| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/11/2005 | US20050176348 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method |
| 08/11/2005 | US20050176253 Method of manufacturing semiconductor device |
| 08/11/2005 | US20050176251 Polishing pad with releasable slick particles |
| 08/11/2005 | US20050176250 Polishig fluid for metallic films and method for producing semiconductor substrate using the same |
| 08/11/2005 | US20050173669 Polishing fluid and method of polishing |
| 08/11/2005 | US20050173259 Endpoint system for electro-chemical mechanical polishing |
| 08/10/2005 | EP1562228A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 08/10/2005 | EP1561541A1 Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process |
| 08/10/2005 | EP1561540A1 Flexible membrane for a polishing head and CMP apparatus having the same |
| 08/10/2005 | EP1560890A1 Apparatus and method for replacing a media content item |
| 08/10/2005 | EP1332385A4 Method and device for polishing optical fiber connectors |
| 08/10/2005 | CN2715917Y Abrasive disk for quartz crystal |
| 08/10/2005 | CN1653600A Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 08/10/2005 | CN1653597A Substrate processing apparatus and substrate processing method |
| 08/10/2005 | CN1653594A Apparatus, system and method to reduce wafer warpage |
| 08/10/2005 | CN1652898A Process control in electro-chemical mechanical polishing |
| 08/10/2005 | CN1652306A Polishing pad with releasable slick particles |
| 08/10/2005 | CN1652304A All-functional semiconductor chip grinding process and device thereof |
| 08/10/2005 | CN1652297A Method of manufacturing semiconductor device |
| 08/10/2005 | CN1651193A Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| 08/10/2005 | CN1651192A Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| 08/10/2005 | CN1214133C Method and apparatus for electrochemical mechanical deposition |
| 08/10/2005 | CN1213913C Package with multiple chambers and valves |
| 08/10/2005 | CN1213834C Method of chemical mechanical polishing |
| 08/09/2005 | US6927177 Chemical mechanical electropolishing system |
| 08/09/2005 | US6926589 Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing |
| 08/09/2005 | US6926587 CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method |
| 08/09/2005 | US6926585 Pressure control system and polishing apparatus |
| 08/09/2005 | US6926584 Dual mode hybrid control and method for CMP slurry |
| 08/04/2005 | WO2005070059A2 Layered support and method for laminating cmp pads |
| 08/04/2005 | WO2004097899A3 Wafer carrier pivot mechanism |
| 08/04/2005 | US20050171225 Polyurethane polishing pad |
| 08/04/2005 | US20050171224 Density, porosity uniformity; made with controlled isocyanate concentration; precision planarization of semiconductor, optical and magnetic substrates |
| 08/04/2005 | US20050170761 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
| 08/04/2005 | US20050170760 Polishing apparatus |
| 08/04/2005 | US20050170757 Grooved polishing pad and method |
| 08/04/2005 | US20050170751 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 08/04/2005 | US20050170750 Polish pad to change polish rate on wafer by adjusting groove width and density |
| 08/04/2005 | US20050170749 Process for producing a semiconductor wafer |
| 08/04/2005 | US20050167048 Pad conditioning head for CMP process |
| 08/04/2005 | DE10361636A1 Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors A method and system for controlling the chemical mechanical polishing by means of a seismic signal from a seismic sensor |
| 08/03/2005 | EP1558426A1 Polishing apparatus |
| 08/03/2005 | EP1272579B1 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 08/03/2005 | CN1650404A 半导体晶片的制造方法及晶片 The method of manufacturing a semiconductor wafer and a wafer |
| 08/03/2005 | CN1650403A Polishing fluid and polishing method |
| 08/03/2005 | CN1649802A Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same |
| 08/03/2005 | CN1649103A Method for producing semiconductor wafer |
| 08/03/2005 | CN1647894A Grooved polishing pad and method |
| 08/02/2005 | US6925348 Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 08/02/2005 | US6924641 Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
| 08/02/2005 | US6924016 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| 08/02/2005 | US6923714 Carrier head with a non-stick membrane |
| 08/02/2005 | US6923711 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 08/02/2005 | US6923710 Apparatus and method for chemical mechanical polishing process |
| 08/02/2005 | US6923076 Flushing a multi-port valve manifold |
| 07/28/2005 | WO2005067663A2 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 07/28/2005 | WO2005058545B1 Retaining ring with slurry transport grooves |
| 07/28/2005 | US20050164617 Retaining ring for wafer carriers |
| 07/28/2005 | US20050164610 Chemical mechanical machining and surface finishing |
| 07/28/2005 | US20050164608 Apparatus for optical inspection of wafers during processing |
| 07/28/2005 | US20050164606 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 07/28/2005 | US20050164605 Device and method for surface working |
| 07/28/2005 | US20050164604 Apparatus for transporting for polishing wafers |
| 07/28/2005 | US20050164603 Pivotable slurry arm |
| 07/28/2005 | US20050161341 Electrochemical machining, applying different voltage potentials to different electrodes; supply a higher potential to the substrate edge, removing the copper conductive layer from the substrate edge; making semiconductor, integrated circuits |
| 07/28/2005 | DE10392703T5 Metalloxidpulver für Hochpräzisionspolieren und ein Verfahren zur Herstellung desselben Metal oxide powders for high-precision polishing, and a method of manufacturing the same |
| 07/28/2005 | DE10361767A1 Mechanical processing method e.g. for parallel front surface of small workpiece, involves having workpiece with two front surfaces |
| 07/27/2005 | CN1647255A Polishing pad and semiconductor substrate manufacturing method using the polishing pad |
| 07/27/2005 | CN1647103A Abrasive articles and methods for the manufacture and use of same |
| 07/27/2005 | CN1646651A Methanol-containing silica-based CMP compositions |
| 07/27/2005 | CN1646650A Free radical-forming activator attached to solid and used to enhance CMP formulations |
| 07/27/2005 | CN1646649A Method and composition for polishing a substrate |
| 07/27/2005 | CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 07/27/2005 | CN1646263A Electrochemical mechanical processing with advancible sweeper |
| 07/27/2005 | CN1645570A Method for removing particles from wafer surface |
| 07/27/2005 | CN1644644A Compositions and methods for low downforce pressure polishing of copper |
| 07/27/2005 | CN1644640A Compositions and methods for controlled polishing of copper |
| 07/27/2005 | CN1644317A Polishing apparatus and method of polishing work piece |
| 07/27/2005 | CN1212649C Wafer carrier assembly for chemical mechanical polishing apparatus and polishing method using the same |
| 07/26/2005 | US6922253 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| 07/26/2005 | US6922070 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 07/26/2005 | US6921466 Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| 07/26/2005 | US6921455 Device for polishing outer peripheral edge of semiconductor wafer |
| 07/26/2005 | US6921324 Pad backer |
| 07/26/2005 | US6921323 Apparatus for polishing a semiconductor wafer and method therefor |
| 07/26/2005 | US6921318 Semiconductor die de-processing using a die holder and chemical mechanical polishing |
| 07/26/2005 | US6921317 Automated lapping system |
| 07/26/2005 | CA2174442C Polishing device with specimen-holder |
| 07/21/2005 | WO2005067030A1 Support system for semiconductor wafers and methods thereof |
| 07/21/2005 | WO2005035194A3 Stacked pad and method of use |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | US20050159090 Polishing apparatus |
| 07/21/2005 | US20050159089 Double-side polishing method and apparatus |
| 07/21/2005 | US20050159086 Methods for planarization of group VIII metal-containing surfaces using complexing agents |
| 07/21/2005 | US20050159085 Method of chemically mechanically polishing substrates |
| 07/21/2005 | US20050159084 Chemical mechanical polishing method and apparatus for controlling material removal profile |
| 07/21/2005 | US20050159083 All-in-one polishing process for a semiconductor wafer |
| 07/21/2005 | US20050159082 Polishing apparatus |
| 07/21/2005 | US20050159003 Chemical mechanical polishing compositions and methods relating thereto |
| 07/21/2005 | US20050155869 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis |