for optical fibre connector plug pin body ends |
| 08/17/2005 | CN2717614Y Electronic air door grinding machine |
| 08/17/2005 | CN1655907A Lapping carrier for use in fabricating sliders |
| 08/17/2005 | CN1654169A Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process |
| 08/17/2005 | CN1215199C Solution for chemical machinery brightening of ruthenium |
| 08/16/2005 | US6931330 Methods for monitoring and controlling chemical mechanical planarization |
| 08/16/2005 | US6930782 End point detection with imaging matching in semiconductor processing |
| 08/16/2005 | US6930478 Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal |
| 08/16/2005 | US6930420 Motor |
| 08/16/2005 | US6930054 Slurry composition for use in chemical mechanical polishing of metal wiring |
| 08/16/2005 | US6930037 Process for forming a metal interconnect |
| 08/16/2005 | US6930023 Semiconductor wafer thinning method, and thin semiconductor wafer |
| 08/16/2005 | US6929755 Method of and apparatus for chemical mechanical polishing and slurry supplying device |
| 08/16/2005 | US6929533 Methods for enhancing within-wafer CMP uniformity |
| 08/16/2005 | US6929532 Method and apparatus for filtering a chemical polishing slurry of a wafer fabrication process |
| 08/16/2005 | US6929531 System and method for metal residue detection and mapping within a multi-step sequence |
| 08/16/2005 | US6929530 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 08/16/2005 | US6929529 Polishing apparatus |
| 08/11/2005 | WO2005072338A2 Multi-step pad conditioningh system and method for chemical planarization |
| 08/11/2005 | WO2005072332A2 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 08/11/2005 | US20050176354 Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same |
| 08/11/2005 | US20050176351 System, method, and apparatus for non-traditional kinematics/tooling for efficient charging of lapping plates |
| 08/11/2005 | US20050176349 Load cup for chemical mechanical polishing |